QTP# 154604:Qualification of the 60 FBGA (10mm x 18mm x 1.2mm) Package at ASE

Document No. 002-12034 Rev. **
ECN #: 5201741
Cypress Semiconductor
Package Qualification Report
QTP# 154604 VERSION **
April, 2016
60 FBGA Package (10mm x 18mm x 1.2mm)
SAC405, CuPd
MSL3, 260C Reflow
ASE-G / Taiwan
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Becky Thomas
Reliability Engineer
Reviewed By:
Lorena Zapanta
Reliability Manager
Approved By:
Don Darling
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No. 002-12034 Rev. **
ECN #: 5201741
PACKAGE/PRODUCT QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
154604
New Industrial 60 FBGA (10mm x 18mm x 1.2mm) Package
for nvSRAM (Rainier) at ASE, using Low Alpha KE-G2250
Mold Compound, ATB-125 Die Attach Film, 0.8 mil CuPd
Wire, and SAC405 Solder Balls
Apr 2016
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
Document No. 002-12034 Rev. **
ECN #: 5201741
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
BK60B
Mold Compound Flammability Rating:
60 FBGA (10mm x 18 mm x 1.2 mm)
Low Alpha KE-G2250 / Kyocera
UL-94, V-0
Mold Compound Alpha Emission Rate:
<0.002
Oxygen Rating Index: >28%
28%
Substrate Material:
BT Resin
Lead Finish, Composition / Thickness:
SAC405
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
100% Saw
Die Attach Supplier:
Hitachi
Die Attach Material:
ATB-125 Die Attach Film
Bond Diagram Designation
002-03473
Wire Bond Method:
Ultrasonic
Wire Material/Size:
0.8 mil CuPd
Thermal Resistance Theta JA C/W:
21C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
64-22-0000-0059
Name/Location of Assembly (prime) facility:
ASE / Taiwan
MSL LEVEL
3
REFLOW PROFILE
260
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
Wafer Sort: Cypress CMI, USA; Class Test/Finish: ASE, Taiwan
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No. 002-12034 Rev. **
ECN #: 5201741
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Test Condition (Temp/Bias)
Result
P/F
P
High Accelerated Saturation
Test (HAST)
JEDEC STD 22-A110: 130C, 85%RH, 3.6V
Precondition: JESD22 Moisture Sensitivity Level 3
(192 Hrs., 30 C, 60% RH)
Pressure Cooker Test
JESD22-A102: 121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level 3
(192 Hrs., 30 C, 60% RH)
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level 3
(192 Hrs., 30 C, 60% RH)
JESD22-A103: 150 C, no bias
P
(500V, 1,000V, 1250V)
JESD22-C101
P
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH)
JESD22-B116A
Cpk : 1.33, Ppk : 1.66
MIL-STD-883 – Method 2011,
Cpk : 1.33, Ppk : 1.66
Criteria: Meet external and internal characteristics of
Cypress package
P
MIL-STD-883, Method 2019
P
Temperature Cycle
High Temp Storage
Electrostatic Discharge
Charge Device Model (ESDCDM)
Acoustic Microscopy
Ball Shear
Bond Pull
Constructional Analysis
Die Shear
P
P
P
P
P
Per die size:



<3000 sq. mils = 1.2 kgf
30001-5000 sq. mils = 1.2 kgf
>5001 sq. mils = 1.2 kgf
P
Internal Visual
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
JESD22-B117B
Cpk : 1.33, Ppk : 1.66
MIL-STD-883-2014
Final Visual Inspection
JESD22-B101B
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Solderability, Steam Aged
J-STD-002, JESD22-B102
P
X-Ray
95% solder coverage minimum
MIL-STD-883 - 2012
Dye Penetrant Test
BGA Solder Ball Shear
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 7
P
P
P
Document No. 002-12034 Rev. **
ECN #: 5201741
Reliability Test Data
QTP #: 154604
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: Highly Accelerated Saturation Test (HAST), 130C, 85%RH, 3.6V (MSL 3 Preconditioning)
CY14B116N-BA25XIES
CY14B116N-BA25XIES
4521076
4519113
611537842
611537843
ASE-G
ASE-G
96
96
24
25
0
0
STRESS: Temperature Cycling Test (TCT), Condition C, -65 C to 150 C (MSL 3 Preconditioning)
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
4521076
4519113
4519113
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
500
500
500
80
80
80
0
0
0
STRESS: Pressure Cooker Test (PCT), 121 C, 100%RH, 15 PSIG (MSL 3 Preconditioning)
CY14B116N-BA25XIES
CY14B116N-BA25XIES
4521076
4519113
STRESS: High Temperature Storage: 150C
CY14B116N-BA25XIES
4521076
CY14B116N-BA25XIES
4521076
611537842
611537843
ASE-G
ASE-G
168
168
78
80
0
0
611537842
611537842
ASE-G
ASE-G
500
1000
80
80
0
0
9
0
3
0
STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 500V
CY14B116N-BA25XIES
4521076
611537842
ASE-G
500V
STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 1,000V
CY14B116N-BA25XIES
4521076
611537842
ASE-G
1,000V
STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 1,250V
CY14B116N-BA25XIES
4521076
611537842
ASE-G
1,250V
3
0
STRESS: Acoustic Microscopy (MSL 3 Preconditioning)
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
4521076
4519113
4519113
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
COMP
COMP
COMP
15
15
15
0
0
0
4521076
4519113
4519113
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
COMP
COMP
COMP
220
220
220
0
0
0
4521076
4519113
4519113
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
COMP
COMP
COMP
220
220
220
0
0
0
4521076
611537842
ASE-G
COMP
5
0
4521076
4519113
4519113
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
COMP
COMP
COMP
15
15
15
0
0
0
STRESS: Wire Bond Shear
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
STRESS: Wire Bond Pull
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
STRESS: Constructional Analysis
CY14B116N-BA25XIES
STRESS: Die Shear
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No. 002-12034 Rev. **
ECN #: 5201741
Reliability Test Data
QTP #: 154604
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: Dye Penetrant Test
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
4521076
4519113
4519113
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
COMP
COMP
COMP
15
15
15
0
0
0
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
COMP
COMP
COMP
30
30
30
0
0
0
611537842
ASE-G
COMP
5
0
4521076
4519113
4519113
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
COMP
COMP
COMP
519
517
520
0
0
0
4521076
4519113
4519113
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
COMP
COMP
COMP
30
30
30
0
0
0
4521076
4519113
4519113
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
COMP
COMP
COMP
3
3
3
0
0
0
4521076
4519113
4519113
611537842
611537843
611537844
ASE-G
ASE-G
ASE-G
COMP
COMP
COMP
15
15
15
0
0
0
STRESS: BGA Solder Ball Shear
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
4521076
4519113
4519113
STRESS: Internal Visual Inspection
CY14B116N-BA25XIES
4521076
STRESS: Final Visual Inspection
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
STRESS: Physical Dimensions
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
STRESS: Solderability- BGA
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
STRESS: X-RAY
CY14B116N-BA25XIES
CY14B116N-BA25XIES
CY14B116N-BA25XIES
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.002-12034 Rev. **
ECN # 5201741
Document History Page
Document Title:
QTP# 154604: Qualification of the 60 FBGA (10mm x 18mm x 1.2mm) ASE Package for
nvSRAM, using Low Alpha KE-G2250, ATB-125 DAF, CuPd, and SAC405, at MSL3
Document Number:
002-12034
Rev. ECN
Orig. of
No.
Change
**
5201741 BECK
Description of Change
Initial Release
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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