SEMICONDUCTOR TECHNICAL DATA ! The MC10H332 is a Dual Bus Driver/Receiver with four–to–one output multiplexers. These multiplexers have common selects and output enable. When disabled, (OE = high) the bus outputs go to –2.0 V. The parameters specified are with 25 Ω loading on the bus drivers and 50 Ω loads on the receivers. L SUFFIX CERAMIC PACKAGE CASE 732–03 • Propagation Delay, 1.5 ns Typical Data–to–Output • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible P SUFFIX PLASTIC PACKAGE CASE 738–03 FN SUFFIX PLCC CASE 775–02 MAXIMUM RATINGS Characteristic Symbol Rating Unit VEE VI –8.0 to 0 Vdc Power Supply (VCC = 0) Input Voltage (VCC = 0) 0 to VEE Vdc Output Current — Continuous — Surge Iout 50 100 mA Operating Temperature Range TA Tstg 0 to +75 °C –55 to +150 –55 to +165 °C °C Storage Temperature Range — Plastic — Ceramic DIP & PLCC PIN ASSIGNMENT ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° 25° 75° Characteristic Symbol Min Max Min Max Min Max Unit Power Supply Current IE — 115 — 110 — 115 mA Input Current High Pins 3,4,5,6,14, 15,16,17 Pins 7,8 Pins 13, 18 IinH Input Current Low IinL VOH VOL High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage VIH VIL µA — — — 667 437 456 — — — 417 273 285 — — — 0.5 — 0.5 — 0.3 417 273 285 — µA –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc –1.02 –0.84 –0.98 –0.81 –0.92 AC PARAMETERS Propagation Delay Data–to–Bus Output Select–to–Bus Output OE–to–Bus Output Bus–to–Receiver Select–to–Receiver RE–to–Receiver Data–to–Receiver Rise Time Fall Time tpd tr tf ns 0.8 3.0 0.8 3.0 0.8 3.2 0.8 0.8 0.8 1.8 0.8 1.3 3.4 2.4 2.1 4.5 2.2 4.0 0.8 0.8 0.8 1.8 0.8 1.3 3.4 2.4 2.1 4.5 2.2 4.0 0.8 0.8 0.8 1.8 0.8 1.3 3.8 2.6 2.4 5.0 2.5 4.5 0.5 2.0 0.5 2.0 0.5 2.1 ns 0.5 2.0 0.5 2.0 0.5 2.1 ns 2–13 1 20 VCC02 XBUS 2 19 YBUS X0 3 18 OE X1 4 17 Y0 X2 5 16 Y1 X3 6 15 Y2 S0 7 14 Y3 S1 8 13 RE XIN 9 12 YIN VEE 10 11 VCC01 Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Receiver outputs are terminated through a 50–ohm resistor to –2.0 volts dc. Bus outputs are terminated through a 25–ohm resistor to –2.0 volts dc. 3/93 Motorola, Inc. 1996 VCC REV 5 MC10H332 MULTIPLEXER TRUTH TABLE OE S1 S0 XBus YBus H L L L L X L L H H X L H L H –2.0V X0 X1 X2 X3 –2.0V Y0 Y1 Y2 Y3 RECEIVER TRUTH TABLE RE Xin Yin H L L XBus L YBus LOGIC DIAGRAM OE 18 X0 3 X1 4 X2 5 X3 6 S0 7 S1 8 Y0 17 Y1 16 Y2 15 Y3 14 XIN 9 RE 13 YIN 12 MOTOROLA 2 XBUS 19 YBUS VCC VCC01 VCC02 VEE 2–14 = = = = PIN 1 PIN 11 PIN 20 PIN 10 MECL Data DL122 — Rev 6 MC10H332 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–15 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA MC10H332 OUTLINE DIMENSIONS 20 11 1 10 L SUFFIX CERAMIC DIP PACKAGE CASE 732–03 ISSUE E NOTES: 1. LEADS WITHIN 0.010 DIAMETER, TRUE POSITION AT SEATING PLANE, AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS A AND B INCLUDE MENISCUS. B A L C F DIM A B C D F G H J K L M N N H G D J K M INCHES MIN MAX 0.940 0.990 0.260 0.295 0.150 0.200 0.015 0.022 0.055 0.065 0.100 BSC 0.020 0.050 0.008 0.012 0.125 0.160 0.300 BSC 0_ 15_ 0.010 0.040 SEATING PLANE P SUFFIX PLASTIC DIP PACKAGE CASE 738–03 ISSUE E –A– 20 11 1 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. B L C –T– K SEATING PLANE M N E G F J D 0.25 (0.010) 20 PL 0.25 (0.010) 20 PL M T A M M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. 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