Document No. 002-09013 Rev. ** ECN #: 4993186 Cypress Semiconductor Package Qualification Report QTP# 151502 VERSION ** October, 2015 16LD (300-mil) SOIC Pure Sn, CuPd MSL3, 260C Reflow UTL / Thailand FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Becky Thomas Reliability Engineer Reviewed By: Lorena Zapanta Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 002-09013 Rev. ** ECN #: 4993186 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 151502 New Package Qualification of the 16LD 300-mil SOIC assembled at UTL, Thailand, using 0.8mil CuPd bond wire, G605 mold compound, 8200T die attach, with pure Sn leadfinish, at MSL3 and 260C reflow temperature, with 1M nvSRAM, using S8 technology from CMI Fab4 Oct 2015 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No. 002-09013 Rev. ** ECN #: 4993186 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: SZ163 Mold Compound Flammability Rating: 16LD (300-mil) SOIC G605 / Sumitomo UL94 V-0 Oxygen Rating Index: >28% 54% Lead Frame Designation: FMP Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn / 400 microinch minimum Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Henkel Die Attach Material: 8200T Bond Diagram Designation 001-96231 Wire Bond Method: Thermosonic Wire Material/Size: 0.8 mil CuPd Thermal Resistance Theta JA C/W: 65C/W Package Cross Section Yes/No: No Assembly Process Flow: CP-NSE-003/SOMT Name/Location of Assembly (prime) facility: UTL / Thailand MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Class: UTL, Thailand / Finish: CML-RA, Philippines Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No. 002-09013 Rev. ** ECN #: 4993186 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Ball Shear Bond Pull Constructional Analysis Die Shear Test Condition (Temp/Bias) JEDEC STD 22-A110: 130C, 85%RH, 3.6V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-A102: 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-A103: 150 C, no bias Precondition: JESD22 (500V, 1,000V, 1,250V) JESD22-C101 J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-B116A Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Result P/F P P P P P P P P P P Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Solderability, Steam Aged J-STD-002, JESD22-B102 P X-Ray 95% solder coverage minimum MIL-STD-883 - 2012 Dye Penetrant Test Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P Document No. 002-09013 Rev. ** ECN #: 4993186 Reliability Test Data QTP #: 151502 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH ACCELERATED SATURATION TEST (HAST), 130C, 85%RH, 3.60V, with MSL3 Preconditioning CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 96 25 0 CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 192 25 0 STRESS: PRESSURE COOKER TEST, at 121 C, 100%RH, 15 PSIG, with MSL3 Preconditioning CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 168 80 0 CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 288 80 0 STRESS: TEMPERATURE CYCLE TEST, Condition C, -65 C to 150 C, with MSL3 Preconditioning CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 500 80 0 CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 1000 80 0 CY14B101Q3A-SFXI 4429594 611515684 UTL - UT 500 80 0 CY14B101Q3A-SFXI 4429594 611515684 UTL - UT 1000 80 0 CY14B101Q3A-SFXI 4429594 611515685 UTL - UT 500 80 0 CY14B101Q3A-SFXI 4429594 611515685 UTL - UT 1000 80 0 STRESS: HIGH TEMPERATURE STORAGE, 150 C CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 500 80 0 CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 1000 80 0 STRESS: CHARGED DEVICE MODEL (CDM) ESD: 500V, 1,000V, 1,250V CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 500 9 0 CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 1000 3 0 CY14B101Q3A-SFXI 4429594 611515683 UTL - UT 1250 3 0 STRESS: ACOUSTIC MICROSCOPY / before and after MSL3 Preconditioning CY14B101Q3A-SFXI 4429594 611515683 UTL - UT COMP 15 0 CY14B101Q3A-SFXI 4429594 611515684 UTL - UT COMP 15 0 CY14B101Q3A-SFXI 4429594 611515685 UTL - UT COMP 15 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No. 002-09013 Rev. ** ECN #: 4993186 Reliability Test Data QTP #: 151502 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: BALL SHEAR CY14B101Q3A-SFXI 4429594 611515683 UTL - UT COMP 10 0 4429594 611515683 UTL - UT COMP 10 0 STRESS: BOND PULL CY14B101Q3A-SFXI STRESS: CONSTRUCTIONAL ANALYSIS CY14B101Q3A-SFXI 4429594 611515683 UTL - UT COMP 5 0 CY14B101Q3A-SFXI 4429594 611515684 UTL - UT COMP 5 0 CY14B101Q3A-SFXI 4429594 611515685 UTL - UT COMP 5 0 4429594 611515683 UTL - UT COMP 30 0 STRESS: DIE SHEAR CY14B101Q3A-SFXI STRESS: DIE PENETRATION TEST CY14B101Q3A-SFXI 4429594 611515683 UTL - UT COMP 15 0 CY14B101Q3A-SFXI 4429594 611515684 UTL - UT COMP 15 0 CY14B101Q3A-SFXI 4429594 611515685 UTL - UT COMP 15 0 STRESS: INTERNAL VISUAL CY14B101Q3A-SFXI 4429594 611515683 UTL - UT COMP 5 0 CY14B101Q3A-SFXI 4429594 611515684 UTL - UT COMP 5 0 CY14B101Q3A-SFXI 4429594 611515685 UTL - UT COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No. 002-09013 Rev. ** ECN #: 4993186 Reliability Test Data QTP #: 151502 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: FINAL VISUAL INSPECTION CY14B101Q3A-SFXI 4429594 611515683 UTL - UT COMP 440 0 CY14B101Q3A-SFXI 4429594 611515684 UTL - UT COMP 800 0 CY14B101Q3A-SFXI 4429594 611515685 UTL - UT COMP 800 0 611515683 UTL - UT COMP 30 0 STRESS: PHYSICAL DIMENSION CY14B101Q3A-SFXI 4429594 STRESS: STEAM-AGED SOLDERABILITY CY14B101Q3A-SFXI 4429594 611515683 UTL - UT COMP 3 0 CY14B101Q3A-SFXI 4429594 611515684 UTL - UT COMP 3 0 CY14B101Q3A-SFXI 4429594 611515685 UTL - UT COMP 3 0 4429594 611515683 UTL - UT COMP 15 0 STRESS: X-RAY CY14B101Q3A-SFXI Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.002-09013 Rev. ** ECN # 4993186 Document History Page Document Title: QTP# 151502: New Package Qualification of the UTL 16LD 300-mil SOIC, with CuPd, G605, 8200T, Pure Sn, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4 Document Number: 002-09013 Rev. ECN Orig. of No. Change ** 4993186 BECK Description of Change Initial Release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8