DIODES HBDM60V600W

HBDM60V600W
COMPLEX TRANSISTOR ARRAY FOR BIPOLAR
TRANSISTOR HALF H-BRIDGE MOTOR/ACTUATOR DRIVER
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Features
Mechanical Data
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•
•
•
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Epitaxial Planar Die Construction
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Sub-Component P/N
Reference
MMBT2907A_DIE
Q1
PNP Transistor
MMBTA06_DIE
Q2
NPN Transistor
•
•
•
Device Type
•
•
•
Case: SOT-363
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: See Schematic & Pin Configuration
Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 6
Ordering Information: See Page 6
Weight: 0.016 grams (approximate)
CQ1
EQ1
EQ2
Q1
Q2
MMBT2907A
MMBTA06
BQ1
Top View
CQ2
BQ2
Device Schematic
Maximum Ratings: Total Device
@TA = 25°C unless otherwise specified
Characteristic
Operating and Storage Junction Temperature Range
Symbol
VEBO
Value
-55 to +150
Unit
°C
Characteristic
Power Dissipation (Note 3)
Thermal Resistance, Junction to Ambient Air (Note 3)
Symbol
PD
RθJA
Value
200
625
Unit
mW
°C/W
Maximum Ratings: Sub-Component Devices
@TA = 25°C unless otherwise specified
Thermal Characteristics: Total Device
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous (Note 3)
Notes:
Symbol
VCBO
VCEO
VEBO
IC
Q1-PNP Transistor
(MMBT2907A)
-60
-60
-5.5
-600
Q2-NPN Transistor
(MMBTA06)
80
65
6
500
Unit
V
V
V
mA
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on page 7 or on Diodes Inc. suggested pad layout document
AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
HBDM60V600W
Document number: DS30701 Rev. 5 - 2
1 of 7
www.diodes.com
July 2008
© Diodes Incorporated
HBDM60V600W
Electrical Characteristics: PNP (MMBT2907A) Transistor (Q1)
Characteristic
OFF CHARACTERISTICS (Note 4)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Collector Cutoff Current
Base Cutoff Current
ON CHARACTERISTICS (Note 4)
@TA = 25°C unless otherwise specified
Symbol
Min
Max
Unit
V(BR)CBO
V(BR)CEO
V(BR)EBO
ICBO
ICEX
IBL
-60
-60
-5.5
⎯
⎯
⎯
⎯
⎯
⎯
-10
-50
-50
V
V
V
nA
nA
nA
IC = -10μA, IE = 0
IC = -10mA, IB = 0
IE = -10μA, IC = 0
VCB = -50V, IE = 0
VCE = -30V, VEB(OFF) = -0.5V
VCE = -30V, VEB(OFF) = -0.5V
hFE
100
100
100
100
50
⎯
⎯
⎯
300
⎯
⎯
⎯
⎯
⎯
⎯
Collector-Emitter Saturation Voltage
VCE(SAT)
⎯
-0.3
-0.5
V
Base-Emitter Saturation Voltage
VBE(SAT)
⎯
-0.95
-1.3
V
IC = -100μA, VCE = -10V
IC = -1.0mA, VCE = -10V
IC = -10mA, VCE = -10V
IC = -150mA, VCE = -10V
IC = -500mA, VCE = -10V
IC = -150mA, IB = -15mA
IC = -500mA, IB = -50mA
IC = -150mA, IB = -15mA
IC = -500mA, IB = -50mA
Current Gain-Bandwidth Product
fT
100
⎯
MHz
SWITCHING CHARACTERISTICS
Turn-On Time
Delay Time
Rise Time
Turn-Off Time
Storage Time
Fall Time
ton
td
tr
toff
ts
tr
⎯
⎯
⎯
⎯
⎯
⎯
45
10
40
100
80
30
ns
ns
ns
ns
ns
ns
DC Current Gain
Test Condition
SMALL SIGNAL CHARACTERISTICS
Electrical Characteristics: NPN (MMBTA06) Transistor (Q2)
Characteristic
OFF CHARACTERISTICS (Note 4)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector-Base Cutoff Current
Collector Cutoff Current
Emitter-Base Cutoff Current
ON CHARACTERISTICS (Note 4)
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Turn-on Voltage
Base-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
VCE = -30V, IC = -150mA,
IB1 = -15mA
VCC = -6.0V, IC = -150mA,
IB1 = IB2 = -15mA
@TA = 25°C unless otherwise specified
Symbol
Min
Typ
Max
Unit
V(BR)CBO
V(BR)CEO
V(BR)EBO
ICBO
ICES
IEBO
80
65
6
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
100
100
100
V
V
V
nA
nA
nA
IC = 100μA, IE = 0
IC = 1mA, IB = 0
IE = 100μA, IC = 0
VCB = 80V, IE = 0
VCE = 90V, VBE = 0
VEB = 5V, IC = 0
VCE(SAT)
VBE(ON)
VBE(SAT)
250
100
⎯
0.7
⎯
⎯
⎯
0.2
0.75
⎯
⎯
⎯
0.4
0.8
0.95
⎯
⎯
V
V
V
VCE = 1V, IC = 10mA
VCE = 1V, IC = 100mA
IC = 100mA, IB = 10mA
VCE = 1V, IC = 100mA
IC = 100mA, IB = 5mA
fT
100
⎯
⎯
MHz
VCE = 20V, IC = 10mA,
f = 100MHz
hFE
Current Gain-Bandwidth Product
Notes:
VCE = -2.0V, IC = -10mA,
f = 100MHz
Test Condition
4. Short duration pulse test used to minimize self-heating effect.
HBDM60V600W
Document number: DS30701 Rev. 5 - 2
2 of 7
www.diodes.com
July 2008
© Diodes Incorporated
HBDM60V600W
Typical Characteristics
@TA = 25°C unless otherwise specified
PD, POWER DISSIPATION (mW)
200
150
100
50
0
0
25
50
75 100 125 150 175
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
200
PNP (MMBT2907A) Transistor (Q1) Plots:
30
-VCE, COLLECTOR-EMITTER VOLTAGE (V)
1.6
C, CAPACITANCE (pF)
20
10
Cibo
5.0
Cobo
1.0
0.1
1.0
10
REVERSE VOLTAGE (V)
Fig. 2 Typical Capacitance
IC = 100mA
1.2
IC = 1mA
IC = 30mA
1.0
0.8
0.6
0.4
0.2
1
0.1
10
100
-IB, BASE CURRENT (mA)
Fig. 3 Typical Collector Saturation Region
0.01
1,000
VCE = 5V
IC
IB = 10
0.5
TA = 150°C
hFE, DC CURRENT GAIN
-VCE(SAT), COLLECTOR TO EMITTER
SATURATION VOLTAGE (V)
IC = 300mA
IC = 10mA
0
0.001
30
0.6
1.4
0.4
0.3
TA = 150°C
TA = 25°C
0.2
0.1
0
100
TA = 25°C
TA = -50°C
10
TA = -50°C
1
1
10
1,000
100
-IC, COLLECTOR CURRENT (mA)
Fig. 4 Collector Emitter Saturation Voltage vs. Collector Current
HBDM60V600W
Document number: DS30701 Rev. 5 - 2
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1,000
10
100
-IC, COLLECTOR CURRENT (mA)
Fig. 5 Typical DC Current Gain vs. Collector Current
July 2008
1
© Diodes Incorporated
HBDM60V600W
1,000
VCE = 5V
0.9
fT, GAIN BANDWIDTH PRODUCT (MHz)
-VBE(ON), BASE EMITTER VOLTAGE (V)
1.0
TA = -50°C
0.8
0.7
100
0.6
TA = 25°C
0.5
0.4
T A = 150°C
0.3
0.2
0.1
10
1
1
10
100
-IC, COLLECTOR CURRENT (mA)
Fig. 6 Typical Base Emitter Voltage vs. Collector Current
1
10
100
-IC, COLLECTOR CURRENT (mA)
Fig. 7 Typical Gain Bandwidth Product vs. Collector Current
NPN (MMBTA06) Transistor (Q2) Plots
2.0
VCE, COLLECTOR EMITTER VOLTAGE (V)
ICBO, COLLECTOR-BASE CURRENT (nA)
10
1
0.1
50
75
100
125
TA, AMBIENT TEMPERATURE (ºC)
Fig. 8 Typical Collector-Cutoff Current vs. Ambient Temperature
1.4
IC = 30mA
1.2
IC = 10mA
1.0
0.8
0.6
IC = 100mA
0.4
IC = 1mA
0.2
1
0.1
10
100
IB, BASE CURRENT (mA)
Fig. 9 Typical Collector Saturation Region
0.01
10,000
IC
IB = 10
0.450
0.400
hFE, DC CURRENT GAIN
VCE(SAT), COLLECTOR TO EMITTER
SATURATION VOLTAGE (V)
1.6
0
0.001
0.01
25
0.500
1.8
0.350
0.300
TA = 25°C
0.250
T A = 150°C
0.200
0.150
1,000
100
10
0.100
0.050
TA = -50°C
0
1,000
10
100
IC, COLLECTOR CURRENT (mA)
Fig. 10 Typical Collector Emitter Saturation Voltage vs. Collector Current
1
HBDM60V600W
Document number: DS30701 Rev. 5 - 2
4 of 7
www.diodes.com
1
1
10
1,000
100
IC, COLLECTOR CURRENT (mA)
Fig. 11 Typical DC Current Gain vs. Collector Current
July 2008
© Diodes Incorporated
HBDM60V600W
1,000
0.9
fT, GAIN BANDWIDTH PRODUCT (MHz)
VBE(ON), BASE EMITTER VOLTAGE (V)
1.0
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.1
100
10
1
1
100
1
10
IC, COLLECTOR CURRENT (mA)
Fig. 12 Typical Base Emitter Voltage vs. Collector Current
10
IC, COLLECTOR CURRENT (mA)
Fig. 13 Typical Gain Bandwidth Product vs. Collector Current
Current Schematic along with Application Example:
9V-12V
36
R1
HBDM60V600W
HBDM60V600W
EQ1
MMBT2907A
R3
MMBT2907A
C1
Q1
D1
D2
BQ1
Q1
BQ1
0
Q4
Q3
Half H-Bridge
Motor
Half H-Bridge
CQ2
R5
1k
R4
CQ1
CQ1
CQ2
M MB TA0 6
R8
M MB TA0 6
Q2
D3
C2
D4
BQ2
1k
Q2
BQ2
EQ2
Reverse
Forward
0
Note:
D1, D2, D3, D4: Switching Diodes (MMBD4448)
Q3, Q4: NPN Transistors (MMBTA06)
HBDM60V600W
Document number: DS30701 Rev. 5 - 2
5 of 7
www.diodes.com
July 2008
© Diodes Incorporated
HBDM60V600W
Application Example Schematic: (with Package Pinouts)
9V-12V
R1
36
C1
U1
A1
1
NC
C2
6
2
5
3
4
33k
NC
R3
A2
MMBD4448DW
R4
BQ2
470
CQ2
1
2
U2
BQ1
BQ2
U4
BQ1
6
5
CQ2
Motor
CQ1
EQ1
EQ2
3
4
HBDM60V600W
Q1
R6
R2
C1
1
6
2
5
3
4
CQ1
EQ1
EQ2
470
U3
EQ1
BQ2 1
CQ2 2
3
INV5V0W
HBDM60V600W
C2
CQ1
6 BQ1
5 EQ2
4
R5
U5
A1
1
A2
2
A3
3
1k
6
C1
C2
1k
5
4
C3
MMBD4448HTW
Reverse
Forward
Control Input 5V/0V
Ordering Information
(Note 5)
Part Number
HBDM60V600W-7
Notes:
Case
SOT-363
Packaging
3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
YM
Marking Information
HB01
Date Code Key
Year
Code
Month
Code
2006
T
Jan
1
2007
U
Feb
2
HBDM60V600W
Document number: DS30701 Rev. 5 - 2
2008
V
Mar
3
2009
W
Apr
4
May
5
HB01 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: T = 2006)
M = Month (ex: 9 = September)
2010
X
Jun
6
6 of 7
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2011
Y
Jul
7
2012
Z
Aug
8
2013
A
Sep
9
2014
B
Oct
O
Nov
N
2015
C
Dec
D
July 2008
© Diodes Incorporated
HBDM60V600W
Package Outline Dimensions
A
SOT-363
Dim
Min
Max
A
0.10
0.30
B
1.15
1.35
C
2.00
2.20
D
0.65 Typ
F
0.40
0.45
H
1.80
2.20
J
0
0.10
K
0.90
1.00
L
0.25
0.40
M
0.10
0.22
0°
8°
α
All Dimensions in mm
B C
H
K
M
J
D
F
L
Suggested Pad Layout
E
Z
E
C
G
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C
1.9
E
0.65
Y
X
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
HBDM60V600W
Document number: DS30701 Rev. 5 - 2
7 of 7
www.diodes.com
July 2008
© Diodes Incorporated