PD - 96283 IRF7759L2TRPbF IRF7759L2TR1PbF DirectFET Power MOSFET RoHS Compliant, Halogen Free l Lead-Free (Qualified up to 260°C Reflow) l Ideal for High Performance Isolated Converter Primary Switch Socket l Optimized for Synchronous Rectification l Low Conduction Losses l High Cdv/dt Immunity l Low Profile (<0.7mm) l Dual Sided Cooling Compatible l Compatible with existing Surface Mount Techniques l Industrial Qualified l Typical values (unless otherwise specified) SC M2 VGS RDS(on) 75V min ±20V max 1.8mΩ@ 10V tot Qgd Vgs(th) 200nC 62nC 3.0V Qg D G S S S S S S S S D DirectFET ISOMETRIC L8 Applicable DirectFET Outline and Substrate Outline SB VDSS M4 L4 L6 L8 Description The IRF7759L2TR/TR1PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has a footprint smaller than a D2PAK and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems. The IRF7759L2TR/TR1PbF is optimized for high frequency switching and synchronous rectification applications. The reduced total losses in the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements, and makes this device ideal for high performance power converters. Absolute Maximum Ratings Max. Parameter VDS g h g 8 V A mJ A 1.95 I D = 96A T A= 25°C VGS = 7.0V ( Typical R DS(on) mΩ) RDS(on) , Drain-to -Source On Resistance (m Ω) VGS ID @ TC = 25°C ID @ TC = 100°C ID @ TA = 25°C ID @ TC = 25°C IDM EAS IAR Units 75 ±20 160 113 26 375 640 257 96 Drain-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V (Silicon Limited)f Continuous Drain Current, VGS @ 10V (Silicon Limited)f Continuous Drain Current, VGS @ 10V (Silicon Limited)e Continuous Drain Current, VGS @ 10V (Package Limited) f Pulsed Drain Current Single Pulse Avalanche Energy Avalanche Current 6 1.85 T J = 125°C 4 VGS = 8.0V VGS = 10V 1.75 2 T J = 25°C 0 2 4 6 8 10 12 14 16 18 20 V GS, Gate -to -Source Voltage (V) Fig 1. Typical On-Resistance vs. Gate Voltage Notes: Click on this section to link to the appropriate technical paper. Click on this section to link to the DirectFET Website. Surface mounted on 1 in. square Cu board, steady state. www.irf.com VGS = 15V 1.65 15 30 45 60 75 90 105 ID, Drain Current (A) Fig 2. Typical On-Resistance vs. Drain Current TC measured with thermocouple mounted to top (Drain) of part. Repetitive rating; pulse width limited by max. junction temperature. Starting TJ = 25°C, L = 0.056mH, RG = 25Ω, IAS = 96A. 1 11/16/09 IRF7759L2TR/TR1PbF Static @ TJ = 25°C (unless otherwise specified) Min. Typ. Max. Units Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Parameter 75 ––– ––– 0.02 ––– ––– VGS(th) Static Drain-to-Source On-Resistance Gate Threshold Voltage ––– 2.0 1.8 3.0 2.3 4.0 ∆VGS(th)/∆TJ IDSS Gate Threshold Voltage Coefficient Drain-to-Source Leakage Current ––– ––– -11 ––– ––– 20 Gate-to-Source Forward Leakage ––– ––– ––– ––– 250 100 Gate-to-Source Reverse Leakage Forward Transconductance ––– 74 ––– ––– -100 ––– Total Gate Charge Pre-Vth Gate-to-Source Charge ––– ––– 200 37 300 ––– Post-Vth Gate-to-Source Charge Gate-to-Drain Charge ––– ––– 11 62 ––– 93 Gate Charge Overdrive Switch Charge (Qgs2 + Qgd) ––– ––– 91 73 ––– ––– Output Charge Gate Resistance ––– ––– 60 1.1 ––– ––– Turn-On Delay Time Rise Time ––– ––– 18 37 ––– ––– Turn-Off Delay Time Fall Time ––– ––– 80 33 ––– ––– Input Capacitance Output Capacitance ––– ––– 12222 1465 ––– ––– BVDSS ∆ΒVDSS/∆TJ RDS(on) IGSS gfs Qg Qgs1 Qgs2 Qgd Qgodr Qsw Qoss RG td(on) tr td(off) tf Ciss Coss Crss Coss Coss Conditions V VGS = 0V, ID = 250µA V/°C Reference to 25°C, ID = 2mA mΩ VGS = 10V, ID = 96A V mV/°C i VDS = VGS, ID = 250µA µA VDS = 75V, VGS = 0V VDS = 60V, VGS = 0V, TJ = 125°C nA VGS = 20V VGS = -20V S VDS = 25V, ID = 96A nC VDS = 38V VGS = 10V ID = 96A See Fig. 9 nC VDS = 16V, VGS = 0V Ω i VDD = 38V, VGS = 10V ns ID = 96A RG=1.8Ω VGS = 0V VDS = 25V pF Reverse Transfer Capacitance Output Capacitance ––– ––– 609 7457 ––– ––– Output Capacitance ––– 955 ––– Min. Typ. Max. Units ƒ = 1.0MHz VGS = 0V, VDS = 1.0V, f=1.0MHz VGS = 0V, VDS = 60V, f=1.0MHz Diode Characteristics Parameter IS Continuous Source Current ISM (Body Diode) Pulsed Source Current VSD trr Qrr g (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge ––– ––– Conditions MOSFET symbol 160 A showing the integral reverse p-n junction diode. TJ = 25°C, IS = 96A, VGS = 0V TJ = 25°C, IF = 96A, VDD = 38V ––– ––– 640 ––– ––– 1.3 V ––– ––– 64 150 96 225 ns nC i di/dt = 100A/µs i Notes: Repetitive rating; pulse width limited by max. junction temperature. Pulse width ≤ 400µs; duty cycle ≤ 2%. 2 www.irf.com IRF7759L2TR/TR1PbF Absolute Maximum Ratings f f c Max. Parameter Units 125 63 3.3 270 -55 to + 175 Power Dissipation Power Dissipation Power Dissipation Peak Soldering Temperature Operating Junction and Storage Temperature Range PD @TC = 25°C PD @TC = 100°C PD @TA = 25°C TP TJ TSTG W °C Thermal Resistance RθJA RθJA RθJA RθJ-Can RθJ-PCB e j k Parameter Junction-to-Ambient Junction-to-Ambient Junction-to-Ambient Junction-to-Can Junction-to-PCB Mounted fl Typ. Max. Units ––– 12.5 20 ––– ––– 45 ––– ––– 1.2 0.5 °C/W Thermal Response ( Z thJC ) °C/W 10 1 D = 0.50 0.20 0.10 0.05 0.02 0.01 0.1 0.01 τJ R1 R1 τJ τ1 R2 R2 R3 R3 τC τ τ2 τ1 τ2 τ3 τ3 Ci= τi/Ri Ci i/Ri 0.001 1E-005 0.0001 0.001 τ4 τ4 Ri (°C/W) τi (sec) 0.10804 0.000171 0.61403 0.053914 0.45202 0.006099 0.00001 0.036168 Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc SINGLE PULSE ( THERMAL RESPONSE ) 0.0001 1E-006 R4 R4 0.01 0.1 1 t1 , Rectangular Pulse Duration (sec) Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Case Notes: Mounted on minimum footprint full size board with metalized Surface mounted on 1 in. square Cu board, steady state. TC measured with thermocouple incontact with top (Drain) of part. back and with small clip heatsink. Rθ is measured at TJ of approximately 90°C. Used double sided cooling, mounting pad with large heatsink. Surface mounted on 1 in. square Cu board (still air). www.irf.com Mounted on minimum footprint full size board with metalized back and with small clip heatsink. (still air) 3 IRF7759L2TR/TR1PbF 1000 1000 100 BOTTOM 10 TOP ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A) TOP VGS 15V 10V 7.00V 5.50V 5.00V 4.50V 4.00V 3.75V 100 1 3.75V 0.1 BOTTOM 3.75V 10 ≤60µs PULSE WIDTH ≤60µs PULSE WIDTH Tj = 175°C Tj = 25°C 1 0.01 0.1 1 10 0.1 100 V DS, Drain-to-Source Voltage (V) 100 Fig 5. Typical Output Characteristics RDS(on) , Drain-to-Source On Resistance (Normalized) ID, Drain-to-Source Current (A) 10 2.5 1000 VDS = 25V ≤60µs PULSE WIDTH 100 10 T J = 175°C TJ = 25°C TJ = -40°C 1 ID = 96A VGS = 10V 2.0 1.5 1.0 0.5 0.1 2 2.5 3 3.5 4 4.5 5 5.5 -60 6 VGS, Gate-to-Source Voltage (V) ID= 96A C oss = C ds + C gd Ciss Coss Crss 1000 60 100 140 180 14 VGS = 0V, f = 1 MHZ C iss = C gs + C gd, C ds SHORTED C rss = C gd 10000 20 Fig 7. Normalized On-Resistance vs. Temperature Fig 6. Typical Transfer Characteristics 100000 -20 TJ , Junction Temperature (°C) VGS, Gate-to-Source Voltage (V) C, Capacitance (pF) 1 V DS, Drain-to-Source Voltage (V) Fig 4. Typical Output Characteristics 12 VDS= 60V VDS= 38V VDS= 15V 10 8 6 4 2 0 100 1 10 100 VDS, Drain-to-Source Voltage (V) Fig 8. Typical Capacitance vs.Drain-to-Source Voltage 4 VGS 15V 10V 7.00V 5.50V 5.00V 4.50V 4.00V 3.75V 0 50 100 150 200 250 300 QG, Total Gate Charge (nC) Fig 9. Typical Total Gate Charge vs Gate-to-Source Voltage www.irf.com IRF7759L2TR/TR1PbF 10000 OPERATION IN THIS AREA LIMITED BY RDS(on) T J = 175°C TJ = 25°C TJ = -40°C 100 ID, Drain-to-Source Current (A) ISD, Reverse Drain Current (A) 1000 10 1 1000 100 100µsec DC 1msec 10 1 VGS = 0V 0.1 0.1 0.2 0.4 0.6 0.8 1.0 0 1.2 1 10 100 VDS, Drain-to-Source Voltage (V) VSD, Source-to-Drain Voltage (V) Fig 10. Typical Source-Drain Diode Forward Voltage Fig11. Maximum Safe Operating Area 200 VGS(th) , Gate threshold Voltage (V) 4.5 160 ID, Drain Current (A) 10msec Tc = 25°C Tj = 175°C Single Pulse 120 80 40 0 4.0 3.5 3.0 2.5 2.0 1.5 1.0 ID = 1.0A ID = 1.0mA ID = 250µA 0.5 25 50 75 100 125 150 175 -75 -50 -25 T C , Case Temperature (°C) 0 25 50 75 100 125 150 175 T J , Temperature ( °C ) Fig 13. Typical Threshold Voltage vs. Junction Temperature Fig 12. Maximum Drain Current vs. Case Temperature EAS , Single Pulse Avalanche Energy (mJ) 1200 ID 15.39A 23.97A BOTTOM 96A TOP 1000 800 600 400 200 0 25 50 75 100 125 150 175 Starting T J , Junction Temperature (°C) Fig 14. Maximum Avalanche Energy Vs. Drain Current www.irf.com 5 IRF7759L2TR/TR1PbF 1000 Duty Cycle = Single Pulse Allowed avalanche Current vs avalanche pulsewidth, tav, assuming ∆Tj = 150°C and Tstart =25°C (Single Pulse) Avalanche Current (A) 100 0.01 10 0.05 0.10 1 Allowed avalanche Current vs avalanche pulsewidth, tav, assuming ∆Τ j = 25°C and Tstart = 150°C. 0.1 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 tav (sec) Fig 15. Typical Avalanche Current Vs.Pulsewidth EAR , Avalanche Energy (mJ) 300 Notes on Repetitive Avalanche Curves , Figures 15, 16: (For further info, see AN-1005 at www.irf.com) 1. Avalanche failures assumption: Purely a thermal phenomenon and failure occurs at a temperature far in excess of Tjmax. This is validated for every part type. 2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded. 3. Equation below based on circuit and waveforms shown in Figures 19a, 19b. 4. PD (ave) = Average power dissipation per single avalanche pulse. 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. Iav = Allowable avalanche current. 7. ∆T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as 25°C in Figure 15, 16). tav = Average time in avalanche. D = Duty cycle in avalanche = tav ·f ZthJC(D, tav) = Transient thermal resistance, see figure 11) TOP Single Pulse BOTTOM 1.0% Duty Cycle ID = 96A 250 200 150 100 50 0 25 50 75 100 125 150 175 Starting T J , Junction Temperature (°C) PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC Iav = 2DT/ [1.3·BV·Zth] EAS (AR) = PD (ave)·ta Fig 16. Maximum Avalanche Energy Vs. Temperature D.U.T Driver Gate Drive + + - * D.U.T. ISD Waveform Reverse Recovery Current + RG • • • • di/dt controlled by RG Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T. - Device Under Test VDD P.W. Period VGS=10V Circuit Layout Considerations • Low Stray Inductance • Ground Plane • Low Leakage Inductance Current Transformer - D= Period P.W. + - Re-Applied Voltage Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt Body Diode VDD Forward Drop Inductor Current Inductor Curent Ripple ≤ 5% ISD * VGS = 5V for Logic Level Devices Fig 17. Diode Reverse Recovery Test Circuit for N-Channel HEXFET® Power MOSFETs 6 www.irf.com IRF7759L2TR/TR1PbF Id Vds Vgs L VCC DUT 0 20K 1K Vgs(th) S Qgodr Fig 18a. Gate Charge Test Circuit Qgd Qgs2 Qgs1 Fig 18b. Gate Charge Waveform V(BR)DSS 15V DRIVER L VDS tp D.U.T V RGSG + - VDD IAS 20V tp A I AS 0.01Ω Fig 19b. Unclamped Inductive Waveforms Fig 19a. Unclamped Inductive Test Circuit VDS V GS RG RD VDS 90% D.U.T. + - VDD V10V GS Pulse Width ≤ 1 µs Duty Factor ≤ 0.1 % Fig 20a. Switching Time Test Circuit www.irf.com 10% VGS td(on) tr t d(off) tf Fig 20b. Switching Time Waveforms 7 IRF7759L2TR/TR1PbF DirectFET Board Footprint, L8 (Large Size Can). Please see AN-1035 for DirectFET assembly details and stencil and substrate design recommendations G = GATE D = DRAIN S = SOURCE D D D 8 S S S S G D D S S S S D www.irf.com IRF7759L2TR/TR1PbF DirectFET Outline Dimension, L8 Outline (LargeSize Can). Please see AN-1035 for DirectFET assembly details and stencil and substrate design recommendations DIMENSIONS METRIC MAX CODE MIN 9.15 A 9.05 7.10 B 6.85 6.00 C 5.90 0.65 D 0.55 0.62 E 0.58 1.22 F 1.18 1.02 G 0.98 0.77 H 0.73 0.42 0.38 J 1.47 K 1.34 2.69 L 2.52 0.70 M 0.59 0.08 N 0.03 0.18 P 0.09 IMPERIAL MIN 0.356 0.270 0.232 0.022 0.023 0.046 0.015 0.029 0.015 0.053 0.099 0.023 0.001 0.003 MAX 0.360 0.280 0.236 0.026 0.024 0.048 0.017 0.030 0.017 0.058 0.106 0.028 0.003 0.007 DirectFET Part Marking GATE MARKING LOGO PART NUMBER BATCH NUMBER DATE CODE Line above the last character of the date code indicates "Lead-Free" Note: For the most current drawing please refer to IR website at http://www.irf.com/package www.irf.com 9 IRF7759L2TR/TR1PbF DirectFET Tape & Reel Dimension (Showing component orientation). NOTE: Controlling dimensions in mm Std reel quantity is 4000 parts. (ordered as IRF7759L2PBF). REEL DIMENSIONS STANDARD OPTION (QTY 4000) METRIC IMPERIAL MIN CODE MAX MIN MAX A 12.992 330.0 N.C N.C B 0.795 20.2 N.C N.C 0.504 C 12.8 0.520 13.2 D 0.059 1.5 N.C N.C E 3.937 100.0 N.C N.C F N.C N.C 0.889 22.4 G 0.646 16.4 18.4 0.724 H 0.626 15.9 0.724 18.4 LOADED TAPE FEED DIRECTION NOTE: CONTROLLING DIMENSIONS IN MM CODE A B C D E F G H 10 DIMENSIONS IMPERIAL METRIC MIN MIN MAX MAX 0.469 0.476 12.10 11.90 0.154 4.10 3.90 0.161 0.626 15.90 0.642 16.30 0.291 7.40 0.299 7.60 0.284 0.291 7.20 7.40 0.390 0.398 9.90 10.10 0.059 1.50 NC NC 0.059 1.50 0.063 1.60 www.irf.com IRF7759L2TR/TR1PbF Part number Package Type IRF7759L2TRPbF IRF7759L2TR1PbF DirectFET2 Large Can DirectFET2 Large Can Standard Pack Form Quantity Tape and Reel 4000 Tape and Reel 1000 Qualification Information† Industrial Qualification level Note "TR" suffix "TR1" suffix †† (per JEDEC JESD47F††† guidelines) Comments: This family of products has passed JEDEC’s Industrial qualification. IR’s Consumer qualification level is granted by extension of the higher Industrial level. Moisture Sensitivity Level MSL1 DFET2 (per JEDEC J-STD-020D†††) RoHS Compliant Yes Qualification standards can be found at International Rectifier’s web site http://www.irf.com/product-info/reliability Higher qualification ratings may be available should the user have such requirements. Please contact your International Rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/ Applicable version of JEDEC standard at the time of product release. Data and specifications subject to change without notice. This product has been designed and qualified to MSL1 rating for the Industrial market. Additional storage requirement details for DirectFET products can be found in application note AN1035 on IRs Web site. Qualification Standards can be found on IR’s Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.11/2009 www.irf.com 11