QTP 151502:New Package Qualification Of The UTL 16LD 300-MIL SOIC, WITH CUPD, G605, 8200T, PURE SN, AT MSL3, 260C, WITH 1M NVSRAM, S8 Technology from CMI FAB4.pdf

Document No. 002-09013 Rev. **
ECN #: 4993186
Cypress Semiconductor
Package Qualification Report
QTP# 151502 VERSION **
October, 2015
16LD (300-mil) SOIC
Pure Sn, CuPd
MSL3, 260C Reflow
UTL / Thailand
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Becky Thomas
Reliability Engineer
Reviewed By:
Lorena Zapanta
Reliability Manager
Approved By:
Don Darling
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
Document No. 002-09013 Rev. **
ECN #: 4993186
PACKAGE/PRODUCT QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
151502
New Package Qualification of the 16LD 300-mil SOIC
assembled at UTL, Thailand, using 0.8mil CuPd bond wire,
G605 mold compound, 8200T die attach, with pure Sn
leadfinish, at MSL3 and 260C reflow temperature, with 1M
nvSRAM, using S8 technology from CMI Fab4
Oct 2015
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
Document No. 002-09013 Rev. **
ECN #: 4993186
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
SZ163
Mold Compound Flammability Rating:
16LD (300-mil) SOIC
G605 / Sumitomo
UL94 V-0
Oxygen Rating Index: >28%
54%
Lead Frame Designation:
FMP
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
Pure Sn / 400 microinch minimum
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
100% Saw
Die Attach Supplier:
Henkel
Die Attach Material:
8200T
Bond Diagram Designation
001-96231
Wire Bond Method:
Thermosonic
Wire Material/Size:
0.8 mil CuPd
Thermal Resistance Theta JA C/W:
65C/W
Package Cross Section Yes/No:
No
Assembly Process Flow:
CP-NSE-003/SOMT
Name/Location of Assembly (prime) facility:
UTL / Thailand
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
Class: UTL, Thailand / Finish: CML-RA, Philippines
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No. 002-09013 Rev. **
ECN #: 4993186
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Accelerated Saturation Test
(HAST)
Pressure Cooker Test
Temperature Cycle
High Temp Storage
Electrostatic Discharge
Charge Device Model (ESD-CDM)
Acoustic Microscopy
Ball Shear
Bond Pull
Constructional Analysis
Die Shear
Test Condition (Temp/Bias)
JEDEC STD 22-A110: 130C, 85%RH, 3.6V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH)
JESD22-A102: 121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH)
MIL-STD-883C, Method 1010, Condition C, -65 C to
150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH)
JESD22-A103: 150 C, no bias
Precondition: JESD22
(500V, 1,000V, 1,250V)
JESD22-C101
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH)
JESD22-B116A
Cpk : 1.33, Ppk : 1.66
MIL-STD-883 – Method 2011,
Cpk : 1.33, Ppk : 1.66
Criteria: Meet external and internal characteristics of
Cypress package
MIL-STD-883, Method 2019
Result
P/F
P
P
P
P
P
P
P
P
P
P
Per die size:



<3000 sq. mils = 1.2 kgf
30001-5000 sq. mils = 1.2 kgf
>5001 sq. mils = 1.2 kgf
P
Internal Visual
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
MIL-STD-883-2014
Final Visual Inspection
JESD22-B101B
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Solderability, Steam Aged
J-STD-002, JESD22-B102
P
X-Ray
95% solder coverage minimum
MIL-STD-883 - 2012
Dye Penetrant Test
Company Confidential
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Page 4 of 8
P
P
Document No. 002-09013 Rev. **
ECN #: 4993186
Reliability Test Data
QTP #: 151502
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH ACCELERATED SATURATION TEST (HAST), 130C, 85%RH, 3.60V, with MSL3 Preconditioning
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
96
25
0
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
192
25
0
STRESS: PRESSURE COOKER TEST, at 121 C, 100%RH, 15 PSIG, with MSL3 Preconditioning
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
168
80
0
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
288
80
0
STRESS: TEMPERATURE CYCLE TEST, Condition C, -65 C to 150 C, with MSL3 Preconditioning
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
500
80
0
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
1000
80
0
CY14B101Q3A-SFXI
4429594
611515684
UTL - UT
500
80
0
CY14B101Q3A-SFXI
4429594
611515684
UTL - UT
1000
80
0
CY14B101Q3A-SFXI
4429594
611515685
UTL - UT
500
80
0
CY14B101Q3A-SFXI
4429594
611515685
UTL - UT
1000
80
0
STRESS: HIGH TEMPERATURE STORAGE, 150 C
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
500
80
0
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
1000
80
0
STRESS: CHARGED DEVICE MODEL (CDM) ESD: 500V, 1,000V, 1,250V
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
500
9
0
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
1000
3
0
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
1250
3
0
STRESS: ACOUSTIC MICROSCOPY / before and after MSL3 Preconditioning
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
COMP
15
0
CY14B101Q3A-SFXI
4429594
611515684
UTL - UT
COMP
15
0
CY14B101Q3A-SFXI
4429594
611515685
UTL - UT
COMP
15
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Document No. 002-09013 Rev. **
ECN #: 4993186
Reliability Test Data
QTP #: 151502
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: BALL SHEAR
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
COMP
10
0
4429594
611515683
UTL - UT
COMP
10
0
STRESS: BOND PULL
CY14B101Q3A-SFXI
STRESS: CONSTRUCTIONAL ANALYSIS
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
COMP
5
0
CY14B101Q3A-SFXI
4429594
611515684
UTL - UT
COMP
5
0
CY14B101Q3A-SFXI
4429594
611515685
UTL - UT
COMP
5
0
4429594
611515683
UTL - UT
COMP
30
0
STRESS: DIE SHEAR
CY14B101Q3A-SFXI
STRESS: DIE PENETRATION TEST
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
COMP
15
0
CY14B101Q3A-SFXI
4429594
611515684
UTL - UT
COMP
15
0
CY14B101Q3A-SFXI
4429594
611515685
UTL - UT
COMP
15
0
STRESS: INTERNAL VISUAL
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
COMP
5
0
CY14B101Q3A-SFXI
4429594
611515684
UTL - UT
COMP
5
0
CY14B101Q3A-SFXI
4429594
611515685
UTL - UT
COMP
5
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Document No. 002-09013 Rev. **
ECN #: 4993186
Reliability Test Data
QTP #: 151502
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: FINAL VISUAL INSPECTION
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
COMP
440
0
CY14B101Q3A-SFXI
4429594
611515684
UTL - UT
COMP
800
0
CY14B101Q3A-SFXI
4429594
611515685
UTL - UT
COMP
800
0
611515683
UTL - UT
COMP
30
0
STRESS: PHYSICAL DIMENSION
CY14B101Q3A-SFXI
4429594
STRESS: STEAM-AGED SOLDERABILITY
CY14B101Q3A-SFXI
4429594
611515683
UTL - UT
COMP
3
0
CY14B101Q3A-SFXI
4429594
611515684
UTL - UT
COMP
3
0
CY14B101Q3A-SFXI
4429594
611515685
UTL - UT
COMP
3
0
4429594
611515683
UTL - UT
COMP
15
0
STRESS: X-RAY
CY14B101Q3A-SFXI
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Document No.002-09013 Rev. **
ECN # 4993186
Document History Page
Document Title: QTP# 151502: New Package Qualification of the UTL 16LD 300-mil SOIC, with CuPd, G605, 8200T,
Pure Sn, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4
Document Number:
002-09013
Rev. ECN
Orig. of
No.
Change
**
4993186 BECK
Description of Change
Initial Release
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
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