Document No. 002-12034 Rev. ** ECN #: 5201741 Cypress Semiconductor Package Qualification Report QTP# 154604 VERSION ** April, 2016 60 FBGA Package (10mm x 18mm x 1.2mm) SAC405, CuPd MSL3, 260C Reflow ASE-G / Taiwan FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Becky Thomas Reliability Engineer Reviewed By: Lorena Zapanta Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No. 002-12034 Rev. ** ECN #: 5201741 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 154604 New Industrial 60 FBGA (10mm x 18mm x 1.2mm) Package for nvSRAM (Rainier) at ASE, using Low Alpha KE-G2250 Mold Compound, ATB-125 Die Attach Film, 0.8 mil CuPd Wire, and SAC405 Solder Balls Apr 2016 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No. 002-12034 Rev. ** ECN #: 5201741 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: BK60B Mold Compound Flammability Rating: 60 FBGA (10mm x 18 mm x 1.2 mm) Low Alpha KE-G2250 / Kyocera UL-94, V-0 Mold Compound Alpha Emission Rate: <0.002 Oxygen Rating Index: >28% 28% Substrate Material: BT Resin Lead Finish, Composition / Thickness: SAC405 Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Hitachi Die Attach Material: ATB-125 Die Attach Film Bond Diagram Designation 002-03473 Wire Bond Method: Ultrasonic Wire Material/Size: 0.8 mil CuPd Thermal Resistance Theta JA C/W: 21C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 64-22-0000-0059 Name/Location of Assembly (prime) facility: ASE / Taiwan MSL LEVEL 3 REFLOW PROFILE 260 ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Wafer Sort: Cypress CMI, USA; Class Test/Finish: ASE, Taiwan Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No. 002-12034 Rev. ** ECN #: 5201741 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130C, 85%RH, 3.6V Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) Pressure Cooker Test JESD22-A102: 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level 3 (192 Hrs., 30 C, 60% RH) JESD22-A103: 150 C, no bias P (500V, 1,000V, 1250V) JESD22-C101 P J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-B116A Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package P MIL-STD-883, Method 2019 P Temperature Cycle High Temp Storage Electrostatic Discharge Charge Device Model (ESDCDM) Acoustic Microscopy Ball Shear Bond Pull Constructional Analysis Die Shear P P P P P Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack JESD22-B117B Cpk : 1.33, Ppk : 1.66 MIL-STD-883-2014 Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Solderability, Steam Aged J-STD-002, JESD22-B102 P X-Ray 95% solder coverage minimum MIL-STD-883 - 2012 Dye Penetrant Test BGA Solder Ball Shear Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P P P Document No. 002-12034 Rev. ** ECN #: 5201741 Reliability Test Data QTP #: 154604 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: Highly Accelerated Saturation Test (HAST), 130C, 85%RH, 3.6V (MSL 3 Preconditioning) CY14B116N-BA25XIES CY14B116N-BA25XIES 4521076 4519113 611537842 611537843 ASE-G ASE-G 96 96 24 25 0 0 STRESS: Temperature Cycling Test (TCT), Condition C, -65 C to 150 C (MSL 3 Preconditioning) CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES 4521076 4519113 4519113 611537842 611537843 611537844 ASE-G ASE-G ASE-G 500 500 500 80 80 80 0 0 0 STRESS: Pressure Cooker Test (PCT), 121 C, 100%RH, 15 PSIG (MSL 3 Preconditioning) CY14B116N-BA25XIES CY14B116N-BA25XIES 4521076 4519113 STRESS: High Temperature Storage: 150C CY14B116N-BA25XIES 4521076 CY14B116N-BA25XIES 4521076 611537842 611537843 ASE-G ASE-G 168 168 78 80 0 0 611537842 611537842 ASE-G ASE-G 500 1000 80 80 0 0 9 0 3 0 STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 500V CY14B116N-BA25XIES 4521076 611537842 ASE-G 500V STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 1,000V CY14B116N-BA25XIES 4521076 611537842 ASE-G 1,000V STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 1,250V CY14B116N-BA25XIES 4521076 611537842 ASE-G 1,250V 3 0 STRESS: Acoustic Microscopy (MSL 3 Preconditioning) CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES 4521076 4519113 4519113 611537842 611537843 611537844 ASE-G ASE-G ASE-G COMP COMP COMP 15 15 15 0 0 0 4521076 4519113 4519113 611537842 611537843 611537844 ASE-G ASE-G ASE-G COMP COMP COMP 220 220 220 0 0 0 4521076 4519113 4519113 611537842 611537843 611537844 ASE-G ASE-G ASE-G COMP COMP COMP 220 220 220 0 0 0 4521076 611537842 ASE-G COMP 5 0 4521076 4519113 4519113 611537842 611537843 611537844 ASE-G ASE-G ASE-G COMP COMP COMP 15 15 15 0 0 0 STRESS: Wire Bond Shear CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES STRESS: Wire Bond Pull CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES STRESS: Constructional Analysis CY14B116N-BA25XIES STRESS: Die Shear CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No. 002-12034 Rev. ** ECN #: 5201741 Reliability Test Data QTP #: 154604 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: Dye Penetrant Test CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES 4521076 4519113 4519113 611537842 611537843 611537844 ASE-G ASE-G ASE-G COMP COMP COMP 15 15 15 0 0 0 611537842 611537843 611537844 ASE-G ASE-G ASE-G COMP COMP COMP 30 30 30 0 0 0 611537842 ASE-G COMP 5 0 4521076 4519113 4519113 611537842 611537843 611537844 ASE-G ASE-G ASE-G COMP COMP COMP 519 517 520 0 0 0 4521076 4519113 4519113 611537842 611537843 611537844 ASE-G ASE-G ASE-G COMP COMP COMP 30 30 30 0 0 0 4521076 4519113 4519113 611537842 611537843 611537844 ASE-G ASE-G ASE-G COMP COMP COMP 3 3 3 0 0 0 4521076 4519113 4519113 611537842 611537843 611537844 ASE-G ASE-G ASE-G COMP COMP COMP 15 15 15 0 0 0 STRESS: BGA Solder Ball Shear CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES 4521076 4519113 4519113 STRESS: Internal Visual Inspection CY14B116N-BA25XIES 4521076 STRESS: Final Visual Inspection CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES STRESS: Physical Dimensions CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES STRESS: Solderability- BGA CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES STRESS: X-RAY CY14B116N-BA25XIES CY14B116N-BA25XIES CY14B116N-BA25XIES Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.002-12034 Rev. ** ECN # 5201741 Document History Page Document Title: QTP# 154604: Qualification of the 60 FBGA (10mm x 18mm x 1.2mm) ASE Package for nvSRAM, using Low Alpha KE-G2250, ATB-125 DAF, CuPd, and SAC405, at MSL3 Document Number: 002-12034 Rev. ECN Orig. of No. Change ** 5201741 BECK Description of Change Initial Release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7