DIODES DMP2035UVT-7

DMP2035UVT
-20V P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS
Features and Benefits
•
•
•
•
•
•
•
ID
RDS(on) max
TA = 25°C
35mΩ @ VGS = -4.5V
-6.0A
45mΩ @ VGS = -2.5V
-5.2A
-20V
Description and Applications
Mechanical Data
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
•
•
•
•
Low Input Capacitance
Low On-Resistance
Fast Switching Speed
ESD protected Up To 3KV
Lead, Halogen, and Antimony Free, RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
DC-DC Converters
Motor Control
Power management functions
Analog Switch
•
•
Case: TSOT26
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – MatteTin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.0013 grams (approximate)
•
•
•
•
Drain
TSOT26
D
1
6
D
D
2
5
D
G
3
4
S
Top View
ESD PROTECTED TO 3kV
Gate
Gate
Protection
Diode
Top View
Pin-Out
Source
Equivalent Circuit
Ordering Information (Note 3)
Part Number
DMP2035UVT-7
DMP2035UVT-13
Notes:
Case
TSOT26
TSOT26
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free.
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
20P
Date Code Key
Year
Code
Month
Code
2011
Y
Jan
1
2012
Z
Feb
2
DMP2035UVT
Document number: DS35190 Rev. 5 - 2
Mar
3
YM
Marking Information
20P = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
2013
A
Apr
4
May
5
2014
B
Jun
6
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2015
C
Jul
7
Aug
8
2016
D
Sep
9
Oct
O
2017
E
Nov
N
Dec
D
March 2012
© Diodes Incorporated
DMP2035UVT
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Steady
State
Continuous Drain Current (Note 5) VGS = -4.5V
t<10s
Steady
State
Continuous Drain Current (Note 5) VGS = -2.5V
t<10s
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
ID
-7.2
-5.7
A
ID
-5.2
-4.1
A
Units
V
V
A
-6.2
-4.9
-2.0
-24
ID
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Thermal Characteristics
ID
Value
-20
±12
-6.0
-4.8
IS
IDM
A
A
A
@TA = 25°C unless otherwise specified
Characteristic
Symbol
PD
Total Power Dissipation (Note 4)
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 4)
Value
1.2
106
74
2.0
65
46
11.8
-55 to 150
RθJA
Total Power Dissipation (Note 5)
PD
Steady State
t<10s
Steady State
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
RθJA
RθJC
TJ, TSTG
Units
W
°C/W
W
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Gate Threshold Voltage Temperature Coefficient
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage (Note 5)
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
Symbol
Min
Typ
BVDSS
IDSS
IGSS
-20
⎯
⎯
⎯
⎯
⎯
⎯
-1
±10
VGS(th)
-0.4
-0.7
VGS(th)/△TJ
⎯
2.5
|Yfs|
VSD
⎯
⎯
⎯
⎯
⎯
23
30
41
18
-0.7
35
45
62
⎯
-1.0
Ciss
Coss
Crss
RG
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
1610
157
145
9.4
15.4
2.5
3.3
17
12
94
42
14
4
2400
210
200
14.1
23.1
⎯
⎯
33
19
150
64
25
8
△
RDS (ON)
Max
Unit
Test Condition
V
µA
µA
VGS = 0V, ID = -250μA
VDS = -20V, VGS = 0V
VGS = ±8V, VDS = 0V
-1.5
V
VDS = VGS, ID = -250μA
⎯
mV/°C
mΩ
S
V
ID = -250μA , Referenced to 25°C
VGS = -4.5V, ID = -4.0A
VGS = -2.5V, ID = -4.0A
VGS = -1.8V, ID = -2.0A
VDS = -5V, ID = -5.5A
VGS = 0V, IS = -1A
pF
VDS = -10V, VGS = 0V
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = -10V, VGS = -4.5V
ID = -4A
ns
VGS = -4.5V, VDS = -10V, RG = 6Ω,
ID = -1A, RL = 10Ω
ns
nC
IF =-4.5A, di/dt=100A/µS
4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
DMP2035UVT
Document number: DS35190 Rev. 5 - 2
2 of 6
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March 2012
© Diodes Incorporated
DMP2035UVT
20
25
VGS = 8.0V
VDS = -5.0V
VGS = 4.5V
VGS = 3.5V
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
20
VGS = 2.0V
VGS = 3.2V
15
VGS = 3.0V
VGS = 2.5V
10
5
15
10
TA = 150°C
5
TA = 125 °C
VGS = 1.5V
TA = 85°C
TA = 25°C
0
0
1
2
3
4
-VDS, DRAIN -SOURCE VOLTAGE(V)
Fig. 1 Typical Output Characteristics
0.05
0.04
0.03
1
10
-ID, DRAIN SOURCE CURRENT
Fig. 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
100
RDS(on), DRAIN-SOURCE ON-RESISTANCE (Ω)
1.7
1.5
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (Normalized)
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE(Ω)
RDS(ON),DRAIN-SOURCE ON-RESISTANCE(Ω)
0.06
0.02
0.1
0
5
0.07
1.3
1.1
0.9
0.7
0.5
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 5 On-Resistance Variation with Temperature
DMP2035UVT
Document number: DS35190 Rev. 5 - 2
TA = -55°C
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0.5
1.0
1.5
2.0
2.5
-VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
3.0
0.05
VGS = -4.5V
TA = 150°C
0.04
TA = 125°C
TA = 85°C
0.03
TA = 25°C
0.02
0.01
TA = -55°C
0
4
8
12
16
-ID, DRAIN SOURCE CURRENT (A)
Fig. 4 Typical On-Resistance vs.
Drain Current and Temperature
20
0.06
0.05
VGS = -2.5V
ID = -5A
0.04
0.03
VGS = -4.5V
ID = -10A
0.02
0.01
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 6 On-Resistance Variation with Temperature
March 2012
© Diodes Incorporated
DMP2035UVT
20
18
1.0
16
-IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE(V)
1.2
0.8
0.6
0.4
14
12
10
8
6
4
0.2
2
0
-50
0
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
0
0.3
0.6
0.9
1.2
1.5
-VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
100,000
10,000
-IGSS, LEAKAGE CURRENT (nA)
-IDSS, LEAKAGE CURRENT (nA)
TA = 150°C
TA = 125°C
1,000
100
TA = 85°C
10
T A = 150°C
TA = 125°C
10,000
1,000
TA = 85°C
100
TA = 25°C
TA = -55°C
10
TA = -55°C
T A = 25°C
1
1
2
4
6
8
10
-VGS, GATE-SOURCE VOLTAGE(V)
Fig. 10 Typical Gate-Source Leakage Current vs. Voltage
2
4
6
8
10 12 14 16 18 20
-VDS, DRAIN-SOURCE VOLTAGE(V)
Fig. 9 Typical Drain-Source Leakage Current vs. Voltage
10
10,000
-VGS, GATE-SOURCE VOLTAGE (V)
CT, JUNCTION CAPACITANCE (pF)
f = 1MHz
Ciss
1,000
Coss
100
8
6
4
2
C rss
0
2
4
6
8 10 12 14 16 18 20
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 11 Typical Junction Capacitance
DMP2035UVT
Document number: DS35190 Rev. 5 - 2
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0
0
4
8 12 16 20 24 28 32 36 40
Qg, TOTAL GATE CHARGE (nC)
Fig. 12 Gate-Charge Characteristics
March 2012
© Diodes Incorporated
DMP2035UVT
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
D = 0.02
0.01
D = 0.01
RθJA(t) = r(t) * RθJA
RθJA = 88°C/W
Duty Cycle, D = t1/ t2
D = 0.005
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIMES (sec)
Fig. 13 Transient Thermal Resistance
10
100
1,000
Package Outline Dimensions
D
e1
E
E1
L2
c
4x θ1
e
L
θ
6x b
A
A2
A1
TSOT26
Dim Min Max Typ
A
1.00
−
−
A1
0.01 0.10
−
A2
0.84 0.90
−
D
2.90
−
−
E
2.80
−
−
E1
1.60
−
−
b
0.30 0.45
−
c
0.12 0.20
−
e
0.95
−
−
e1
1.90
−
−
L
0.30 0.50
L2
0.25
−
−
θ
0°
8°
4°
θ1
4°
12°
−
All Dimensions in mm
Suggested Pad Layout
C
C
Y1
Y (6x)
Dimensions Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
X (6x)
DMP2035UVT
Document number: DS35190 Rev. 5 - 2
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March 2012
© Diodes Incorporated
DMP2035UVT
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
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labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
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Copyright © 2012, Diodes Incorporated
www.diodes.com
DMP2035UVT
Document number: DS35190 Rev. 5 - 2
6 of 6
www.diodes.com
March 2012
© Diodes Incorporated