Freescale Semiconductor, Inc. Order this document by MPXV4006G/D SEMICONDUCTOR TECHNICAL DATA $"$ "##%" # " ! $ !"$%" !#$ "$ The MPXV4006G series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. INTEGRATED PRESSURE SENSOR 0 to 6 kPa (0 to 0.87 psi) 0.2 to 4.7 V OUTPUT Freescale Semiconductor, Inc... Features • Temperature Compensated over 10° to 60°C • Ideally Suited for Microprocessor or Microcontroller– Based Systems SMALL OUTLINE PACKAGE SURFACE MOUNT SMALL OUTLINE PACKAGE THROUGH–HOLE J • Available in Gauge Surface Mount (SMT) or Through– hole (DIP) Configurations • Durable Thermoplastic (PPS) Package MPXV4006G6U CASE 482 ,) * !% !#$ *$'(*+( &$'%)*!&% % !% )* )%)!% #$%* !% )* % (&+% ((% ) !* !(+!*(/ MPXV4006G7U CASE 482B ,;?> MPXV4006GC6U CASE 482A MPXV4006GC7U CASE 482C '!%) % ( %& &%%*) &( )$## &+*#!% '" ,! % Figure 1. Fully Integrated Pressure Sensor Schematic PIN NUMBER MPXV4006GP CASE 1369 1 N/C 5 N/C 2 VS 6 N/C 3 Gnd 7 N/C 4 Vout 8 N/C NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. MPXV4006DP CASE 1351 Replaces MPXT4006D/D REV 4 Motorola Sensor Device Data Motorola, Inc. 2002 For More Information On This Product, Go to: www.freescale.com 1 Freescale Semiconductor, Inc. MAXIMUM RATINGS(NOTE) Parametrics Symbol Value Unit Pmax 24 kPa Storage Temperature Tstg –30 to +100 °C Operating Temperature TA +10 to +60 °C Maximum Pressure (P1 > P2) NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Freescale Semiconductor, Inc... Characteristic Symbol Min Typ Max Unit Pressure Range POP 0 — 6.0 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current IS — — 10 mAdc (RL = 51kΩ) VFSS — 4.6 — V (RL = 51kΩ) Voff 0.100 0.225 0.430 V V/P — 766 — mV/kPa — — — ±5.0 %VFSS Full Scale Span(2) Offset(3)(5) Sensitivity Accuracy(4)(5) (10 to 60°C) NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • Offset Stability: Output deviation, after 1000 temperature cycles, 30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. • TcSpan: Output deviation over the temperature range of 10 to 60°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006G, external mechanical stresses and mounting position can affect the zero pressure output reading. To obtain the 5% FSS accuracy, the device output must be “autozeroed’’ after installation. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device’s output during normal operations. 2 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10°C to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. ! #+&(&)!#!&% # ! &* )*!%#)) )*# ' , ' -!( &% ,;?> * ($&'#)*! ) &+*'+* ,= !') # ($ % < ' ! &% !(%*!# )%)!% #$%* Figure 2. Cross–Sectional Diagram (Not to Scale) Figure 3. Recommended power supply decoupling and output filtering recommendations. For additional output filtering, please refer to Application Note AN1646. &+*'+*, Freescale Semiconductor, Inc... The performance over temperature is achieved by integrating the shear–stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV4006G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long–term reliability. Internal reliability and qualification *(%)( +%*!&% ,;?> ,)0' 1 ± ,)) ,) , ± ,54 *$' >; ° */'!# $. $!% !(%*!# '())+( 8'2 Figure 4. Output versus Pressure Differential (See Note 5 in Operating Characteristics) Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 3 Freescale Semiconductor, Inc. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola pres- Freescale Semiconductor, Inc... Part Number sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type Pressure (P1) Side Identifier MPXV4006G6U/T1 482 Stainless Steel Cap MPXV4006GC6U/T1 482A Side with Port Attached MPXV4006G7U 482B Stainless Steel Cap MPXV4006GC7U 482C Side with Port Attached MPXV4006GP 1369 Side with Port Attached MPXV4006DP 1351 Side with Part Marking ORDERING INFORMATION MPXV4006G series pressure sensors are available in the basic element package or with pressure ports. Two packing options are offered for the 482 and 482A case configurations. Device Type Basic Element Ported Element Options Case No. MPX Series Order No. Packing Options Marking Element Only 482 MPXV4006G6U Rails MPXV4006G Element Only 482 MPXV4006G6T1 Tape and Reel MPXV4006G Element Only 482 MPXV4006G7U Rails MPXV4006G Axial Port 482A MPXV4006GC6U Rails MPXV4006G Axial Port 482A MPXV4006GC6T1 Tape and Reel MPXV4006G Axial Port 482A MPXV4006GC7U Rails MPXV4006G Side Port 1369 MPXV4006GP Trays MPXV4006G Dual Port 1351 MPXV4006DP Trays MPXV4006G MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. */'. */'. */'. 7:46 99 )# Figure 5. SOP Footprint (Case 482) 4 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. SMALL OUTLINE PACKAGE DIMENSIONS SURFACE MOUNT –A– D 8 PL $ * ) %&*) !$%)!&%!% % *&#(%!% '( %)! /$ &%*(&##!% !$%)!&% !% !$%)!&% % & %&* !%#+ $&# '(&*(+)!&% $.!$+$ $&# '(&*(+)!&% ## ,(*!# )+() */'!# (* ) –B– G S Freescale Semiconductor, Inc... N H C J –T– M K PIN 1 IDENTIFIER ) ) CASE 482–01 ISSUE O –A– D 8 PL $ * ) %&*) !$%)!&%!% % *&#(%!% '( %)! /$ &%*(&##!% !$%)!&% !% !$%)!&% % & %&* !%#+ $&# '(&*(+)!&% $.!$+$ $&# '(&*(+)!&% ## ,(*!# )+() */'!# (* ) N –B– G S W V C H J ) ) –T– K M PIN 1 IDENTIFIER CASE 482A–01 ISSUE A Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 5 Freescale Semiconductor, Inc. SMALL OUTLINE PACKAGE DIMENSIONS – CONTINUED SURFACE MOUNT E A e e/2 .014 (0.35) θ L D A1 DETAIL G b %&*) &%*(&##!% !$%)!&% !% !%*('(* !$%)!&%) % *&#(%) '( )$ /$ !$%)!&%) % & %&* !%#+ $&# #) &( '(&*(+)!&%) $&# #) &( '(&*(+)!&%) ) ## %&* . '( )! !$%)!&% 3 &) %&* !%#+ $( '(&*(+)!&% ##&-# $( '(&*(+)!&% ) ## $.!$+$ Freescale Semiconductor, Inc... F E1 B N ∅T K A P $ M DETAIL G C θ ) ) ° ° ) ) ° ° CASE 1369–01 ISSUE O 6 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. SMALL OUTLINE PACKAGE DIMENSIONS – CONTINUED SURFACE MOUNT E A e e/2 .014 (0.35) θ L D A1 DETAIL G b Freescale Semiconductor, Inc... F $ E1 B N % ,;?> ,= ,;?> % % % % )*/# '!% % ,= % ,;?> % % % % %&*) &%*(&##!% !$%)!&% !% !%*('(* !$%)!&%) % *&#(%) '( )$ /$ !$%)!&%) % & %&* !%#+ $&# #) &( '(&*(+)!&%) $&# #) &( '(&*(+)!&%) ) ## %&* . '( )! !$%)!&% 3 &) %&* !%#+ $( '(&*(+)!&% ##&-# $( '(&*(+)!&% ) ## $.!$+$ ∅T M A P )*/# '!% DETAIL G C K θ ) ° ° ) ° ° CASE 1351–01 ISSUE O Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 7 Freescale Semiconductor, Inc. SMALL OUTLINE PACKAGE DIMENSIONS – CONTINUED THROUGH–HOLE –A– %&*) !$%)!&%!% % *&#(%!% '( %)! /$ &%*(&##!% !$%)!&% !% !$%)!&% % & %&* !%#+ $&# '(&*(+)!&% $.!$+$ $&# '(&*(+)!&% ## ,(*!# )+() */'!# (* !$%)!&% ) *& %*( & # - % &($ '(### –B– G $ * D 8 PL ) ) DETAIL X S PIN 1 IDENTIFIER N Freescale Semiconductor, Inc... C –T– ) ) K M J DETAIL X CASE 482B–03 ISSUE B %&*) !$%)!&%!% % *&#(%!% '( %)! /$ &%*(&##!% !$%)!&% !% !$%)!&% % & %&* !%#+ $&# '(&*(+)!&% $.!$+$ $&# '(&*(+)!&% ## ,(*!# )+() */'!# (* !$%)!&% ) *& %*( & # - % &($ '(### –A– N –B– G $ * D 8 PL ) ) DETAIL X S W V PIN 1 IDENTIFIER C –T– ) ) K M J DETAIL X CASE 482C–03 ISSUE B 8 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... NOTES Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 9 Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... NOTES 10 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... NOTES Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 11 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. 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Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334 Technical Information Center: 1–800–521–6274 HOME PAGE: http://www.motorola.com/semiconductors/ 12 ◊For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data MPXV4006G/D