FAIRCHILD 74LVTH16652MTD

Revised January 2000
74LVTH16652
Low Voltage 16-Bit Transceiver/Register
with 3-STATE Outputs
General Description
Features
The LVTH16652 consists of sixteen bus transceiver circuits
with D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or
from the internal registers. Each byte has separate control
inputs which can be shorted together for full 16-bit operation. Data on the A or B bus will be clocked into the registers as the appropriate clock pin goes to the HIGH logic
level. Output Enable pins (OEAB, OEBA) are provided to
control the transceiver function (see Functional Description).
■ Input and output interface capability to systems at
5V VCC
The LVTH16652 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
■ Latch-up performance exceeds 500 mA
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink −32 mA/+64 mA
■ Functionally compatible with the 74 series 16652
The transceivers are designed for low-voltage (3.3V) VCC
applications, but with the capability to provide a TTL interface to a 5V environment. The LVTH16652 is fabricated
with an advanced BiCMOS technology to achieve high
speed operation similar to 5V ABT while maintaining low
power dissipation.
Ordering Code:
Order Number
Package Number
74LVTH16652MEA
MS56A
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
Package Description
74LVTH16652MTD
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
© 2000 Fairchild Semiconductor Corporation
DS012024
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74LVTH16652 Low Voltage 16-Bit Transceiver/Register with 3-STATE Outputs
January 2000
74LVTH16652
Connection Diagram
Pin Descriptions
Pin Names
A0–A15
Description
Data Register A Inputs/
3-STATE Outputs
B0–B15
Data Register B Inputs/
3-STATE Outputs
CPABn, CPBAn
Clock Pulse Inputs
SABn, SBAn
Select Inputs
OEABn, OEBAn
Output Enable Inputs
Truth Table (Note 1)
Inputs
Inputs/Outputs
OEAB1 OEBA1 CPAB1 CPBA1 SAB1
L
H
L
H
X
H
H
H
L
X
L
L
H or L
H or L
SBA1
X
X
X
X
H or L
X
A0 thru A7
Operating Mode
B0 thru B7
Input
Input
Isolation
X
Input
Not Specified Store A, Hold B
X
X
Input
Output
X
X
Not Specified Input
Hold A, Store B
Store A and B Data
H or L
L
X
X
Output
Input
Store B in Both Registers
L
X
X
X
L
Output
Input
Real-Time B Data to A Bus
Input
Output
Output
Output
L
L
X
H or L
X
H
H
H
X
X
L
X
H
H
H or L
X
H
X
H
L
H or L
H or L
H
H
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Store A in Both Registers
Store B Data to A Bus
Real-Time A Data to B Bus
Stored A Data to B Bus
Stored A Data to B Bus and
Stored B Data to A Bus
= LOW-to-HIGH Clock Transition
Note 1: The data output functions may be enabled or disabled by various signals at OEAB or OEBA inputs. Data input functions are always enabled, i.e.,
data at the bus pins will be stored on every LOW-to-HIGH transition on the clock inputs. This also applies to data I/O (A and B: 8–15) and #2 control pins
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74LVTH16652
Logic Diagrams
Please note that these diagrams are provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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74LVTH16652
Functional Description
Data on the A or B data bus, or both can be stored in the
internal D flip-flop by LOW-to-HIGH transitions at the
appropriate Clock Inputs (CPABn, CPBAn) regardless of
the Select or Output Enable Inputs. When SAB and SBA
are in the real time transfer mode, it is also possible to
store data without using the internal D flip-flops by simultaneously enabling OEABn and OEBAn. In this configuration
each Output reinforces its Input. Thus when all other data
sources to the two sets of bus lines are in a HIGH impedance state, each set of bus lines will remain at its last state.
In the transceiver mode, data present at the HIGH impedance port may be stored in either the A or B register or
both.
The select (SABn, SBAn) controls can multiplex stored and
real-time.
The examples below demonstrate the four fundamental
bus-management functions that can be performed with the
LVTH16652.
Real-Time Transfer
Bus B to Bus A
Storage
L
L
X
X
X
L
X
H
L
X
L
H
Real-Time Transfer
Bus A to Bus B
H
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X
X
X
X
X
X
X
X
X
X
Transfer Storage
Data to A or B
OEAB1 OEBA1 CPAB1 CPBA1 SAB1 SBA1
H
OEAB1 OEBA1 CPAB1 CPBA1 SAB1 SBA1
OEAB1 OEBA1 CPAB1 CPBA1 SAB1 SBA1
L
OEAB1 OEBA1 CPAB1 CPBA1 SAB1 SBA1
X
H
4
L
H or L
H or L
H
H
Symbol
Parameter
Value
Conditions
Units
VCC
Supply Voltage
−0.5 to +4.6
VI
DC Input Voltage
−0.5 to +7.0
VO
DC Output Voltage
−0.5 to +7.0
Output in 3-STATE
−0.5 to +7.0
Output in HIGH or LOW State (Note 3)
V
V
V
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
IO
DC Output Current
64
VO > VCC Output at HIGH State
128
VO > VCC Output at LOW State
mA
ICC
DC Supply Current per Supply Pin
±64
mA
IGND
DC Ground Current per Ground Pin
±128
mA
TSTG
Storage Temperature
−65 to +150
°C
Recommended Operating Conditions
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
IOH
HIGH-Level Output Current
IOL
LOW-Level Output Current
TA
Free-Air Operating Temperature
∆t/∆V
Input Edge Rate, VIN = 0.8V–2.0V, VCC = 3.0V
Min
Max
Units
2.7
3.6
V
0
5.5
V
−32
mA
64
mA
−40
85
°C
0
10
ns/V
Note 2: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.
Note 3: IO Absolute Maximum Rating must be observed.
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74LVTH16652
Absolute Maximum Ratings(Note 2)
74LVTH16652
DC Electrical Characteristics
T A = −40°C to +85°C
Symbol
Parameter
VCC
Min
Max
Units
Conditions
(V)
−1.2
VIK
Input Clamp Diode Voltage
VIH
Input HIGH Voltage
2.7–3.6
VIL
Input LOW Voltage
2.7–3.6
VOH
Output HIGH Voltage
2.7–3.6
VCC − 0.2
2.7
2.4
3.0
2.0
VOL
II(HOLD)
2.7
Output LOW Voltage
Bushold Input Minimum Drive
2.0
0.8
IOH = −8 mA
IOH = −32 mA
IOL = 100 µA
2.7
0.5
IOL = 24 mA
3.0
0.4
3.0
0.5
3.0
0.55
75
3.0
V
500
IOL = 64 mA
µA
Power Off Leakage Current
IPU/PD
Power up/down 3-STATE
VI = 0.8V
VI = 2.0V
(Note 4)
(Note 5)
VI = 5.5V
3.6
10
Control Pins
3.6
±1
Data Pins
3.6
−5
0
±100
µA
0V ≤ VI or VO ≤ 5.5V
0–1.5V
±100
µA
VO = 0.5V to 3.0V
−5
µA
VO = 0.0V
VO = 3.6V
µA
VI = 0V or VCC
VI = 0V
VI = VCC
1
IOFF
IOL = 16 mA
IOL = 32 mA
µA
−500
Input Current
V
0.2
Current to Change State
II
V
2.7
3.0
Bushold Input Over-Drive
II = −18 mA
VO ≤ 0.1V or
VO ≥ VCC − 0.1V
IOH = −100 µA
−75
II(OD)
V
V
VI = GND or VCC
Output Current
IOZL
3-STATE Output Leakage Current
3.6
IOZH
3-STATE Output Leakage Current
3.6
5
µA
IOZH+
3-STATE Output Leakage Current
3.6
10
µA
VCC < VO ≤ 5.5V
ICCH
Power Supply Current
3.6
0.19
mA
Outputs HIGH
ICCL
Power Supply Current
3.6
5
mA
Outputs LOW
ICCZ
Power Supply Current
3.6
0.19
mA
Outputs Disabled
ICCZ+
Power Supply Current
3.6
0.19
mA
VCC ≤ VO ≤ 5.5V,
∆ICC
Increase in Power Supply Current
3.6
0.2
mA
One Input at VCC − 0.6V
Outputs Disabled
(Note 6)
Other Inputs at VCC or GND
Note 4: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 5: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
Note 6: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.
Dynamic Switching Characteristics
Symbol
Parameter
(Note 7)
TA = 25°C
VCC
(V)
Min
Typ
Max
Units
Conditions
CL = 50 pF
RL = 500Ω
VOLP
Quiet Output Maximum Dynamic VOL
3.3
0.8
V
(Note 8)
VOLV
Quiet Output Minimum Dynamic VOL
3.3
−0.8
V
(Note 8)
Note 7: Characterized in SOIC package. Guaranteed parameter, but not tested.
Note 8: Max number of outputs defined as (n). n−1 data inputs are driven 0V to 3V. Output under test held LOW.
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TA = −40°C to +85°C
Symbol
CL = 50 pF, RL = 500Ω
Parameter
VCC = 3.3V ± 0.3V
Min
Max
VCC = 2.7V
Min
Max
fMAX
Maximum Clock Frequency
150
tPHL
Propagation Delay
1.3
4.8
1.3
5.4
150
MHz
tPLH
CPAB or CPBA to A or B
1.3
5.1
1.3
5.6
tPHL
Propagation Delay
1.0
4.5
1.0
5.1
tPLH
Data to A or B
1.0
4.4
1.0
4.7
tPHL
Propagation Delay
1.0
4.9
1.0
5.5
tPLH
SBA or SAB to A or B
1.0
4.8
1.0
5.4
tPZL
Output Enable Time
1.0
4.9
1.0
5.8
tPZH
OE to A
1.0
4.8
1.0
5.8
tPLZ
Output Disable Time
1.6
5.6
1.6
6.1
tPHZ
OE to A
2.0
5.4
2.0
6.1
tPZL
Output Enable Time
1.3
5.0
1.3
5.4
tPZH
OE to B
1.3
4.8
1.3
5.4
tPLZ
Output Disable Time
1.3
5.5
1.3
6.2
tPHZ
OE to B
1.3
5.6
1.3
6.3
tS
Setup Time
Hold Time
tH
A or B before CPAB or CPBA, Data HIGH
1.2
1.5
A or B before CPAB or CPBA, Data LOW
2.0
2.8
A or B before CPAB or CPBA, Data HIGH
0.5
0.0
A or B before CPAB or CPBA, Data LOW
0.5
0.5
CPAB or CPBA HIGH or LOW
3.3
tW
Pulse Width
tOSHL
Output to Output Skew (Note 9)
tOSLH
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
3.3
ns
1.0
1.0
1.0
1.0
ns
Note 9: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Capacitance (Note 10)
Typical
Units
CIN
Symbol
Input Capacitance
Parameter
VCC = Open, VI = 0V or VCC
Conditions
4
pF
CI/O
Input/Output Capacitance
VCC = 3.0V, VO = 0V or VCC
8
pF
Note 10: Capacitance is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.
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74LVTH16652
AC Electrical Characteristics
74LVTH16652
Physical Dimensions inches (millimeters) unless otherwise noted
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
Package Number MS56A
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56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD56
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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74LVTH16652 Low Voltage 16-Bit Transceiver/Register with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)