Order this document by MC33076/D DUAL HIGH OUTPUT CURRENT OPERATIONAL AMPLIFIER The MC33076 operational amplifier employs bipolar technology with innovative high performance concepts for audio and industrial applications. This device uses high frequency PNP input transistors to improve frequency response. In addition, the amplifier provides high output current drive capability while minimizing the drain current. The all NPN output stage exhibits no deadband crossover distortion, large output voltage swing, excellent phase and gain margins, low open loop high frequency output impedance and symmetrical source and sink AC frequency performance. The MC33076 is tested over the automotive temperature range and is available in an 8–pin SOIC package (D suffix) and in both the standard 8 pin DIP and 16–pin DIP packages for high power applications. • 100 Ω Output Drive Capability • • • • • • • SEMICONDUCTOR TECHNICAL DATA 8 8 1 1 D SUFFIX PLASTIC PACKAGE CASE 751 (SO–8) P1 SUFFIX PLASTIC PACKAGE CASE 626 Large Output Voltage Swing PIN CONNECTIONS Low Total Harmonic Distortion High Gain Bandwidth: 7.4 MHz Output 1 High Slew Rate: 2.6 V/µs Dual Supply Operation: ±2.0 V to ±18 V Inputs 1 8 VCC 2 7 Output 2 3 High Output Current: ISC = 250 mA typ VEE Similar Performance to MC33178 1 – +1 4 – 6 2 + 5 Inputs 2 (8 Pin Pkg, Top View) Equivalent Circuit Schematic (Each Amplifier) P2 SUFFIX PLASTIC PACKAGE CASE 648C DIP (12+2+2) 16 1 VCC PIN CONNECTIONS 1 Inputs 1 Iref NC VEE Vin+ CC CM Output 1 15 NC 3 14 VCC 4 13 5 12 6 11 NC 10 NC 9 Output 2 2 Iref Vin– 16 – + 1 NC Vout 7 + – 2 Inputs 2 8 VEE (16 Pin Pkg, Top View) ORDERING INFORMATION Device VEE MC33076D MC33076P1 MC33076P2 Operating Temperature Range TA = – 40° to + 85°C Motorola, Inc. 1996 MOTOROLA ANALOG IC DEVICE DATA Package SO–8 Plastic DIP Power Plastic Rev 0 1 MC33076 MAXIMUM RATINGS Symbol Value Unit Power Supply Voltage (Note 2) Rating VCC to VEE +36 V Input Differential Voltage Range VIDR (Note 1) V Input Voltage Range VIR (Note 1) V Output Short Circuit Duration (Note 2) tSC 5.0 sec Maximum Junction Temperature TJ +150 °C Storage Temperature Tstg –60 to +150 °C Maximum Power Dissipation PD (Note 2) mW NOTES: 1. Either or both input voltages should not exceed VCC or VEE. 2. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded (see power dissipation performance characteristic, Figure 1). See applications section for further information. DC ELECTRICAL CHARACTERICISTICS (VCC = +15 V, VEE = –15 V, TA = 25°C, unless otherwise noted.) Characteristics Input Offset Voltage (RS = 50 Ω, VCM = 0 V) (VS = ±2.5 V to ±15 V) TA = +25°C TA = –40° to +85°C Figure Symbol 2 |VIO| Large Signal Voltage Gain (VO = –10 V to +10 V) (TA = +25°C) RL = 100 Ω RL = 600 Ω (TA = –40° to +85°C) RL = 600 Ω Output Voltage Swing (VID = ±1.0 V) (VCC = +15 V, VEE = –15 V) RL = 100 Ω RL = 100 Ω RL = 600 Ω RL = 600 Ω (VCC = +2.5 V, VEE = –2.5 V) RL = 100 Ω RL = 100 Ω 3, 4 0.5 0.5 µV/°C — 2.0 — — — 100 — 500 600 — — 5.0 — 70 100 –13 –14 +14 13 nA |IIO| 5 6 VICR Unit 4.0 5.0 IIB nA V AVOL kV/V 25 50 — 200 — — 25 — — 7, 8, 9 V VO+ VO– VO+ VO– 10 — 13 — +11.7 –11.7 +13.8 –13.8 — –10 — –13 VO+ VO– 1.2 — +1.66 –1.74 — –1.2 80 116 — 80 120 — Common Mode Rejection (Vin = ±13 V) 10 CMR Power Supply Rejection (VCC/VEE = +15 V/–15 V, +5.0 V/–15 V, +15 V/–5.0 V) 11 PSR 2 Max ∆VIO/∆T Input Offset Current (VCM = 0 V) TA = +25°C TA = –40° to +85°C Common Mode Input Voltage Range Typ mV — — Input Offset Voltage Temperature Coefficient (RS = 50 Ω, VCM = 0 V) TA = –40° to +85°C Input Bias Current (VCM = 0 V) TA = +25°C TA = –40° to +85°C Min dB dB MOTOROLA ANALOG IC DEVICE DATA MC33076 DC ELECTRICAL CHARACTERICISTICS (VCC = +15 V, VEE = –15 V, TA = 25°C, unless otherwise noted.) Characteristics Output Short Circuit Current (VID = ±1.0 V Output to Gnd) (VCC = +15 V, VEE = –15 V) Source Sink (VCC = +2.5 V, VEE = –2.5 V) Source Sink Power Supply Current per Amplifier (VO = 0 V) (VS = ±2.5 V to ±15 V) TA = +25°C TA = –40° to +85°C Figure Symbol 12, 13 ISC 14 Min Typ Max Unit mA 190 — +250 –280 — –215 63 — +94 –80 — –46 ID mA — — 2.2 — 2.8 3.3 AC ELECTRICAL CHARACTERICISTICS (VCC = +15 V, VEE = –15 V, TA = 25°C, unless otherwise noted.) Figure Symbol Min Typ Max Unit Slew Rate (Vin = –10 V to +10 V, RL = 100 Ω, CL = 100 pF, AV = +1) 15 SR 1.2 2.6 — V/µs Gain Bandwidth Product (f = 20 kHz) 16 GBW 4.0 7.4 — MHz Unity Gain Frequency (Open Loop) (RL = 600 Ω, CL = 0 pF) — fU — 3.5 — MHz Gain Margin (RL = 600 Ω, CL = 0 pF) 19, 20 Am — 15 — dB Phase Margin (RL = 600 Ω, CL = 0 pF) 19, 20 ∅m — 52 — Deg Characteristics Channel Separation (f = 100 Hz to 20 kHz) 21 CS — –120 — dB Power Bandwidth (VO = 20 Vpp, RL = 600 Ω, THD ≤ 1%) — BWp — 32 — kHz Total Harmonic Distortion (RL = 600 Ω, VO = 2.0 Vpp, AV = +1) f = 1.0 kHz f = 10 kHz f = 20 kHz 22 THD — — — 0.0027 0.011 0.022 — — — Open Loop Output Impedance (VO = 0 V, f = 2.5 MHz, AV = 10) 23 |ZO| — 75 — Ω Differential Input Resistance (VCM = 0 V) — Rin — 200 — kΩ Differential Input Capacitance (VCM = 0 V) — Cin — 10 — pF Equivalent Input Noise Voltage (RS = 100 Ω) f = 10 Hz f = 1.0 kHz 24 en — — 7.5 5.0 — Equivalent Input Noise Current f = 10 Hz f = 1.0 kHz — — — 0.33 0.15 — — MOTOROLA ANALOG IC DEVICE DATA % nV/√Hz in pA/√Hz 3 MC33076 Figure 2. Distribution of Input Offset Voltage 4000 25 PERCENTAGE OF AMPLIFIERS (%) PD , MAXIMUM POWER DISSIPATION (mW) Figure 1. Maximum Power Dissipation versus Temperature See Application Section for Further Information 3500 3000 MC33076P2 2500 2000 MC33076P1 1500 1000 500 0 –60 MC33076D –30 0 30 60 90 TA, AMBIENT TEMPERATURE (°C) 120 20 15 10 5 0 –2.0 150 180 amplifiers tested from 3 wafer lots VCC = ±15 V TA = 25°C (Plastic DIP package) –1.5 –1.0 –0.5 0 0.5 1.0 1.5 VIO, INPUT OFFSET VOLTAGE (mV) Figure 3. Input Bias Current versus Common Mode Voltage I IB , INPUT BIAS CURRENT (nA) I IB , INPUT BIAS CURRENT (nA) 150 VCC = +15 V VEE = –15 V TA = 25°C 225 200 175 150 125 –10 –5.0 0 5.0 10 137 125 112 100 75 –55 15 VCC = +15 V VEE = –15 V VCM = 0 V 88 –25 VCM, COMMON MODE VOLTAGE (V) AVOL, OPEN LOOP VOLTAGE GAIN (dB) VCC = + 5.0 V to +18 V VEE = – 5.0 V to –18 V ∆VIO = 5.0 mV VCC–0.50 VCC–0.75 VCC–1.0 VEE+0.25 VEE+0.125 4 –25 5.0 35 65 TA, TEMPERATURE (°C) 35 65 95 125 Figure 6. Open Loop Voltage Gain versus Temperature VCC VCC–0.25 5.0 TA, AMBIENT TEMPERATURE (°C) Figure 5. Input Common Mode Voltage Range versus Temperature VEE –55 2.5 Figure 4. Input Bias Current versus Temperature 250 100 –15 2.0 95 125 120 115 RL = 2.0 kΩ 110 105 100 95 90 –55 VCC = +15 V VEE = –15 V f = 10 Hz ∆VO = –10 to +10 V –25 RL = 100 Ω 5.0 35 65 TA, AMBIENT TEMPERATURE (°C) 95 125 MOTOROLA ANALOG IC DEVICE DATA MC33076 Figure 7. Output Voltage Swing versus Supply Voltage Figure 8. Maximum Peak–to–Peak Output Voltage Swing versus Load Resistance 30 VO , OUTPUT VOLTAGE SWING (Vpp) VO, OUTPUT VOLTAGE (Vpp ) 40 35 30 RL = 10 kΩ TA = 25°C 25 RL = 100 Ω 20 15 10 5.0 0 TA = 25°C f = 1.0 kHz 25 20 15 10 VS = ± 5.0 V 5.0 0 0 5.0 10 15 20 VCC, |VEE|, SUPPLY VOLTAGE (V) 25 10 Figure 9. Output Voltage versus Frequency CMR, COMMON MODE REJECTION (dB) 15 VCC = +15 V VEE = –15 V RL = 100 Ω AV = +1.0 THD = ≤ 1.0% TA = 25°C 5.0 1.0 k 10 k f, FREQUENCY (Hz) 100 k 100 80 +PSR 60 40 VCC = +15 V VEE = –15 V ∆VCC = ±1.5 V TA = – 55° to +125°C –PSR 0 10 100 80 60 40 VCC = +15 V VEE = –15 V VCM = 0 V ∆VCM = ±1.5 V TA = – 55° to +125°C 20 1.0 M Figure 11. Power Supply Rejection versus Frequency Over Temperature 20 10 k 0 0 100 100 1.0 k 10 k 100 k f, FREQUENCY (Hz) MOTOROLA ANALOG IC DEVICE DATA 1.0 M 10 M 10 |I SC |, OUTPUT SHORT CIRCUIT CURRENT (mA) VO, OUTPUT VOLTAGE (Vpp ) 20 10 100 1.0 k RL, LOAD RESISTANCE TO GROUND (Ω) Figure 10. Common Mode Rejection versus Frequency Over Temperature 25 PSR, POWER SUPPLY REJECTION (dB) VS = ±15 V 100 1.0 k 10 k f, FREQUENCY (Hz) 100 k 1.0 M Figure 12. Output Short Circuit Current versus Output Voltage 300 250 Sink 200 Source 150 100 VCC = +15 V VEE = –15 V VID = ±1.0 V 50 0 0 3.0 6.0 9.0 |VO|, OUTPUT VOLTAGE (V) 12 15 5 MC33076 Figure 14. Supply Current versus Supply Voltage with No Load 5.0 I D, SUPPLY CURRENT/AMPLIFIER (mA) 320 300 Sink 280 260 240 220 200 180 –55 Source VCC = +15 V VEE = –15 V VID = ±1.0 V RL < 10 Ω –25 5.0 35 65 TA, AMBIENT TEMPERATURE (°C) 95 4.0 TA = +125°C 3.0 TA = + 25°C 2.0 TA = – 55°C 1.0 0 125 0 3.0 3.0 SR, SLEW RATE (V/µS) 2.5 2.0 1.5 ∆Vin 1.0 0.5 0 –55 VCC = +15 V VEE = –15 V ∆Vin = 20 Vpp –25 +– 100Ω 5.0 35 65 TA, AMBIENT TEMPERATURE (°C) 100pF 95 8.0 7.5 7.0 6.5 6.0 5.5 –55 125 2 B 120 160 1 B 200 –10 –30 –50 100 k 6 1A) Phase, VS = ±18 V 2A) Phase, VS = ±1.5 V 1B) Gain, VS = ±18 V 2B) Gain, VS = ±1.5 V 1.0 M f, FREQUENCY (Hz) 240 10 M 280 30 M AV, VOLTAGE GAIN (dB) 10 1 A ∅, EXCESS PHASE (DEGREES) A V, VOLTAGE GAIN (dB) 2 A VCC = +15 V VEE = –15 V f = 100 Hz RL = 100 Ω CL = 0 pF –25 5.0 35 65 TA, AMBIENT TEMPERATURE (°C) 95 125 Figure 18. Voltage Gain and Phase versus Frequency 80 30 18 8.5 Figure 17. Voltage Gain and Phase versus Frequency 50 15 Figure 16. Gain Bandwidth Product versus Temperature GBW, GAIN BANDWIDTH PRODUCT (MHz) Figure 15. Slew Rate versus Temperature 6.0 9.0 12 VCC |VEE|, SUPPLY VOLTAGE (V) 50 80 30 120 10 160 –10 –30 1B 1A) Phase, (R = 100 Ω) 2A) Phase, (R = 100 Ω, C = 300 pF) 1B) Gain, (R = 100 Ω) 2B) Gain, (R = 100 Ω, C = 300 pF) –50 100 k 1.0 M 2B 2 A 10 M 1 A 200 240 ∅ , EXCESS PHASE (DEGREES) |I SC |, OUTPUT SHORT CIRCUIT CURRENT (mA) Figure 13. Output Short Circuit Current versus Temperature 280 30 M f, FREQEUNCY (Hz) MOTOROLA ANALOG IC DEVICE DATA MC33076 12 Gain Margin 40 30 20 8.0 Phase Margin 4.0 10 0 2.0 k 4.0 k 6.0 k 8.0 k 10 k RT, DIFFERENTIAL SOURCE RESISTANCE (Ω) ∅ m, PHASE MARGIN (DEGREES) 16 0 60 50 VCC = +15 V VEE = –15 V RT = R1 + R2 VO = 0 V TA = 25°C ∅ m, PHASE MARGIN (DEGREES) A m , GAIN MARGIN (dB) 20 Figure 20. Open Loop Gain Margin and Phase Margin versus Output Load Capacitance 16 VCC = +15 V VEE = –15 V VO = 0 V 50 10 30 8.0 Phase Margin 0 2.0 0 THD, TOTAL HARMONIC DISTORTION (%) 100 Drive Channel VCC = +15 V VEE = –15 V RL = 100 Ω TA = 25°C 100 k 1.0 M Figure 23. Output Impedance versus Frequency ZO , OUTPUT IMPEDANCE ( Ω ) 100 VCC = +15 V VEE = –15 V VCM = 0 V VO = 0 V TA = 25°C 80 60 40 AV = 1000 20 AV = 100 0 10 k AV = 10 AV = 1.0 100 k 1.0 M f, FREQUENCY (Hz) MOTOROLA ANALOG IC DEVICE DATA 10 M e n , INPUT REFERRED NOISE VOLTAGE (NV/ √Hz) CS, CHANNEL SEPARATION (dB) 110 10 k f, FREQUENCY (Hz) 400 800 1200 1600 0 2000 Figure 22. Total Harmonic Distortion versus Frequency 120 1.0 k 4.0 Gain Margin 10 CL, OUTPUT LOAD CAPACITANCE (pF) 130 70 100 6.0 20 0 12 k 140 80 12 40 Figure 21. Channel Separation versus Frequency 90 14 A m , OPEN LOOP GAIN MARGIN (dB) Figure 19. Phase Margin and Gain Margin versus Differential Source Resistance 3.0 2.5 2.0 VCC = +15 V VEE = –15 V RL = 100 Ω VO = 2.0 Vpp TA = 25°C 1.5 AV = +10 1.0 AV = +1000 0.5 AV = +100 0 10 AV = +1 100 1.0 k f, FREQUENCY (Hz) 10 k 100 k Figure 24. Input Referred Noise Voltage versus Frequency 20 16 VCC = +15 V VEE = –15 V TA = 25°C 12 + – VO Input Noise Voltage Test Circuit 8.0 4.0 0 10 100 1.0 k f, FREQUENCY (Hz) 10 k 100 k 7 MC33076 Figure 25. Percent Overshoot versus Load Capacitance Figure 26. PC Board Heatsink Example os, PERCENT OVERSHOOT (%) 100 80 VCC = +15 V VEE = –15 V TA = 25°C Copper Pad Copper Pad 60 RL = 2.0 kΩ 40 20 0 10 RL = 100 Ω 100 1000 CL, LOAD CAPACITANCE (pF) 10 k APPLICATIONS INFORMATION The MC33076 dual operational amplifier is available in the standard 8–pin plastic dual–in–line (DIP) and surface mount packages, and also in a 16–pin batwing power package. To enhance the power dissipation capability of the power package, Pins 4, 5, 12, and 13 are tied together on the leadframe, giving it an ambient thermal resistance of 52°C/W 8 typically, in still air. The junction–to–ambient thermal resistance (RθJA) can be decreased further by using a copper padb on the printed circuit board (as shown in Figure 26) to draw the heat away from the package. Care must be taken not to exceed the maximum junction temperature or damage to the device may occur. MOTOROLA ANALOG IC DEVICE DATA MC33076 OUTLINE DIMENSIONS D SUFFIX PLASTIC PACKAGE CASE 751–05 (SO–8) ISSUE R D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. C 8 5 0.25 H E B M M 1 4 h B X 45 _ q e DIM A A1 B C D E e H h L A C SEATING PLANE L 0.10 A1 B 0.25 M C B A S S q MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.18 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ P1 SUFFIX PLASTIC PACKAGE CASE 626–05 ISSUE K 8 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5 –B– 1 4 F –A– NOTE 2 L C J –T– MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC ––– 10_ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC ––– 10_ 0.030 0.040 N SEATING PLANE D H DIM A B C D F G H J K L M N M K G 0.13 (0.005) MOTOROLA ANALOG IC DEVICE DATA M T A M B M 9 MC33076 OUTLINE DIMENSIONS P2 SUFFIX PLASTIC PACKAGE CASE 648C–03 (DIP (12+2+2)) ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. INTERNAL LEAD CONNECTION BETWEEN 4 AND 5, 12 AND 13. –A– 16 9 1 8 –B– L NOTE 5 C –T– F E J G D 16 PL 0.13 (0.005) 10 M N SEATING PLANE 16 PL 0.13 (0.005) M T A M T B DIM A B C D E F G J K L M N INCHES MIN MAX 0.740 0.840 0.240 0.260 0.145 0.185 0.015 0.021 0.050 BSC 0.040 0.70 0.100 BSC 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.040 MILLIMETERS MIN MAX 18.80 21.34 6.10 6.60 3.69 4.69 0.38 0.53 1.27 BSC 1.02 1.78 2.54 BSC 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01 S S MOTOROLA ANALOG IC DEVICE DATA MC33076 Motorola reserves the right to make changes without further notice to any products herein. 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MOTOROLA ANALOG IC DEVICE DATA 11 MC33076 How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 12 ◊ *MC33076/D* MOTOROLA ANALOG IC DEVICE DATA MC33076/D