ONSEMI TIP131G

TIP131, TIP132 (NPN),
TIP137 (PNP)
Preferred Devices
Darlington Complementary
Silicon Power Transistors
Designed for general−purpose amplifier and low−speed switching
applications.
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Features
DARLINGTON 8 AMPERE
COMPLEMENTARY SILICON
POWER TRANSISTORS
80−100 VOLTS, 70 WATTS
• High DC Current Gain −
•
•
•
•
hFE = 2500 (Typ) @ IC
= 4.0 Adc
Collector−Emitter Sustaining Voltage − @ 30 mAdc
VCEO(sus) = 80 Vdc (Min) − TIP131
= 100 Vdc (Min) − TIP132, TIP137
Low Collector−Emitter Saturation Voltage −
VCE(sat) = 2.0 Vdc (Max) @ IC = 4.0 Adc
= 3.0 Vdc (Max) @ IC = 6.0 Adc
Monolithic Construction with Built−In Base−Emitter Shunt Resistors
Pb−Free Packages are Available*
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MARKING
DIAGRAM
4
TO−220AB
CASE 221A
STYLE 1
MAXIMUM RATINGS
Symbol
TIP131
TIP132
TIP137
Unit
VCEO
80
100
Vdc
Collector−Base Voltage
VCB
80
100
Vdc
Emitter−Base Voltage
VEB
5.0
Vdc
IC
8.0
12
Adc
Base Current
IB
300
mAdc
Total Power Dissipation @ TC = 25_C
PD
70
W
Total Power Dissipation @ TA = 25_C
PD
2.0
W
TJ, Tstg
– 65 to + 150
_C
Rating
Collector−Emitter Voltage
Collector Current − Continuous
Peak
Operating and Storage Junction,
Temperature Range
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance,
Junction−to−Case
RqJC
1.78
_C/W
Thermal Resistance,
Junction−to−Ambient
RqJA
63.5
_C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1
2
TIP13xG
AYWW
3
TIP13x
x
A
Y
WW
G
= Device Code
= 1, 2, or 7
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
TIP131
TIP131G
TIP132
TIP132G
TIP137
TIP137G
Package
Shipping
TO−220
50 Units/Rail
TO−220
(Pb−Free)
50 Units/Rail
TO−220
50 Units/Rail
TO−220
(Pb−Free)
50 Units/Rail
TO−220
50 Units/Rail
TO−220
(Pb−Free)
50 Units/Rail
Preferred devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 1
1
Publication Order Number:
TIP131/D
TIP131, TIP132 (NPN), TIP137 (PNP)
COLLECTOR
PNP
TIP137
COLLECTOR
NPN
TIP131
TIP132
BASE
BASE
≈ 8.0 k
≈ 8.0 k
≈ 120
≈ 120
EMITTER
EMITTER
Figure 1. Darlington Circuit Schematic
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ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted)
Characteristic
Symbol
Min
Max
80
100
−
−
−
−
0.5
0.5
−
−
0.2
0.2
−
5.0
500
1000
−
15000
−
−
2.0
3.0
−
2.5
Unit
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (Note 1)
(IC = 30 mAdc, IB = 0)
VCEO(sus)
TIP131
TIP132, TIP137
Collector Cutoff Current
(VCE = 40 Vdc, IB = 0)
(VCE = 50 Vdc, IB = 0)
TIP131
TIP132, TIP137
Collector Cutoff Current
(VCB = 80 Vdc, IE = 0)
(VCB = 100 Vdc, IE = 0)
TIP131
TIP132, TIP137
Vdc
ICEO
mAdc
ICBO
Emitter Cutoff Current
(VBE = 5.0 Vdc, IC = 0)
IEBO
mAdc
mAdc
ON CHARACTERISTICS (Note 1)
DC Current Gain
(IC = 1.0 Adc, VCE = 4.0 Vdc)
(IC = 4.0 Adc, VCE = 4.0 Vdc)
hFE
Collector−Emitter Saturation Voltage
(IC = 4.0 Adc, IB = 16 mAdc)
(IC = 6.0 Adc, IB = 30 mAdc)
VCE(sat)
Base−Emitter On Voltage
(IC = 4.0 Adc, VCE = 4.0 Vdc)
VBE(on)
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
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2
−
Vdc
Vdc
TIP131, TIP132 (NPN), TIP137 (PNP)
PD, POWER DISSIPATION (WATTS)
TA TC
4.0 80
3.0 60
TC
2.0 40
TA
1.0 20
0
0
0
20
40
60
80
100
T, TEMPERATURE (°C)
120
140
160
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
Figure 2. Power Derating
1.0
0.7
0.5
D = 0.5
0.3
0.2
0.2
0.1
0.1
0.07
0.05
0.05
0.02
0.03
0.02
P(pk)
ZqJC(t) = r(t) RqJC
RqJC = 1.78°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
t1
READ TIME AT t1
t2
TJ(pk) − TC = P(pk) ZqJC(t)
DUTY CYCLE, D = t1/t2
0.01
0.01
0.01
SINGLE PULSE
0.02
0.05
0.1
0.2
0.5
1.0
2.0
5.0
t, TIME (ms)
10
Figure 3. Thermal Response
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3
20
50
100
200
500 1.0 k
TIP131, TIP132 (NPN), TIP137 (PNP)
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AA
−T−
B
SEATING
PLANE
C
F
T
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
1 2 3
U
H
K
Z
L
R
V
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.147
0.095
0.105
0.110
0.155
0.018
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
−−−
−−− 0.080
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
3.73
2.42
2.66
2.80
3.93
0.46
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
−−−
−−−
2.04
BASE
COLLECTOR
EMITTER
COLLECTOR
ON Semiconductor and
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TIP131/D