NB100LVEP224 2.5V/3.3V 1:24 Differential ECL/PECL Clock Driver with Clock Select and Output Enable http://onsemi.com Description The NB100LVEP224 is a low skew 1−to−24 differential clock driver, designed with clock distribution in mind, accepting two clock sources into an input multiplexer. The part is designed for use in low voltage applications which require a large number of outputs to drive precisely aligned low skew signals to their destination. The two clock inputs are differential ECL/PECL and they are selected by the CLK_SEL pin. To avoid generation of a runt clock pulse when the device is enabled/disabled, the Output Enable (OE) is synchronous ensuring the outputs will only be enabled/disabled when they are already in LOW state (See Figure 4). The NB100LVEP224 guarantees low output−to−output skew. The optimal design, layout, and processing minimize skew within a device and from lot to lot. In any differential output, the same bias and termination scheme is required. Unused output pairs should be left unterminated (open) to “reduce power and switching noise as much as possible.” Any unused single line of a differential pair should be terminated the same as the used line to maintain balanced loads on the differential driver outputs. The wide VIHCMR specification allows both pair of CLOCK inputs to accept LVDS levels. The NB100LVEP224, as with most other ECL devices, can be operated from a positive VCC supply in LVPECL mode. This allows the LVEP224 to be used for high performance clock distribution in +3.3 V or +2.5 V systems. Single−ended CLK input operation is limited to a VCC ≥ 3.0 V in LVPECL mode, or VEE ≤ −3.0 V in NECL mode. In a PECL environment, series or Thevenin line terminations are typically used as they require no additional power supplies. For more information on PECL terminations, designers should refer to Application Note AND8020/D. MARKING DIAGRAM* LQFP−64 FA SUFFIX CASE 848G A WL YY WW G NB100 LVEP224 AWLYYWWG 64 1 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. Features • • • • • • • • • • 20 ps Typical Output−to−Output Skew 75 ps Typical Device−to−Device Skew Maximum Frequency > 1 GHz 650 ps Typical Propagation Delay LVPECL Mode Operating Range: VCC = 2.375 V to 3.8 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −2.375 V to −3.8 V • Internal Input Pulldown Resistors Q Output will Default Low with Inputs Open or at VEE Thermally Enhanced 64−Lead LQFP CLOCK Inputs are LVDS−Compatible; Requires External 100 W LVDS Termination Resistor Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 7 1 Publication Order Number: NB100LVEP224/D Q8 Q8 Q9 Q9 Q10 Q10 Q11 Q11 Q12 Q12 Q13 Q13 Q14 Q14 VEE VCCO VEE NB100LVEP224 48 49 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 VCCO Q7 50 31 Q15 Q7 51 30 Q15 Q6 52 29 Q16 Q6 53 28 Q16 Q5 54 27 Q17 Q5 55 26 Q17 Q4 56 25 Q18 Q4 57 24 Q18 Q3 58 23 Q19 Q3 59 22 Q19 Q2 60 21 Q20 Q2 61 20 Q20 Q1 62 19 Q21 Q1 63 18 Q21 VCCO 64 17 VCCO 10 11 12 13 14 15 16 Q23 Q22 Q22 VCCO 9 Q23 8 OE VCC 7 VEE Q0 6 CLK1 Q0 5 CLK1 4 CLK_SEL 3 CLK0 2 CLK0 1 VCCO NB100LVEP224 All VCC, VCCO, and VEE pins must be externally connected to appropriate Power Supply to guarantee proper operation. The thermally conductive exposed pad on package bottom (see package case drawing) must be attached to a heat−sinking conduit, capable of transferring 1.2 Watts. This exposed pad is electrically connected to VEE internally. Figure 1. 64−Lead LQFP Pinout (Top View) Table 1. PIN DESCRIPTION PIN FUNCTION CLK0*, CLK0** CLK1*, CLK1** CLK_SEL* OE* Q0−Q23, Q0−Q23 VCC, VCCO VEE*** ECL Differential Input Clock ECL Differential Input Clock ECL Input CLK Select ECL Output Enable ECL Differential Outputs Positive Supply Negative Supply Table 2. FUNCTION TABLE OE (1) CLK_SEL Q0−Q23 Q0−Q23 L L H H L H L H CLK0 CLK1 L L CLK0 CLK1 H H 1. The OE (Output Enable) signal is synchronized with the falling edge of the LVPECL_CLK signal. * Pins will default LOW when left open. ** Pins will default HIGH when left open. *** The thermally conductive exposed pad on the bottom of the package is electrically connected to VEE internally. http://onsemi.com 2 NB100LVEP224 CLK_SEL CLK0 0 24 CLK0 CLK1 Q0−Q23 1 CLK1 VCC VEE Q0−Q23 24 Q D OE Figure 2. Logic Diagram Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor ESD Protection 37.5 kW Human Body Model Machine Model Charged Device Model > 2 kV > 150 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 2) LQFP−64 Flammability Rating Oxygen Index: 28 to 34 Pb Pkg Pb−Free Pkg Level 2 Level 3 UL 94 V−0 @ 0.125 in Transistor Count 654 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 2. For additional information, refer to Application Note AND8003/D. Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 to 0 −6 to 0 V TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) (See Application Information) 0 lfpm 500 lfpm 64 LQFP 64 LQFP 35.6 30 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) (See Application Information) 0 lfpm 500 lfpm 64 LQFP 64 LQFP 3.2 6.4 °C/W °C/W Tsol Wave Solder 265 265 °C Pb Pb−Free VI ≤ VCC VI ≥ VEE Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 3 NB100LVEP224 Table 5. LVPECL DC CHARACTERISTICS VCC = 2.5 V; VEE = 0 V (Note 3) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit IEE Power Supply Current 130 160 195 135 165 200 140 165 205 mA VOH Output HIGH Voltage (Note 4) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV VOL Output LOW Voltage (Note 4) 555 680 900 555 680 900 555 680 900 mV VIH Input HIGH Voltage (Single−Ended) (Note 5) 1335 1620 1335 1620 1275 1620 mV VIL Input LOW Voltage (Single−Ended) (Note 5) 555 900 555 900 555 900 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 6) CLK/CLK 1.2 2.5 1.2 2.5 1.2 2.5 V 150 mA IIH Input HIGH Current IIL Input LOW Current 150 CLK CLK 0.5 −150 150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Input and output parameters vary 1:1 with VCC. VEE can vary + 0.125 V to −1.3 V. 4. All outputs loaded with 50 W to VCC − 2.0 V. 5. Do not use VBB at VCC < 3.0 V. 6. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 6. LVPECL DC CHARACTERISTICS VCC = 3.3 V; VEE = 0 V (Note 7) −40°C Symbol Min Characteristic Typ 25°C Max Min Typ 85°C Max Min Typ Max Unit IEE Power Supply Current 140 165 195 145 175 205 145 175 210 mA VOH Output HIGH Voltage (Note 8) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV VOL Output LOW Voltage (Note 8) 1355 1480 1700 1355 1480 1700 1355 1480 1700 mV VIH Input HIGH Voltage (Single−Ended) (Note 9) 2135 2420 2135 2420 2135 2420 mV VIL Input LOW Voltage (Single−Ended) (Note 9) 1355 1700 1355 1700 1355 1700 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 10) (Figure 5) 1.2 3.3 1.2 3.3 1.2 3.3 V IIH Input HIGH Current 150 mA IIL Input LOW Current 150 CLK CLK 0.5 −150 150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to −0.5 V. 8. All outputs loaded with 50 W to VCC − 2.0 V. 9. Single ended input operation is limited VCC ≥ 3.0 V in LVPECL mode. 10. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. http://onsemi.com 4 NB100LVEP224 Table 7. NECL DC CHARACTERISTICS VCC = 0 V, VEE = −2.375 V to −3.8 V (Note 11) −40°C Symbol Characteristic VEE = −2.5 V VEE = −3.3 V 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 130 140 160 165 195 195 135 145 165 175 200 205 140 145 165 175 205 210 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 12) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV VOL Output LOW Voltage (Note 12) −1945 −1820 −1600 −1945 −1820 −1600 −1945 −1820 −1600 mV VIH Input HIGH Voltage (Single−Ended) (Note 13) −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage (Single−Ended) (Note 13) −1945 −1600 −1945 −1600 −1945 −1600 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 14) (Figure 5) 0.0 V IIH Input HIGH Current 150 mA IIL Input LOW Current VEE + 1.2 0.0 VEE + 1.2 0.0 150 CLK CLK VEE + 1.2 150 0.5 −150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 11. Input and output parameters vary 1:1 with VCC. 12. All outputs loaded with 50 W to VCC − 2.0 V. 13. Single ended input operation is limited VEE ≤ −3.0 V in NECL mode. 14. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 8. AC CHARACTERISTICS VCC = 2.375 V to 3.8 V; VEE = 0 V (Note 15) −405C 255C Min Typ fout < 50 MHz fout < 0.8 GHz fout < 1.0 GHz 600 600 600 750 750 700 tPLH tPHL Propagation Delay (Differential Configuration) CLKx−Qx CLK_SELx−Qx 500 600 600 700 700 800 tskew Within−Device Skew (Note 16) Device−to−Device Skew (Note 17) 20 50 40 300 tJITTER Random Clock Jitter (Figure 3) (RMS) VPP Input Swing (Differential Configuration) (Note 19) (Figure 5) 200 tS OE Set Up Time (Note 18) 200 tH OE Hold Time 200 tr/tf Output Rise/Fall Time (20%−80%) 100 Characteristic Symbol VOpp Differential Output Voltage (Figure 3) Max 1 5 800 1200 855C Min Typ 600 600 525 725 725 650 550 650 650 800 750 900 20 50 40 300 200 Max 1 5 800 1200 200 300 100 Typ 575 550 400 700 650 525 650 750 750 850 1000 1150 ps ps 35 100 60 300 ps ps 200 Max 1 5 ps 800 1200 mV ps 200 200 300 150 Unit mV mV mV 200 200 200 Min ps 250 350 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 15. Measured with PECL 750 mV source, 50% duty cycle clock source. All outputs loaded with 50 W to VCC − 2 V. 16. Skew is measured between outputs under identical transitions and conditions on any one device. 17. Device−to−Device skew for identical transitions at identical VCC levels. 18. OE Set Up Time is defined with respect to the falling edge of the clock. OE High−to−Low transition ensures outputs remain disabled during the next clock cycle. OE Low−to−High transition enables normal operation of the next input clock. 19. VPP is the differential input voltage swing required to maintain AC characteristics including tPD and device−to−device skew. http://onsemi.com 5 NB100LVEP224 10 9.0 800 8.0 700 Q AMP (mV) 7.0 6.0 600 500 5.0 2.5 V 3.3 V 4.0 3.0 400 200 2.0 RMS JITTER (ps) 300 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 RMS JITTER (ps) OUTPUT AMPLITUDE (mV) 900 1.4 1.5 1.0 0 INPUT FREQUENCY (GHz) Figure 3. Output Amplitude (VOPP) versus Input Frequency and Random Clock Jitter (tJITTER) CLK CLK OE Q Q Figure 4. Output Enable (OE) Timing Diagram VCC(LVPECL) VPP VIH(DIFF) VIHCMR VIL(DIFF) VEE Figure 5. LVPECL Differential Input Levels http://onsemi.com 6 NB100LVEP224 APPLICATIONS INFORMATION Using the thermally enhanced package of the NB100LVEP224 supply enough solder paste to fill those vias and not starve the solder joints. The attachment process for the exposed pad package is equivalent to standard surface mount packages. Figure 7, “Recommended solder mask openings”, shows a recommended solder mask opening with respect to a 4 X 4 thermal via array. Because a large solder mask opening may result in a poor rework release, the opening should be subdivided as shown in Figure 7. For the nominal package standoff of 0.1 mm, a stencil thickness of 5 to 8 mils should be considered. The NB100LVEP224 uses a thermally enhanced 64−lead LQFP package. The package is molded so that a portion of the leadframe is exposed at the surface of the package bottom side. This exposed metal pad will provide the low thermal impedance that supports the power consumption of the NB100LVEP224 high−speed bipolar integrated circuit and will ease the power management task for the system design. In multilayer board designs, a thermal land pattern on the printed circuit board and thermal vias are recommended to maximize both the removal of heat from the package and electrical performance of the NB100LVEP224. The size of the land pattern can be larger, smaller, or even take on a different shape than the exposed pad on the package. However, the solderable area should be at least the same size and shape as the exposed pad on the package. Direct soldering of the exposed pad to the thermal land will provide an efficient thermal conduit. The thermal vias will connect the exposed pad of the package to internal copper planes of the board. The number of vias, spacing, via diameters and land pattern design depend on the application and the amount of heat to be removed from the package. Maximum thermal and electrical performance is achieved when an array of vias is incorporated in the land pattern. The recommended thermal land design for NB100LVEP224 applications on multi−layer boards comprises a 4 X 4 thermal via array using a 1.2 mm pitch as shown in Figure 6 providing an efficient heat removal path. All Units mm 0.2 4.6 1.0 1.0 0.2 4.6 Thermal Via Array (4 X 4) 1.2 mm Pitch 0.3 mm Diameter Exposed Pad Land Pattern Figure 7. Recommended Solder Mask Openings All Units mm Proper thermal management is critical for reliable system operation. This is especially true for high−fanout and high output drive capability products. For thermal system analysis and junction temperature calculation the thermal resistance parameters of the package is provided: 4.6 Table 9. Thermal Resistance * 4.6 Thermal Via Array (4 X 4) 1.2 mm Pitch 0.3 mm Diameter lfpm qJA 5C/W qJC 5C/W 0 35.6 3.2 100 32.8 4.9 500 30.0 6.4 * Junction to ambient and Junction to board, four−conductor layer test board (2S2P) per JESD 51−8 These recommendations are to be used as a guideline, only. It is therefore recommended that users employ sufficient thermal modeling analysis to assist in applying the general recommendations to their particular application to assure adequate thermal performance. The exposed pad of the NB100LVEP224 package is electrically shorted to the substrate of the integrated circuit and VEE. The thermal land should be electrically connected to VEE. Exposed Pad Land Pattern Figure 6. Recommended Thermal Land Pattern The via diameter should be approximately 0.3 mm with 1 oz. copper via barrel plating. Solder wicking inside the via may result in voiding during the solder process and must be avoided. If the copper plating does not plug the vias, stencil print solder paste onto the printed circuit pad. This will http://onsemi.com 7 NB100LVEP224 ORDERING INFORMATION Device Package Shipping † NB100LVEP224FA LQFP−64 160 Units / Tray NB100LVEP224FAG LQFP−64 (Pb−Free) 160 Units / Tray NB100LVEP224FAR2 LQFP−64 1500 / Tape & Reel NB100LVEP224FARG LQFP−64 (Pb−Free) 1500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 8 NB100LVEP224 PACKAGE DIMENSIONS LQFP 64 LEAD EXPOSED PAD 848G−02 ISSUE A 4 PL M M/2 −Z− 0.20 (0.008) T X−Y Z AJ AJ 64 49 48 1 PLATING −X− ÇÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ ÉÉÉÉ AA −Y− L B B/2 L/2 16 D REF 33 0.08 (0.003) 32 17 J AB M Y T−U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MM. 3. DATUM PLANE E" IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING PLANE. 4. DATUM X", Y" AND Z" TO BE DETERMINED AT DATUM PLANE DATUM E". 5. DIMENSIONS M AND L TO BE DETERMINED AT SEATING PLANE DATUM T". 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE BASE DETERMINED AT DATUM PLAND E". METAL 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED THE MAXIMUM D DIMENSION BY MORE THAN 0.08 (0.003). DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD OR PROTRUSION 0.07 (0.003). 8. EXACT SHAPE OF EACH CORNER IS OPTIONAL. Z DIM A B C D F G H J K L M N P R S V W AA AB AC AD AE AF DETAIL AJ−AJ A/2 0.20 (0.008) E X−Y Z A DETAIL AH −E− −T− AG AG G/2 SEATING PLANE G 0.08 (0.003) T 4 PL 60 PL D 0.08 (0.003) 64 PL M T X−Y V Z 0.05 (0.002) R S AC AD AE EXPOSED PAD 17 32 33 16 S C W N K P F AF H DETAIL AH 1 48 64 49 VIEW AG−AG http://onsemi.com 9 0.25 GAGE PLANE MILLIMETERS MIN MAX 10.00 BSC 10.00 BSC 1.35 1.45 0.17 0.27 0.45 0.75 0.50 BSC 1.00 REF 0.09 0.20 0.05 0.15 12.00 BSC 12.00 BSC 0.20 −−− 0_ 7_ 0_ −−− −−− 1.60 11 _ 13 _ 11 _ 13 _ 0.17 0.23 0.09 0.16 0.08 −−− 0.08 −−− 4.50 4.78 4.50 4.78 INCHES MIN MAX 0.394 BSC 0.394 BSC 0.053 0.057 0.007 0.011 0.018 0.030 0.020 BSC 0.039 BSC 0.004 0.008 0.002 0.006 0.472 BSC 0.472 BSC 0.008 −−− 0_ 7_ 0_ −−− −−− 0.063 11 _ 13 _ 11 _ 13 _ 0.007 0.009 0.004 0.006 0.003 −−− 0.003 −−− 0.180 0.188 0.180 0.188 NB100LVEP224 ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 10 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NB100LVEP224/D