Order this document by MRF372/D SEMICONDUCTOR TECHNICAL DATA The RF MOSFET Line N–Channel Enhancement–Mode Lateral MOSFET Designed for broadband commercial and industrial applications with frequencies from 470 to 860 MHz. The high gain and broadband performance of this device make it ideal for large–signal, common source amplifier applications in 32 volt transmitter equipment. • Typical Narrowband Two–Tone Performance @ f1 = 857 MHz, f2 = 863 MHz, 32 Volts Output Power — 180 Watts PEP Power Gain — 17 dB Efficiency — 36% IMD — –35 dBc • Typical Broadband Two–Tone Performance @ f1 = 857 MHz, f2 = 863 MHz, 32 Volts Output Power — 180 Watts PEP Power Gain — 14.5 dB Efficiency — 37% IMD — –31 dBc • Internally Matched, Controlled Q, for Ease of Use • Integrated ESD Protection • 100% Tested for Load Mismatch Stress at All Phase Angles with 3:1 VSWR @ 32 Vdc, f1 = 857 MHz, f2 = 863 MHz, 180 Watts PEP • Excellent Thermal Stability • Characterized with Series Equivalent Large–Signal Impedance Parameters 470 – 860 MHz, 180 W, 32 V LATERAL N–CHANNEL RF POWER MOSFET CASE 375G–04, STYLE 1 NI–860C3 MAXIMUM RATINGS (1) Symbol Value Unit Drain–Source Voltage Rating VDSS 68 Vdc Gate–Source Voltage VGS – 0.5, +15 Vdc Drain Current – Continuous ID 17 Adc Total Device Dissipation @ TC = 25°C Derate above 25°C PD 350 2.0 W W/°C Storage Temperature Range Tstg – 65 to +150 °C Operating Junction Temperature TJ 200 °C ESD PROTECTION CHARACTERISTICS Test Conditions Class Human Body Model 1 (Minimum) Machine Model M3 (Minimum) THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction to Case Symbol Max Unit RθJC 0.5 °C/W (1) Each side of device measured separately. NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed. REV 5 MOTOROLA RF DEVICE DATA Motorola, Inc. 2002 MRF372 1 ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit V(BR)DSS 68 — — Vdc Zero Gate Voltage Drain Current (VDS = 32 Vdc, VGS = 0 Vdc) IDSS — — 10 µAdc Gate–Source Leakage Current (VGS = 5 Vdc, VDS = 0 Vdc) IGSS — — 1 µAdc Gate Threshold Voltage (VDS = 10 V, ID = 200 µA) VGS(th) 2 3 4 Vdc Gate Quiescent Voltage (VDS = 32 V, ID = 100 mA) VGS(Q) 2.5 3.5 4.5 Vdc Drain–Source On–Voltage (VGS = 10 V, ID = 3 A) VDS(on) — 0.28 0.45 Vdc Forward Transconductance (VDS = 10 V, ID = 3 A) gfs — 2.6 — S Input Capacitance (Includes Input Matching Capacitance) (VDS = 32 V, VGS = 0 V, f = 1 MHz) Ciss — 260 — pF Output Capacitance (VDS = 32 V, VGS = 0 V, f = 1 MHz) Coss — 69 — pF Reverse Transfer Capacitance (VDS = 32 V, VGS = 0 V, f = 1 MHz) Crss — 2.5 — pF OFF CHARACTERISTICS (1) Drain–Source Breakdown Voltage (VGS = 0 Vdc, ID =10 µA) ON CHARACTERISTICS (1) DYNAMIC CHARACTERISTICS (1) FUNCTIONAL CHARACTERISTICS, NARROWBAND OPERATION (In Motorola MRF372 Narrowband Circuit, 50 ohm system) (2) Common Source Power Gain (VDD = 32 V, Pout = 180 W PEP, IDQ = 2 x 400 mA, f1 = 857 MHz, f2 = 863 MHz) Gps 16 17 — dB Drain Efficiency (VDD = 32 V, Pout = 180 W PEP, IDQ = 2 x 400 mA, f1 = 857 MHz, f2 = 863 MHz) η 33 36 — % IMD — –35 –31 dBc Intermodulation Distortion (VDD = 32 Vdc, Pout = 180 W PEP, IDQ = 2 x 400 mA, f1 = 857 MHz, f2 = 863 MHz) Output Mismatch Stress (VDD = 32 Vdc, Pout = 180 W PEP, IDQ = 2 x 400 mA, f1 = 857 MHz, f2 = 863 MHz, VSWR = 3:1 at all phase angles of test) ψ No Degradation in Output Power TYPICAL CHARACTERISTICS, BROADBAND OPERATION (In Motorola MRF372 Broadband Circuit, 50 ohm system) (2) Common Source Power Gain (VDD = 32 Vdc, Pout = 180 W PEP, IDQ = 2 x 500 mA, f1 = 857 MHz, f2 = 863 MHz) Gps — 14.5 — dB Drain Efficiency (VDD = 32 Vdc, Pout = 180 W PEP, IDQ = 2 x 500 mA, f1 = 857 MHz, f2 = 863 MHz) η — 37 — % Intermodulation Distortion (VDD = 32 Vdc, Pout = 180 W PEP, IDQ = 2 x 500 mA, f1 = 857 MHz, f2 = 863 MHz) IMD — –31 — dBc (1) Each side of device measured separately. (2) Measured in push–pull configuration. MRF372 2 MOTOROLA RF DEVICE DATA TYPICAL CHARACTERISTICS ! % & ! " # & % ! $ Note: Ciss does not include input matching capacitance. Figure 1. Capacitance versus Voltage MOTOROLA RF DEVICE DATA MRF372 3 ! " " # # ' " ! ( ) ! Figure 2. 860 MHz Narrowband DC Bias Networks Table 1. 860 MHz Narrowband DC Bias Networks Component Designations and Values ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Designation MRF372 4 Description C1 2.2 pF Chip Capacitor, B Case, ATC C2 0.5 — 5.0 pF Variable Capacitor, B Case, Johansen Gigatrim C3A, B 22 mF, 22 V Tantalum Chip Capacitors, Kemet #T491D226K22AS C4A, B, C14A, B 47.0 pF Chip Capacitors, B Case, ATC C5A, B 100 pF Chip Capacitors, B Case, ATC C6 10.0 pF Chip Capacitor, B Case, ATC C7A, B 2.7 pF Chip Capacitors, A Case, ATC C8A, B 1.0 mF, 100 V Chip Capacitors, Vitramon #VJ3640Y105KXBAT C9 10.0 pF Chip Capacitor, B Case, ATC C10A, B 2.2 mF, 100 V Chip Capacitors, Vitramon #VJ3640Y225KXBAT C11 5.1 pF Chip Capacitor, B Case, ATC C12A, B 0.01 mF, 100 V Chip Capacitors, Kemet #VJ1210Y103KXBAT C13 3.9 pF Chip Capacitor, B Case, ATC C15 1.2 pF Chip Capacitor, B Case, ATC L1A, B 130 nH, Coilcraft #132–11SM L2A, B #24 AWG, 3 Turns Loose, Fair Rite #2643706001 L3A, B 3.85 nH, Coilcraft #0906–4 L4A, B 5.0 nH, Coilcraft #A02T R1A, B, R2A, B R4A, B, R5A, B 180 Ω, 1/4 W Chip Resistors, Vishay Dale (1210) R3A, B 12 Ω, 1/8 W Chip Resistors, Vishay Dale (1206) PCB MRF372 Printed Circuit Board Rev 1a, Rogers RO4350, Height 30 mils, ε& = 3.48 Balun A, B Vertical 860 MHz Broadband Balun, Printed Circuit Board Rev 01, Rogers RO3010, Height 50 mils, ε& = 10.2 MOTOROLA RF DEVICE DATA ! " ! ( " # # " # ! ) # $ ! "* "* * ? #* !* "* * * !* (* #* #* * )* " #* !* * 2")! < Vertical Balun Mounting Detail ,, ! !6 %0. .&%& 2%%&%/ &/ ($ 234 */, %5& " ./ 01 ,, !6 %0. .&%& +* ,-& " ./ 01 %8 &. */, +* % 0 " ./ 9-9 : % 0 . +* ;/%9 &,/5 */, %/7& 7 -5 /</ =0 0 +* ,-& %/7& 7 =0 :,//> &76 , %0. .&%& &%,7 ./ /% , %, % */, Figure 3. 860 MHz Narrowband Component Layout MOTOROLA RF DEVICE DATA MRF372 5 TYPICAL TWO–TONE NARROWBAND CHARACTERISTICS " ! ! ! h " " # 2 # 22 7* ! " hCD + @7* A "! 7 B A 6$ ! F 2%7 $# B2 7* +1E<56 % +%, + + @ @ 6 %8 2 .,&7 ,5 / 2&1& 20%76 Figure 4. COFDM Performance (860 MHz) # ! " ! ! " h ! " # 2 # ( + @7* hCD + @7* " ! 22 7* A "! 7 B A 6$ $ 7* +1E<56 % B A 6$ 6! $ # ( . # . A "! 7 : A () 234 :! A ($" 234 ! +%, + + @ @ 6 %8 +%, + + @ @ ++ 2 .,&7 ,5 / 2&1& 20%76 Figure 6. Power Gain versus Output Power # ! A "! 7 : A () 234 :! A ($" 234 B A # . ! " ( . " 6! # # # η CD 22 7* Figure 5. 8–VSB Performance (860 MHz) +%, + + @ @ ++ Figure 7. Intermodulation Distortion versus Output Power MRF372 6 " A "! 7 B A ( . : A () 234 :! A ($" 234 " ! ! 6$ +%, + + @ @ ++ Figure 8. Drain Efficiency versus Output Power MOTOROLA RF DEVICE DATA G% A Ω G%,& : A (# 234 : A () 234 : A (# 234 : A () 234 G/%7 A "! B A ( . +%, A ( @ ++ f MHz Zload Ω Zsource Ω 845 3.99 + j2.50 5.63 – j0.38 860 3.56 + j1.98 5.28 – j0.43 875 3.18 + j1.46 4.94 – j0.56 Harmonics f GHz Zsource Ω Zload Ω 1.69 2.85 – j14.30 1.23 – j9.37 1.72 3.27 – j14.32 1.54 – j9.60 1.75 3.35 – j14.36 1.73 – j9.62 Zsource = Test circuit impedance as measured from gate to gate, balanced configuration. Zload = Test circuit impedance as measured from drain to drain, balanced configuration. , 205 =%&1 ' < 7& Z source ,, 205 =%&1 ' Z load Figure 9. Narrowband Series Equivalent Input and Output Impedance MOTOROLA RF DEVICE DATA MRF372 7 ! $ " ? ?* ' ? ( ' ) " ! ) ( ) $ # Figure 10. 470–860 MHz Broadband DC Bias Networks Table 2. 470–860 MHz Broadband DC Bias Networks Component Designations and Values ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Designation MRF372 8 Description C1 0.7 pF Chip Capacitor, B Case, ATC C2, C13 0.8 — 8.0 pF Variable Capacitors, Johansen Gigatrim C3A, B, C14A, B, C, D 100 pF Chip Capacitors, B Case, ATC C4 4.7 pF,Chip Capacitor, B Case, ATC C5 7.5 pF Chip Capacitor, B Case, ATC C6 10.0 pF Chip Capacitor, B Case, ATC C7A, B 6.2 pF Chip Capacitors, A Case, ATC C8A, B 22 mF, 22 V Tantalum Chip Capacitors, Kemet #T491D226K22AS C9A, B 0.1 mF, 100 V Chip Capacitors, Vitramon #VJ3640Y104KXBAT C10 13 pF Chip Capacitor, B Case, ATC C11 6.8 pF Chip Capacitor, B Case, ATC C12 3.9 pF Chip Capacitor, B Case, ATC C15A, B 3.3 pF Chip Capacitors, B Case, ATC C16A, B 10 mF, 35 V Tantalum Chip Capacitors, Kemet #T491D106K35AS C17A, B 3.3 mF, 100 V Chip Capacitors, Vitramon #VJ3640Y335KXBAT C18A, B 0.01 mF Chip Capacitors, B Case, ATC L1A, B 12.55 nH, Coilcraft #1606–10 L2A, B 5.45 nH, Coilcraft #0906–5 L3A, B, C 12.5 nH, Coilcraft #A04T R1A, B 10 Ω, 1/4 W Chip Resistors, Vishay Dale (1210) R2A, B 2.2 kΩ, 1/4 W Chip Resistors, Vishay Dale (1210) R3A, B, R10A, B 390 Ω, 1/8 W Chip Resistors, Vishay Dale (1206) R4TA, B 520 Ω, Thermistor, Vishay #NTHS—1206J14520R5% R5A, B 6.2 Ω, 1/4 W Chip Resistors, Vishay Dale (1210) R6A, B 6.8 kΩ, 1/4 W Chip Resistors, Vishay Dale (1210) R7 100 kΩ Potentiometer, Bourns R8 47.3 kΩ, 1/8 W Chip Resistor, Vishay Dale (1206) R9A, B, C, D 180 Ω, 1/4 W Chip Resistors, Vishay Dale (1210) PCB MRF372 Printed Circuit Board Rev 1a, Rogers RO4350, Height 30 mils, ε& = 3.48 Balun A, B Vertical 660 MHz Broadband Balun, Printed Circuit Board Rev 01, Rogers RO3010, Height 50 mils, ε& = 10.2 MOTOROLA RF DEVICE DATA ( $ ( # ! ! ? " ) " # $ * " ?* "* "* * !* !* * ?* $* ( ? ! ! (* )* "* $ ) ? " # #* " ? # # * (* )* ) #* * $* 2")! <6 Vertical Balun Mounting Detail ,, ! !6 %0. .&%& 2%%&%/ &/ $$ 234 */, %5& " ./ 01 ,, !6 %0. .&%& +* ,-& " ./ 01 %8 &. */, +* % 0 " ./ ;-9 : % 0 . +* ;/%9 &,/5 */, %/7& 7 -5 /</ =0 0 +* ,-& %/7& 7 =0 :,//> &76 , %0. .&%& &%,7 ./ /% , %, % */, Figure 11. 470–860 MHz Broadband Component Layout MOTOROLA RF DEVICE DATA MRF372 9 TYPICAL TWO–TONE BROADBAND CHARACTERISTICS ( 22 7* + @7* ! A "! 7 B A 6 : :! A $ 234 $ A $$ 234 # #) 234 ($ 234 ! ! A "! 7 B A 6 : :! A $ 234 ! " # $$ 234 # ($ 234 2 A #) 234 " +%, + + @ @ ++ +%, + + @ @ ++ Figure 12. Power Gain versus Output Power Figure 13. Intermodulation Distortion versus Output Power # A "! 7 B A 6 : :! A $ 234 h CD # " h A ($ 234 " ! $$ 234 #) 234 ! +%, + + @ @ ++ Figure 14. Drain Efficiency versus Output Power MRF372 10 MOTOROLA RF DEVICE DATA G% A Ω G% A Ω : A #) 234 : A #) 234 G/%7 G%,& : A ($ 234 : A ($ 234 A "! B A 6 +%, A ( @ ++ f MHz Zload Ω Zsource Ω 470 4.46 + j2.57 4.88 + j3.50 560 6.40 – j1.06 5.45 + j0.07 660 7.84 – j0.14 8.13 – j0.73 760 6.67 – j0.46 8.27 + j1.00 860 6.25 – j0.31 7.52 – j0.02 Zsource = Test circuit impedance as measured from gate to gate, balanced configuration. Zload = Test circuit impedance as measured from drain to drain, balanced configuration. , 205 =%&1 ' < 7& Z source ,, 205 =%&1 ' Z load Figure 15. Broadband Series Equivalent Input and Output Impedance MOTOROLA RF DEVICE DATA MRF372 11 PACKAGE DIMENSIONS 4 G R 2 * 2 Q --- 2X L 2 J 2 2 * 2 (LID) 2 1 B 8 6 2 8 36 !6 + 2 + 2 C#62??#6 "6 2 3 * 2 6" 6)$! @C 2 +F * C6 #6 22 * 2 6# !(6?$ * "2 @6 (FLANGE) 5 4X S 2 4 B (INSULATOR) --- 3 K 4X 2 * 2 D --- 2 2 2 * 2 2 * 2 F N (LID) E M H C (INSULATOR) --- 2 A 2 * 2 A T SEATING PLANE DIM A B C D E F G H J K L M N Q R S bbb ccc INCHES MIN MAX 6"" 6"# 6"( 6"? 6( 6!!# 6"! 6"" 6$ 6) 6# 6$ 6* 6?) 6) 6!!* 6" 6$ 6#!* 6(! 6($( 6( 6($? 6( 6"( 6"? 6# 6"?# 6#$ 6 6 C 8 + 6 !6 "6 #6 6 MILLIMETERS MIN MAX ""6? "#6$ ?6$ ?6? #6) 6$? (6!$ (6 6! 6)( 6 6 !)6?#* !6#$ !6)! 6"?)* "6#" #6? 6(* !6$# !!6 !6$! !!6) "6 "6" 6" 6!? 6 6" 6! 6"( CASE 375G–04 ISSUE E NI–860C3 Motorola reserves the right to make changes without further notice to any products herein. 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MOTOROLA and the logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334 Technical Information Center: 1–800–521–6274 HOME PAGE: http://www.motorola.com/semiconductors/ MRF372 12 ◊ MRF372/D MOTOROLA RF DEVICE DATA This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.