SEMICONDUCTOR TECHNICAL DATA The MC10E/100E158 contains five 2:1 multiplexers with differential outputs. The output data are controlled by the Select input (SEL). • • • • • • 600ps Max. D to Output 800ps Max. SEL to Output Differential Outputs 5-BIT 2:1 MULTIPLEXER One VCCO Pin Per Output Pair Extended 100E VEE Range of – 4.2V to – 5.46V 75kΩ Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View) D4a D3b D3a VCCO Q4 Q4 VCCO 25 24 23 21 20 19 22 D4b 26 18 Q3 D2a 27 17 Q3 D2b 28 16 VCC VEE 1 15 Q2 SEL 2 14 Q2 D0a 3 13 VCCO D0b 4 12 Q1 5 D1a 6 7 D1b VCCO 8 9 10 11 Q0 Q0 VCCO Q1 * All VCC and VCCO pins are tied together on the die. PIN NAMES Pin D0a – D4a D0b – D4b SEL Q0 – Q4 Q0 – Q4 FN SUFFIX PLASTIC PACKAGE CASE 776-02 LOGIC DIAGRAM D0a MUX Q0 D0b SEL Q0 D1a MUX Q1 D1b SEL Q1 D2a MUX Q2 D2b SEL Q2 D3a MUX Q3 D3b SEL Q3 D4a MUX Q4 D4b SEL Q4 Function Input Data a Input Data b Select Input True Outputs Inverted Outputs FUNCTION TABLE SEL Data H L a b SEL 12/93 Motorola, Inc. 1996 2–1 REV 2 MC10E158 MC100E158 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol IIH IEE Characteristic min typ 25°C max min typ 85°C max min typ max Unit Condition µA Input HIGH Current D SEL 200 150 Power Supply Current 10E 100E 200 150 200 150 mA 33 33 40 40 33 33 40 40 33 38 40 46 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic tPLH tPHL Propagation Delay to Output D SEL tSKEW Within-Device Skew tr tf Rise/Fall Time 20 - 80% 25°C 85°C min typ max min typ max min typ max 225 400 385 600 550 775 225 400 385 600 550 775 225 400 385 600 550 775 Unit Condition ps 60 60 60 ps 1 ps 275 425 650 275 425 650 275 425 650 1. Within-device skew is defined as identical transitions on similar paths through a device. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E158 MC100E158 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E158 MC100E158 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 2–4 *MC10E158/D* MC10E158/D ECLinPS and ECLinPS Lite DL140 — Rev 4