TOSHIBA GT40QR21

GT40QR21
Discrete IGBTs
Silicon N-Channel IGBT
GT40QR21
1. Applications
•
Dedicated to Voltage-Resonant Inverter Switching Applications
Note:
The product(s) described herein should not be used for any other application.
2. Features
(1)
6.5th generation
(2)
The RC-IGBT consists of a freewheeling diode monolithically integrated in an IGBT chip.
(3)
Enhancement mode
(4)
High-speed switching
IGBT : tf = 0.20 µs (typ.) (IC = 40 A)
FWD : trr = 0.60 µs (typ.) (IF = 15 A)
(5)
Low saturation voltage : VCE(sat) = 1.9 V (typ.) (IC = 40 A)
(6)
High junction temperature : Tj = 175 (max)
3. Packaging and Internal Circuit
1: Gate
2: Collector
3: Emitter
TO-3P(N)
1
2011-06-06
Rev.1.0
GT40QR21
, unless otherwise specified)
4. Absolute Maximum Ratings (Note) (Ta = 25
25
Characteristics
Symbol
Rating
Unit
Collector-emitter voltage
VCES
1200
V
Gate-emitter voltage
VGES
±25
IC
40
Collector current (DC)
(Tc = 25)
Collector current (DC)
(Tc = 100)
Collector current (1 ms)
ICP
80
Diode forward current (DC)
IF
20
Diode forward current (100 µs)
Collector power dissipation
A
35
(Tc = 25)
Junction temperature
80
PC
230
W

Tj
175
Storage temperature
Tstg
-55 to 175
Mounting torque
TOR
0.8
Note:
(Note 1)
IFP
Nm
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
In general, loss of IGBT increases more when it has positive temperature coefficient and gets higher
temperature.
In case that the temperature rise due to loss of IGBT exceeds the heat release capacity of a device, it leads
to thermorunaway and results in destruction.
Therefore, please design heat release of a device with due consideration to the temperature rise of IGBT.
Note 1: Ensure that the junction temperature does not exceed 175.
5. Thermal Characteristics
Characteristics
Junction-to-case thermal resistance
2
Symbol
Max
Unit
Rth(j-c)
0.65
/W
2011-06-06
Rev.1.0
GT40QR21
6. Electrical Characteristics
, unless otherwise specified)
6.1. Static Characteristics (Ta = 25
25
Characteristics
Gate leakage current
Collector cut-off current
Symbol
Test Condition
IGES
VGE = ±25 V, VCE = 0 V
ICES
VCE = 1200 V, VGE = 0 V
Min
Typ.
Max
Unit


±100
nA


1
mA
Gate-emitter cut-off voltage
VGE(OFF) IC = 40 mA, VCE = 5 V
4.5

7.5
V
Collector-emitter saturation voltage
VCE(sat)(1) IC = 20 A, VGE = 15 V

1.50

Collector-emitter saturation voltage
VCE(sat)(2) IC = 20 A, VGE = 15 V,
Tj = 125

1.75

Collector-emitter saturation voltage
VCE(sat)(3) IC = 20 A, VGE = 15 V,
Tj = 175

1.89

Collector-emitter saturation voltage
VCE(sat)(4) IC = 40 A, VGE = 15 V

1.90
2.70
Collector-emitter saturation voltage
VCE(sat)(5) IC = 40 A, VGE = 15 V,
Tj = 125

2.29

Collector-emitter saturation voltage
VCE(sat)(6) IC = 40 A, VGE = 15 V,
Tj = 175

2.50



2.6
Diode forward voltage
VF
IF = 15 A, VGE = 0 V
3
2011-06-06
Rev.1.0
GT40QR21
, unless otherwise specified)
6.2. Dynamic Characteristics (Ta = 25
25
Characteristics
Input capacitance
Symbol
Cies
Switching time (rise time)
tr
Switching time (turn-on time)
ton
Switching time (fall time)
Switching time (turn-off time)
tf
Test Condition
Min
Typ.
Max
Unit
VCE = 10 V, VGE = 0 V,
f = 1 MHz

1500

pF
Resistive load
VCC = 600 V, IC = 40 A,
VGG = ±15 V, RG = 39 Ω
See Fig. 6.2.1, 6.2.2.

0.12

µs

0.18


0.20
0.40

0.40

toff
Switching loss (turn-off switching loss)
Eoff(1)
Inductive Load
VCC = 280 V, IC = 40 A,
L = 30 µH,C = 0.33 µF,
VGG = 20 V, RG = 10 Ω
See Fig. 6.2.3, 6.2.4.

0.16

Switching loss (turn-off switching loss)
Eoff(2)
Inductive Load
VCC = 280 V, IC = 40 A,
L = 30 µH,C = 0.33 µH,
VGG = 20 V, RG = 10 Ω
Tc = 125
See Fig. 6.2.3, 6.2.4.

0.29

IF = 15 A, VGE = 0 V,
di/dt = -20 A/µs

0.60

Reverse recovery time
trr
mJ
µs
Fig. 6.2.1 Test Circuit of Switching Time
Fig. 6.2.2 Timing Chart of Switching Time
Fig. 6.2.3 Test Circuit of Switching Loss
Fig. 6.2.4 Timing Chart of Switching Loss
4
2011-06-06
Rev.1.0
GT40QR21
7. Marking (Note)
Fig. 7.1 Marking
Note:
A line under a Lot No. identifies the indication of product Labels.
[[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on
the restriction of the use of certain hazardous substances in electrical and electronic equipment.
Note:
This transistor is sensitive to electrostatic discharge and should be handled with care.
5
2011-06-06
Rev.1.0
GT40QR21
8. Characteristics Curves (Note)
Fig. 8.1 IC - VCE
Fig. 8.2 IC - VCE
Fig. 8.3 IC - VCE
Fig. 8.4 IC - VCE
Fig. 8.5 VCE(sat) - Tc
Fig. 8.6 IC - VGE
6
2011-06-06
Rev.1.0
GT40QR21
Fig. 8.8 C - VCE
Fig. 8.9 Switching Time - IC
Fig. 8.10 Switching Time - RG
Fig. 8.11 rth(j-c) - tw
(Guaranteed Maximum)
Fig. 8.12 Safe Operating Area
(Guaranteed Maximum)
Fig. 8.13 Reverse Bias SOA
(Guaranteed Maximum)
7
2011-06-06
Rev.1.0
GT40QR21
Fig. 8.14 IF - VF
Note:
The above characteristics curves are presented for reference only and not guaranteed by production test.
8
2011-06-06
Rev.1.0
GT40QR21
Package Dimensions
Unit: mm
Weight: 4.6 g (typ.)
Package Name(s)
TOSHIBA: 2-16C1S
Nickname: TO-3P(N)
9
2011-06-06
Rev.1.0
GT40QR21
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product
is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/
or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact
("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace
industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,
equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and
equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange
and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology
are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
10
2011-06-06
Rev.1.0