ONSEMI MC10EP016

MC10EP016, MC100EP016
3.3V / 5VECL 8−Bit
Synchronous Binary
Up Counter
The MC10/100EP016 is a high−speed synchronous, presettable,
cascadeable 8−bit binary counter. Architecture and operation are the
same as the MC10E016 in the ECLinPS™ family.
The counter features internal feedback to TC gated by the TCLD
(Terminal Count Load) pin. When TCLD is LOW (or left open, in
which case it is pulled LOW by the internal pulldowns), the TC
feedback is disabled, and counting proceeds continuously, with TC
going LOW to indicate an all−one state. When TCLD is HIGH, the TC
feedback causes the counter to automatically reload upon TC = LOW,
thus functioning as a programmable counter. The Qn outputs do not
need to be terminated for the count function to operate properly. To
minimize noise and power, unused Q outputs should be left
unterminated.
COUT and COUT provide differential outputs from a single,
non−cascaded counter or divider application. COUT and COUT
should not be used in cascade configuration. Only TC should be used
for a counter or divider cascade chain output.
A differential clock input has also been added to improve
performance.
The 100 Series contains temperature compensation.
• 500 ps Typical Propagation Delay
• PECL Mode Operating Range: VCC = 3.0 V to 5.5 V
with VEE = 0 V
• NECL Mode Operating Range: VCC = 0 V
with VEE = −3.0 V to −5.5 V
• Open Input Default State
• Safety Clamp on Inputs
• Internal TC Feedback (Gated)
• Addition of COUT and COUT
• 8−Bit
• Differential Clock Input
• VBB Output
• Fully Synchronous Counting and TC Generation
• Asynchronous Master Reset
• Pb−Free Packages are Available*
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MARKING
DIAGRAM*
MCxxx
EP016
AWLYYWWG
LQFP−32
FA SUFFIX
CASE 873A
xxx
A
WL
YY
WW
G
= 10 or 100
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 11
1
Publication Order Number:
MC10EP016/D
MC10EP016, MC100EP016
VBB CLK CLK P0
24
23
22
21
P1
P2
P3
P4
20
19
18
17
Table 1. PIN DESCRIPTION
PIN
FUNCTION
P0−P7*
ECL Parallel Data (Preset) Inputs
PE
25
16
P5
CE
26
15
P6
Q0−Q7
ECL Data Outputs
MR
27
14
P7
CE*
ECL Count Enable Control Input
VEE
28
13
VCC
PE*
ECL Parallel Load Enable Control Input
Q0
29
12
TC
Q1
30
11
COUT
Q2
31
10
VCC
32
9
MC10EP016
MC100EP016
1
2
3
4
5
6
7
MR*
ECL Master Reset
CLK*, CLK*
ECL Differential Clock
TC
ECL Terminal Count Output
TCLD*
COUT COUT, COUT
VEE
8
ECL TC−Load Control Input
ECL Differential Output
VCC
Positive Supply
VEE
Negative Supply
VBB
Reference Voltage Output
* Pins will default LOW when left open.
VCC Q3
Q4
Q5
Q6
Q7 TCLD VCC
Warning: All VCC and VEE pins must be externally connected to
Power Supply to guarantee proper operation.
Figure 1. 32−Lead LQFP Pinout (Top View)
Table 2. FUNCTION TABLES
CE
PE
X
L
L
H
X
X
L
H
H
H
X
X
TCLD MR
X
L
H
X
X
X
CLK
L
L
L
L
L
H
FUNCTION
Z
Z
Z
Z
ZZ
X
Load Parallel (Pn to Qn)
Continuous Count
Count; Load Parallel on TC = LOW
Hold
Masters Respond, Slaves Hold
Reset (Qn : = LOW, TC : = HIGH)
ZZ = Clock Pulse (High−to−Low)
Z = Clock Pulse (Low−to−High)
Table 3. FUNCTION TABLE
Function
PE
CE
MR
TCLD
CLK
P7−P4
P3
P2
P1
P0
Q7−Q4
Q3
Q2
Q1
Q0
TC
COUT
COUT
Load Count
L
H
H
H
H
X
L
L
L
L
L
L
L
L
L
X
L
L
L
L
Z
Z
Z
Z
Z
H
X
X
X
X
H
X
X
X
X
H
X
X
X
X
L
X
X
X
X
L
X
X
X
X
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
L
L
H
H
L
L
H
L
H
L
H
H
H
L
H
H
H
H
L
H
L
L
L
H
L
Load Hold
L
H
H
X
H
H
L
L
L
X
X
X
Z
Z
Z
H
X
X
H
X
X
H
X
X
L
X
X
L
X
X
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
H
H
H
H
H
H
L
L
L
Load on
Terminal
Count
H
H
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
H
H
H
H
H
H
Z
Z
Z
Z
Z
Z
H
H
H
H
H
H
L
L
L
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
H
H
H
H
H
H
H
H
H
L
L
H
H
H
H
H
H
L
L
H
H
H
H
L
H
L
H
L
H
L
H
H
L
H
H
H
H
H
L
H
H
H
L
L
H
L
L
L
Reset
X
X
H
X
X
X
X
X
X
X
L
L
L
L
L
H
H
L
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2
MC10EP016, MC100EP016
Q1
Q0
Q7
PE
TCLD
Q0M
MASTER Q0M SLAVE
CE
Q0
CE
CE Q
Q1 0
Q2
Q3
Q
Q5 Q4
BIT 1
BIT 0
BIT 7
6
P0
P1
P7
MR
CLK
BITS 2−6
CLK
TC
5
VBB
COUT
COUT
VEE
Note that this diagram is provided for understanding of logic operation only.
It should not be used for propagation delays as many gate functions are achieved internally without incurring a full gate delay.
Figure 2. 8-BIT Binary Counter Logic Diagram
Table 4. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
ESD Protection
N/A
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
LQFP−32
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
> 2 kV
> 100 V
> 2 kV
Pb Pkg
Pb−Free Pkg
Level 2
Level 2
UL 94 V−0 @ 0.125 in
897 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
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MC10EP016, MC100EP016
Table 5. MAXIMUM RATINGS)
Rating
Unit
VCC
PECL Mode Power Supply
Parameter
VEE = 0 V
6
V
VEE
NECL Mode Power Supply
VCC = 0 V
−6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
32 LQFP
32 LQFP
80
55
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
32 LQFP
12 to 17
°C/W
Tsol
Wave Solder
265
265
°C
Symbol
Condition 1
Condition 2
VI VCC
VI VEE
Pb
Pb−Free
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 6. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2)
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
85°C
Max
Min
Typ
Max
Unit
IEE
Power Supply Current
120
160
200
120
160
200
120
160
200
mA
VOH
Output HIGH Voltage (Note 3)
2165
2290
2415
2230
2355
2480
2290
2415
2540
mV
VOL
Output LOW Voltage (Note 3)
1365
1490
1615
1430
1555
1680
1490
1615
1740
mV
VIH
Input HIGH Voltage (Single−Ended)
2090
2415
2155
2480
2215
2540
mV
VIL
Input LOW Voltage (Single−Ended)
1365
1690
1460
1755
1490
1815
mV
VBB
Output Voltage Reference
1790
1990
1855
2055
1915
2115
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 4)
3.3
2.0
3.3
2.0
3.3
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
1890
2.0
150
0.5
1955
150
0.5
0.5
2015
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
3. All loading with 50 W to VCC − 2.0 V.
4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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MC10EP016, MC100EP016
Table 7. 10EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 5)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Power Supply Current (Note 6)
120
160
200
120
160
200
120
160
200
mA
VOH
Output HIGH Voltage (Note 7)
3865
3990
4115
3930
4055
4180
3990
4115
4240
mV
VOL
Output LOW Voltage (Note 7)
3065
3190
3315
3130
3255
3380
3190
3315
3440
mV
VIH
Input HIGH Voltage (Single−Ended)
3790
4115
3855
4180
3915
4240
mV
VIL
Input LOW Voltage (Single−Ended)
3065
3390
3130
3455
3190
3515
mV
VBB
Output Voltage Reference
3490
3690
3555
3755
3615
3815
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 8)
5.0
2.0
5.0
2.0
5.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
3590
2.0
3655
150
3715
150
0.5
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
6. Required 500 lfpm air flow when using +5 V power supply. For (VCC − VEE) >3.3 V, 5 W to 10 W in line with VEE required for maximum thermal
protection at elevated temperatures. Recommend VCC−VEE operation at 3.3 V.
7. All loading with 50 W to VCC − 2.0 V.
8. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 8. 10EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −5.5 V to −3.0 V (Note 9)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
120
160
200
120
160
200
120
160
200
mA
IEE
Power Supply Current (Note 10)
VOH
Output HIGH Voltage (Note 11)
−1135
−1010
−885
−1070
−945
−820
−1010
−885
−760
mV
VOL
Output LOW Voltage (Note 11)
−1935
−1810
−1685
−1870
−1745
−1620
−1810
−1685
−1560
mV
VIH
Input HIGH Voltage (Single−Ended)
−1210
−885
−1145
−820
−1085
−760
mV
VIL
Input LOW Voltage (Single−Ended)
−1935
−1610
−1870
−1545
−1810
−1485
mV
VBB
Output Voltage Reference
−1510
−1310
−1445
−1245
−1385
−1185
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 12)
0.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
−1410
VEE+2.0
0.0
VEE+2.0
150
0.5
−1345
0.0
VEE+2.0
150
0.5
−1285
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. Input and output parameters vary 1:1 with VCC.
10. Required 500 lfpm air flow when using −5 V power supply. For (VCC − VEE) >3.3 V, 5 W to 10 W in line with VEE required for maximum thermal
protection at elevated temperatures. Recommend VCC−VEE operation at 3.3 V.
11. All loading with 50 W to VCC − 2.0 V.
12. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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MC10EP016, MC100EP016
Table 9. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 13)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Power Supply Current
120
160
200
120
160
200
120
160
200
mA
VOH
Output HIGH Voltage (Note 14)
2155
2280
2405
2155
2280
2405
2155
2280
2405
mV
VOL
Output LOW Voltage (Note 14)
1355
1480
1605
1355
1480
1605
1355
1480
1605
mV
VIH
Input HIGH Voltage (Single−Ended)
2075
2420
2075
2420
2075
2420
mV
VIL
Input LOW Voltage (Single−Ended)
1355
1675
1355
1675
1355
1675
mV
VBB
Output Voltage Reference
1775
1975
1775
1975
1775
1975
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 15)
3.3
2.0
3.3
2.0
3.3
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
1875
2.0
1875
150
0.5
1875
150
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
13. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
14. All loading with 50 W to VCC − 2.0 V.
15. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 10. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 16)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Power Supply Current (Note 17)
120
160
200
120
160
200
120
160
200
mA
VOH
Output HIGH Voltage (Note 18)
3855
3980
4105
3855
3980
4105
3855
3980
4105
mV
VOL
Output LOW Voltage (Note 18)
3055
3180
3305
3055
3180
3305
3055
3180
3305
mV
VIH
Input HIGH Voltage (Single−Ended)
3775
4120
3775
4120
3775
4120
mV
VIL
Input LOW Voltage (Single−Ended)
3055
3375
3055
3375
3055
3375
mV
VBB
Output Voltage Reference
3475
3675
3475
3675
3475
3675
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 19)
5.0
2.0
5.0
2.0
5.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
3575
2.0
150
0.5
3575
150
0.5
0.5
3575
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
16. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
17. Required 500 lfpm air flow when using +5 V power supply. For (VCC − VEE) >3.3 V, 5 W to 10 W in line with VEE required for maximum thermal
protection at elevated temperatures. Recommend VCC−VEE operation at 3.3 V.
18. All loading with 50 W to VCC − 2.0 V.
19. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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MC10EP016, MC100EP016
Table 11. 100EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −5.5 V to −3.0 V (Note 20)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Power Supply Current (Note 21)
120
160
200
120
160
200
120
160
200
mA
VOH
Output HIGH Voltage (Note 22)
−1145
−1020
−895
−1145
−1020
−895
−1145
−1020
−895
mV
VOL
Output LOW Voltage (Note 22)
−1945
−1820
−1695
−1945
−1820
−1695
−1945
−1820
−1695
mV
VIH
Input HIGH Voltage (Single−Ended)
−1225
−880
−1225
−880
−1225
−880
mV
VIL
Input LOW Voltage (Single−Ended)
−1945
−1625
−1945
−1625
−1945
−1625
mV
VBB
Output Voltage Reference
−1525
−1325
−1525
−1325
−1525
−1325
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 23)
0.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
−1425
VEE+2.0
0.0
VEE+2.0
150
0.5
−1425
0.0
VEE+2.0
150
0.5
−1425
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
20. Input and output parameters vary 1:1 with VCC.
21. Required 500 lfpm air flow when using −5 V power supply. For (VCC − VEE) >3.3 V, 5 W to 10 W in line with VEE required for maximum thermal
protection at elevated temperatures. Recommend VCC−VEE operation at 3.3 V.
22. All loading with 50 W to VCC − 2.0 V.
23. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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MC10EP016, MC100EP016
Table 12. AC CHARACTERISTICS VEE = −3.0 V to −5.5 V; VCC = 0 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 24)
−40°C
Symbol
Characteristic
fCOUNT
Maximum Frequency
tPLH
tPHL
Propagation Delay (10)
(10)
(10)
(10)
(10)
(10)
(100)
(100)
(100)
(100)
(100)
(100)
tS
Min
Typ
25°C
Max
Min
>1
> 800
Q, TC
COUT/COUT
Typ
85°C
Max
Min
>1
> 800
350
400
400
350
450
400
400
450
400
450
450
500
500
500
500
450
550
500
550
590
550
590
600
640
−50
300
300
300
100
500
500
500
−50
300
300
300
100
500
500
500
Max
>1
> 800
GHz
MHz
300
300
350
250
400
300
350
400
350
400
400
450
460
400
420
350
470
400
500
550
500
550
550
600
Setup Time
Pn
CE
PE
TCLD
100
500
500
500
tH
Hold Time
Pn
CE
PE
TCLD
100
500
500
500
tJITTER
Clock Random Jitter
(RMS >1000 Waveforms)
tRR
Reset Recovery Time
200
80
200
80
200
80
ps
tPW
Minimum Pulse Width CLK, MR
550
300
550
300
550
300
ps
tr
tf
Output Rise/Fall Times
20% − 80%
120
210
120
220
150
250
8.5
320
400
450
400
400
450
450
480
520
480
520
530
570
560
580
550
510
600
560
630
670
630
670
680
720
−50
300
300
300
100
500
500
500
−50
300
300
300
ps
−50
300
300
300
100
500
500
500
−50
300
300
300
ps
2.5
650
600
600
550
700
650
700
750
700
750
800
850
Unit
CLK to Q
MR to Q
CLK to TC
MR to TC
CLK to COUT
MR to COUT
CLK to Q
MR to Q
CLK to TC
MR to TC
CLK to COUT
MR to COUT
2.6
600
500
550
450
650
550
650
700
650
700
750
800
Typ
8.0
320
2.5
700
700
700
600
800
700
780
820
780
820
880
920
8.0
450
ps
ps
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
24. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.
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8
MC10EP016, MC100EP016
Applications Information
Cascading Multiple EP016 Devices
For applications which call for larger than 8-bit counters
multiple EP016s can be tied together to achieve very wide
bit width counters. The active low terminal count (TC)
output and count enable input (CE) greatly facilitate the
cascading of EP016 devices. Two EP016s can be cascaded
without the need for external gating, however for counters
wider than 16 bits external OR gates are necessary for
cascade implementations.
Figure 3 below pictorially illustrates the cascading of 4
EP016s to build a 32-bit high frequency counter. Note the
EP01 gates used to OR the terminal count outputs of the
lower order EP016s to control the counting operation of the
higher order bits. When the terminal count of the preceding
device (or devices) goes low (the counter reaches an all 1s
state) the more significant EP016 is set in its count mode and
will count one binary digit upon the next positive clock
transition. In addition, the preceding devices will also count
one bit thus sending their terminal count outputs back to a
high state disabling the count operation of the more
significant counters and placing them back into hold modes.
Therefore, for an EP016 in the chain to count, all of the lower
order terminal count outputs must be in the low state. The bit
width of the counter can be increased or decreased by simply
adding or subtracting EP016 devices from Figure 3 and
maintaining the logic pattern illustrated in the same figure.
The maximum frequency of operation for a cascaded
counter chain is set by the propagation delay of the TC output,
the necessary setup time of the CE input, and the propagation
delay through the OR gate controlling it (for 16−bit counters
the limitation is only the TC propagation delay and the CE
setup time). Figure 3 shows EP01 gates used to control the
count enable inputs, however, if the frequency of operation is
slow enough, a LVECL OR gate can be used. Using the worst
case guarantees for these parameters.
LOAD
Q0 to Q7
LO
CE
PE
EP016
LSB
CLK
CLK
TC
Q0 to Q7
CE
Q0 to Q7
PE
CE
EP016
CLK
CLK
PE
CE
CLK
CLK
TC
PE
EP016
MSB
EP016
CLK
CLK
TC
TC
EP01
EP01
P0 to P7
Q0 to Q7
P0 to P7
P0 to P7
P0 to P7
CLK
CLK
Figure 3. 32-Bit Cascaded EP016 Counter
Programmable Divider
Note that this assumes the trace delay between the TC
outputs and the CE inputs are negligible. If this is not the
case estimates of these delays need to be added to the
calculations.
The EP016 has been designed with a control pin which
makes it ideal for use as an 8-bit programmable divider. The
TCLD pin (load on terminal count) when asserted reloads the
data present at the parallel input pin (Pn’s) upon reaching
terminal count (an all 1s state on the outputs). Because this
feedback is built internal to the chip, the programmable
division operation will run at very nearly the same frequency
as the maximum counting frequency of the device. Figure 4
below illustrates the input conditions necessary for utilizing
the EP016 as a programmable divider set up to divide by 113.
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9
MC10EP016, MC100EP016
Applications Information (continued)
H
L
L
P7 P6 P5
L
H
H
H
H
P4
P3
P2 P1 P0
Table 13. Preset Values for Various Divide Ratios
Preset Data Inputs
Divide
H
PE
Ratio
P7
P6
P5
P4
P3
P2
P1
P0
L
CE
2
H
H
H
H
H
H
H
L
H
TCLD
3
H
H
H
H
H
H
L
H
4
H
H
H
H
H
H
L
L
5
H
H
H
H
H
L
H
H
w
w
•
•
•
•
•
•
•
TC
CLK
COUT
CLK
COUT
Q4 Q3 Q2 Q1 Q0
Q7 Q6 Q5
Figure 4. Mod 2 to 256 Programmable Divider
To determine what value to load into the device to
accomplish the desired division, the designer simply
subtracts the binary equivalent of the desired divide ratio
from the binary value for 256. As an example for a divide
ratio of 113:
Pn’s = 256 − 113 = 8F16 = 1000 1111
where:
P0 = LSB and P7 = MSB
Forcing this input condition as per the setup in Figure 4
will result in the waveforms of Figure 5. Note that the TC
output is used as the divide output and the pulse duration is
equal to a full clock period. For even divide ratios, twice the
desired divide ratio can be loaded into the EP016 and the TC
output can feed the clock input of a toggle flip flop to create
a signal divided as desired with a 50% duty cycle.
Load
CLK
1001 0000
w
•
•
•
•
•
•
•
•
112
H
L
L
H
L
L
L
L
113
H
L
L
L
H
H
H
H
114
H
L
L
L
H
H
H
L
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
254
L
L
L
L
L
L
H
L
255
L
L
L
L
L
L
L
H
256
L
L
L
L
L
L
L
L
A single EP016 can be used to divide by any ratio from 2
to 256 inclusive. If divide ratios of greater than 256 are
needed multiple EP016s can be cascaded in a manner similar
to that already discussed. When EP016s are cascaded to
build larger dividers the TCLD pin will no longer provide a
means for loading on terminal count. Because one does not
want to reload the counters until all of the devices in the
chain have reached terminal count, external gating of the TC
pins must be used for multiple EP016 divider chains.
1001 0001
1111 1100
•••
1111 1101
1111 1110
1111 1111
•••
PE
•••
TC
DIVIDE BY 113
Figure 5. Divide by 113 EP016 Programmable Divider Waveforms
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10
Load
MC10EP016, MC100EP016
Applications Information (continued)
EP01
Q0 to Q7
LO
CE
Q0 to Q7
PE
CE
EP016
LSB
CLK
CLK
Q0 to Q7
PE
CE
EP016
CLK
CLK
TC
Q0 to Q7
PE
CE
EP016
CLK
CLK
TC
EP016
MSB
CLK
CLK
TC
EP01
P0 to P7
PE
TC
EP01
P0 to P7
P0 to P7
P0 to P7
CLK
CLK
Figure 6. 32-Bit Cascaded EP016 Programmable Divider
Maximizing EP016 Count Frequency
Figure 6 shows a typical block diagram of a 32-bit divider
chain. Once again to maximize the frequency of operation
EP01 OR gates were used. For lower frequency applications
a slower OR gate could replace the EP01. Note that for a
16-bit divider the OR function feeding the PE (program
enable) input CANNOT be replaced by a wire OR tie as the
TC output of the least significant EP016 must also feed the
CE input of the most significant EP016. If the two TC
outputs were OR tied the cascaded count operation would
not operate properly. Because in the cascaded form the PE
feedback is external and requires external gating, the
maximum frequency of operation will be significantly less
than the same operation in a single device.
Q
The EP016 device produces 9 fast transitioning
single−ended outputs, thus VCC noise can become
significant in situations where all of the outputs switch
simultaneously in the same direction. This VCC noise can
negatively impact the maximum frequency of operation of
the device. Since the device does not need to have the Q
outputs terminated to count properly, it is recommended that
if the outputs are not going to be used in the rest of the system
they should be left unterminated. In addition, if only a subset
of the Q outputs are used in the system only those outputs
should be terminated. Not terminating the unused outputs
will not only cut down the VCC noise generated but will also
save in total system power dissipation. Following these
guidelines will allow designers to either be more aggressive
in their designs or provide them with an extra margin to the
published data book specifications.
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 7. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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11
MC10EP016, MC100EP016
ORDERING INFORMATION
Package
Shipping †
MC10EP016FA
LQFP−32
250 Units / Tray
MC10EP016FAG
LQFP−32
(Pb−Free)
250 Units / Tray
MC10EP016FAR2
LQFP−32
2000 / Tape & Reel
MC10EP016FAR2G
LQFP−32
(Pb−Free)
2000 / Tape & Reel
MC100EP016FA
LQFP−32
250 Units / Tray
MC100EP016FAG
LQFP−32
(Pb−Free)
250 Units / Tray
MC100EP016FAR2
LQFP−32
2000 / Tape & Reel
MC100EP016FAR2G
LQFP−32
(Pb−Free)
2000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1642/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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12
MC10EP016, MC100EP016
PACKAGE DIMENSIONS
32
A1
A
−T−, −U−, −Z−
32 LEAD LQFP
CASE 873A−02
ISSUE B
4X
25
0.20 (0.008) AB T−U Z
1
AE
−U−
−T−
B
P
V
17
8
BASE
METAL
DETAIL Y
V1
AC T−U Z
AE
DETAIL Y
ÉÉ
ÉÉ
ÉÉ
9
−Z−
S1
4X
0.20 (0.008) AC T−U Z
F
S
8X M_
D
DETAIL AD
G
−AB−
SECTION AE−AE
C E
−AC−
H
W
K
X
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE −AB− IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS −T−, −U−, AND −Z− TO BE
DETERMINED AT DATUM PLANE −AB−.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE −AC−.
6. DIMENSIONS A AND B DO NOT
INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.250
(0.010) PER SIDE. DIMENSIONS A AND
B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE
−AB−.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER
MAY VARY FROM DEPICTION.
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
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13
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.300
0.450
1.350
1.450
0.300
0.400
0.800 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12_ REF
0.090
0.160
0.400 BSC
1_
5_
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12_ REF
0.004
0.006
0.016 BSC
1_
5_
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
Q_
0.250 (0.010)
0.10 (0.004) AC
GAUGE PLANE
SEATING
PLANE
J
R
M
N
9
0.20 (0.008)
B1
MC10EP016, MC100EP016
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: [email protected]
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14
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MC10EP016/D