NL17SZ16 Single Input Buffer The NL17SZ16 is a single input Buffer in two tiny footprint packages. The device performs much as LCX multi−gate products in speed and drive. Features • • • • • • http://onsemi.com Tiny SOT−353 and SOT−553 Packages Source/Sink 24 mA at 3.0 Volts Over−Voltage Tolerant Inputs and Outputs Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation Pb−Free Packages are Available MARKING DIAGRAMS 5 5 LRd 1 SOT−353/SC70−5/SC−88A DF SUFFIX CASE 419A 1 d = Date Code 5 5 NC 1 A 2 GND 3 5 VCC 1 LR = Device Marking D = One Digit Date Code 4 Y PIN ASSIGNMENT Figure 1. Pinout (Top View) A LR D 1 SOT−553 XV5 SUFFIX CASE 463B 1 Y Pin Function 1 NC 2 IN A 3 GND 4 OUT Y 5 VCC Figure 2. Logic Symbol FUNCTION TABLE A Input Y Output L L H H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 5 1 Publication Order Number: NL17SZ16/D NL17SZ16 MAXIMUM RATINGS Symbol VCC Parameter Value Unit 0.5 to 7.0 V Output in High or Low State (Note 2) 0.5 VI 7.0 V VI < GND 0.5 VO 7.0 V VO < GND 50 mA DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current 50 mA IOUT DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground per Supply Pin 100 mA TSTG Storage Temperature Range 65 to 150 °C 260 °C 150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias JA Thermal Resistance SOT−353 SOT−553 350 360 °C/W PD Power Dissipation in Still Air at 85°C SOT−353 SOT−553 150 180 mW MSL Moisture Sensitivity FR Flammability Rating ESD ESD Classification ILatchup Latchup Performance Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) Above VCC and Below GND at 85°C (Note 6) Class IC Class A N/A V 500 mA Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. IO Absolute Maximum Rating Must be Obtained. 3. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 4. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage VOUT Operations Only Data Retention DC Output Voltage TA Operating Temperature Range tr, tf Input Rise and Fall Time VCC = 2.5 V 0.2 V VCC = 3.0 V 0.3 V VCC = 5.0 V 0.5 V http://onsemi.com 2 Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V 40 85 °C 0 0 0 20 10 5 ns/V NL17SZ16 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80°C 117.8 TJ = 90°C 1,032,200 TJ = 100°C 80 TJ = 110°C Time, Years TJ = 120°C Time, Hours FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130°C Junction Temperature °C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature DC ELECTRICAL CHARACTERISTICS Min 0.75 VCC 0.7 VCC Symbol Parameter VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIL or VIH IOH = −100 A IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VOL Low−Level Output Voltage VIN = VIH or VOH IOL = 100 A IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 Input Leakage Current VIN = VCC or GND IOFF Power Off−Output Leakage Current VOUT = 5.5 V ICC Quiescent Supply Current VIN = VCC or GND IIN Condition 40C TA 85C TA = 25C VCC (V) Typ Max Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 Max VCC 1.52 2.1 2.4 2.7 2.5 4.0 0.0 0.08 0.20 0.22 0.28 0.38 0.42 Unit V 1.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 V V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V 0 to 5.5 0.1 1.0 A 0 1 10 A 5.5 1 10 A AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns Symbol tPLH tPHL Parameter Propagation Delay (Figure 4 and 5) 40C TA 85C TA = 25C VCC (V) Min Typ Max Min Max Unit RL = 1 M CL = 15 pF 1.65 1.8 2.5 0.2 3.3 0.3 5.0 0.5 2.0 2.0 0.8 0.5 0.5 5.3 4.4 2.9 2.1 1.8 11.4 9.5 6.5 4.5 3.9 2.0 2.0 0.8 0.5 0.5 12 10 7.0 4.7 4.1 ns RL = 500 CL = 50 pF F 3.3 0.3 5.0 0.5 1.5 0.8 2.9 2.4 5.0 4.3 1.5 0.8 5.2 4.5 Condition http://onsemi.com 3 NL17SZ16 CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 4 pF CPD Power Dissi Dissipation ation Ca Capacitance acitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 25 30 pF F 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. tf = 3 ns tf = 3 ns 90% INPUT A and B VCC 90% 50% 50% INPUT 10% 10% OUTPUT GND RL tPHL CL tPLH VOL OUTPUT Y 50% 50% A 1−MHz square input wave is recommended for propagation delay tests. VOH Figure 4. Switching Waveform Figure 5. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator No. of Gates per Package Temp Range Identifier NL17SZ16DFT2 NL 1 NL17SZ16DFT2G NL NL17SZ16XV5T2 NL Device Order Number Technology Device Function Package Suffix Tape and Reel Suffix 7 SZ 16 DF 1 7 SZ 16 1 7 SZ 16 Package Type Tape and Reel Size† T2 SOT−353/ SC70−5/ SC−88A 178 mm, 3000 Unit DF T2 SOT−353/ SC70−5/ SC−88A (Pb−Free) 178 mm, 3000 Unit XV5 T2 SOT−553* 178 mm, 4000 Unit †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *All Devices in Package SOT553 are Inherently Pb−Free. http://onsemi.com 4 NL17SZ16 PACKAGE DIMENSIONS SOT−353 DF SUFFIX 5−LEAD PACKAGE CASE 419A−02 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ16 PACKAGE DIMENSIONS SOT−553 XV5 SUFFIX 5−LEAD PACKAGE CASE 463B−01 ISSUE A A −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. C K 4 1 2 B −Y− 3 D G S DIM A B C D G J K S J 5 PL 0.08 (0.003) M X Y MILLIMETERS MIN MAX 1.50 1.70 1.10 1.30 0.50 0.60 0.17 0.27 0.50 BSC 0.08 0.18 0.10 0.30 1.50 1.70 STYLE 1: PIN 1. 2. 3. 4. 5. INCHES MIN MAX 0.059 0.067 0.043 0.051 0.020 0.024 0.007 0.011 0.020 BSC 0.003 0.007 0.004 0.012 0.059 0.067 BASE 1 EMITTER 1/2 BASE 2 COLLECTOR 2 COLLECTOR 1 STYLE 2: PIN 1. 2. 3. 4. 5. CATHODE ANODE CATHODE CATHODE CATHODE SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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