Document No.001-97853 Rev. ** ECN # 4784181 Cypress Semiconductor Package Qualification Report QTP# 143604 VERSION ** July 2015 QFN16L (3x3x0.6mm) QFN24L (4x4x0.6mm) Pure Sn, CuPd Wire MSL3, 260C Reflow ASEK Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 10 Document No.001-97853 Rev. ** ECN # 4784181 PACKAGE QUALIFICATION HISTORY QTP Number 134505 143604 Description of Qualification Purpose Qualification of QFN16L (3x3x0.6mm) & QFN24L (4x4x0.6mm) at ASEK Taiwan(G) using G700 mold compound, FH900 film die attach, 0.8mil CuPd wire, Pure Sn leadfinish at MSL3, 260C Reflow Temperature Qualification of QFN16L (3x3x0.6mm) & QFN24L (4x4x0.6mm) at ASEK Taiwan(G) using G700 mold compound, NEX130 die attach film, 0.8mil CuPd wire, Pure Sn leadfinish at MSL3, 260C Reflow Temperature Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 10 Date Feb 2014 June 2015 Document No.001-97853 Rev. ** ECN # 4784181 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ16A / LQ24A Package Outline, Type, or Name: QFN16L (3x3x0.6mm) & QFN24L (4x4x0.6mm) Mold Compound Name/Manufacturer: G700 / Sumitomo Mold Compound Flammability Rating: UL 94 V=0 pass Mold Compound Alpha Emission Rate: N/A (not low alpha mold compound) Oxygen Rating Index: >28% 54% Lead Frame Designation: FMP Lead Frame Material: Copper with Ag-Spot Plating Substrate Material: N/A Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Hitachi Die Attach Material: FH900 Bond Diagram Designation 001-88428, 001-88427 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8mil Thermal Resistance Theta JA C/W: 49.6 C/W (QFN16), 38.01 CW (QFN24) Package Cross Section Yes/No: No Assembly Process Flow: 001-89390M Name/Location of Assembly (prime) facility: ASEK Taiwan (G) MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML (R) Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 10 Document No.001-97853 Rev. ** ECN # 4784181 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ16A / LQ24A Package Outline, Type, or Name: QFN16L (3x3x0.6mm) & QFN24L (4x4x0.6mm) Mold Compound Name/Manufacturer: G700 / Sumitomo Mold Compound Flammability Rating: UL 94 V=0 pass Mold Compound Alpha Emission Rate: N/A (not low alpha mold compound) Oxygen Rating Index: >28% 54% Lead Frame Designation: FMP Lead Frame Material: Copper with Ag-Spot Plating Substrate Material: N/A Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Nippon Steel Die Attach Material: NEX130 Bond Diagram Designation 001-88428, 001-88427 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8mil Thermal Resistance Theta JA C/W: 49.6 C/W (QFN16), 38.01 CW (QFN24) Package Cross Section Yes/No: No Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: ASEK Taiwan (G) MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML (R) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 10 Document No.001-97853 Rev. ** ECN # 4784181 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Pressure Cooker Test Temperature Cycle Acoustic Microscopy Test Condition (Temp/Bias) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Result P/F P P P Constructional Analysis Criteria: Meet external and internal characteristics of package P High Temp Storage JESD22-A103: 150 C, no bias P X-Ray MIL-STD-883 - 2012 P Internal Visual MIL-STD-883-2014 P Bond Pull MIL-STD-883 – Method 2011 P Ball Shear JESD22-B116A P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110, 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 10 Document No.001-97853 Rev. ** ECN # 4784181 Reliability Test Data QTP #: 134505 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G COMP 15 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G COMP 15 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G COMP 15 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G COMP 10 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G COMP 10 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G COMP 10 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G COMP 10 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G COMP 10 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G COMP 10 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G COMP 5 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G COMP 5 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G COMP 5 0 STRESS: HIGH ACCELERATED SATURATION TEST CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G 128 40 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G 128 40 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G 128 40 0 STRESS: HIGH TEMPERATURE STORAGE CY8C20234 (8C20234BK) LQ16A 5234006 611326674 ASE-G 500 80 0 CY8C20234 (8C20234BK) LQ16A 5234006 611326674 ASE-G 1000 80 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G COMP 5 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G COMP 5 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G COMP 5 0 STRESS: INTERNAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 10 Document No.001-97853 Rev. ** ECN # 4784181 Reliability Test Data QTP #: 134505 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G 168 79 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G 288 79 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G 168 78 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G 288 78 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G 168 80 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G 288 79 0 STRESS: TEMPERATURE CYCLE CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G 500 78 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G 1000 78 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G 500 79 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G 1000 79 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G 500 78 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G 1000 77 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342071 ASE-G COMP 128 0 CY8CMBR3108 (8CP44303AC) LQ16A 4339140 611342072 ASE-G COMP 128 0 CY8CMBR3116 (8CP44304AC) LQ24A 4339140 611342073 ASE-G COMP 128 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 10 Document No.001-97853 Rev. ** ECN # 4784181 Reliability Test Data QTP #: 143604 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417855 ASE-G COMP 15 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417856 ASE-G COMP 15 0 CY8CMBR3145 (8CP44304AC) LQ16A 4345693 611417857 ASE-G COMP 15 0 CY8C4014LQI (8CP44303AC) LQ16A 4444274 611512731 ASE-G COMP 15 0 CY8CMBR3145 (8CP44303AC) LQ16A 4444274 611512733 ASE-G COMP 15 0 CY8CMBR3145 (8CP44303BK) LQ16A 5435004 611512726 ASE-G COMP 15 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417855 ASE-G COMP 100 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417856 ASE-G COMP 100 0 CY8CMBR3145 (8CP44304AC) LQ16A 4345693 611417857 ASE-G COMP 100 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417855 ASE-G COMP 100 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417856 ASE-G COMP 100 0 CY8CMBR3145 (8CP44304AC) LQ16A 4345693 611417857 ASE-G COMP 100 0 611417855 ASE-G COMP 5 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8CMBR3145 (8CP44303AC) LQ16A 4345693 STRESS: HIGH ACCELERATED SATURATION TEST CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417855 ASE-G 96 30 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417856 ASE-G 96 30 0 611417855 ASE-G COMP 5 0 STRESS: INTERNAL VISUAL INSPECTION CY8CMBR3145 (8CP44303AC) LQ16A 4345693 STRESS: PRESSURE COOKER TEST CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417855 ASE-G 168 80 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417855 ASE-G 288 80 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417856 ASE-G 168 79 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 10 Document No.001-97853 Rev. ** ECN # 4784181 Reliability Test Data QTP #: 143604 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TEMPERATURE CYCLE CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417855 ASE-G 500 80 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417855 ASE-G 1000 78 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417856 ASE-G 500 80 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417856 ASE-G 1000 80 0 CY8CMBR3145 (8CP44304AC) LQ16A 4345693 611417857 ASE-G 500 80 0 CY8CMBR3145 (8CP44304AC) LQ16A 4345693 611417857 ASE-G 1000 78 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417855 ASE-G COMP 15 0 CY8CMBR3145 (8CP44303AC) LQ16A 4345693 611417856 ASE-G COMP 15 0 CY8CMBR3145 (8CP44304AC) LQ16A 4345693 611417857 ASE-G COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 10 Document No.001-97853 Rev. ** ECN # 4784181 Document History Page Document Title: QTP#143604: LQ16 QFN16 (3X3X0.6MM) LQ24 QFN24 (4X4X0.6MM) PURE SN, CUPD WIRE MSL3, 260 REFLOW Document Number: 001-97853 Rev. ECN Orig. of No. Change ** 4784181 HSTO Description of Change Initial spec release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 10