SEMICONDUCTOR TECHNICAL DATA The MC10E/100E175 is a 9-bit latch. It also features a tenth latched output, ODDPAR, which is formed as the odd parity of the nine data inputs (ODDPAR is HIGH if an odd number of the inputs are HIGH). The E175 can also be used to generate byte parity by using D8 as the parity-type select (L = even parity, H = odd parity), and using ODDPAR as the byte parity output. The LEN pin latches the data when asserted with a logical high and makes the latch transparent when placed at a logic low level. • • • • • • 9-BIT LATCH WITH PARITY 9-Bit Latch Parity Detection/Generation 800ps Max. D to Output Reset Extended 100E VEE Range of – 4.2V to – 5.46V Internal 75kΩ Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View) D6 D7 D8 VCCO Q8 Q7 VCCO 25 24 23 22 21 20 19 FN SUFFIX PLASTIC PACKAGE CASE 776-02 26 18 Q6 D4 27 17 Q5 D3 28 16 VCC VEE 1 15 Q4 LEN 2 14 Q3 MR 3 13 VCCO D2 4 12 Q2 5 6 7 8 9 10 11 D1 D0 VCCO ODDPAR D5 Q0 VCCO Q1 LOGIC DIAGRAM D0 D EN Q Q0 Q Q8 Q ODDPAR R BITS 1–7 D8 D EN R * All VCC and VCCO pins are tied together on the die. PIN NAMES Pin D0 – D8 LEN MR Q0 – Q8 ODDPAR D Function EN Data Inputs Latch Enable Master Reset Data Outputs Parity Output R LEN MR 12/93 Motorola, Inc. 1996 2–1 REV 2 MC10E175 MC100E175 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E min typ 25°C max min typ 150 85°C max min typ 150 max Unit 150 µA Cond mA 110 110 132 132 110 110 132 132 110 127 132 152 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic min typ 25°C max min typ 85°C max min tPLH tPHL Propagation Delay to Output D to Q D to ODDPAR LEN to Q LEN to ODDPAR MR to Q(tPHL) MR to ODDPAR(tPHL) 450 850 525 525 525 525 600 1150 700 700 700 700 ts Setup Time D (Q) D (ODDPAR) 275 900 100 700 275 900 275 900 Hold Time D (Q) D (ODDPAR) 175 – 300 –100 – 70 175 – 300 175 – 300 850 600 850 th max Unit Cond ps 800 1450 900 900 900 900 450 850 525 525 525 525 600 1150 700 700 700 700 800 1450 900 900 900 900 450 850 525 525 525 525 600 1150 700 700 700 700 800 1450 900 900 900 900 ps ps tRR Reset Recovery Time tSKEW Within-Device Skew LEN, MR D to Q D to ODDPAR tr tf typ 600 850 600 ps ps 75 75 200 Rise/Fall Times 20 - 80% 75 75 200 1 75 75 200 ps 300 500 800 300 500 800 300 500 800 1. Within-device skew is defined as identical transitions on similar paths through a device. FUNCTION TABLE D EN MR Q H L X X L L H X L L L H H L Q0 L MOTOROLA ODDPAR H if odd no. of Dn HIGH H if odd no. of Dn HIGH Q0 L 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E175 MC100E175 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E175 MC100E175 Motorola reserves the right to make changes without further notice to any products herein. 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