Order this document by MRF859/D SEMICONDUCTOR TECHNICAL DATA The RF Line Designed for 24 Volt UHF large–signal, common emitter, class A linear amplifier applications in industrial and commercial equipment operating in the range of 800 to 960 MHz. • Specified for VCE = 24 Vdc, IC = 0.9 Adc Characteristics Output Power = 6.5 Watts CW Minimum Power Gain = 11.5 dB Minimum ITO = + 47 dBm Typical Noise Figure = 6 dB • Characterized with Small–Signal S–Parameters and Series Equivalent Large–Signal Parameters from 800 to 960 MHz • Silicon Nitride Passivated • 100% Tested for Load Mismatch Stress at All Phase Angles with 30:1 VSWR @ 24 Vdc, IC = 0.9 Adc and Rated Output Power • Will Withstand RF Input Overdrive of 2 W CW • Gold Metallized, Emitter Ballasted for Long Life and Resistance to Metal Migration • Circuit Board Photomaster Available by Ordering Document MRF859PHT/D from Motorola Literature Distribution. CLASS A 800 – 960 MHz 6.5 W (CW), 24 V NPN SILICON RF POWER TRANSISTOR CASE 319–07, STYLE 2 MRF859 CASE 319A–02, STYLE 2 MRF859S MAXIMUM RATINGS Rating Symbol Value Unit Collector–Emitter Voltage VCEO 30 Vdc Collector–Base Voltage VCBO 55 Vdc Emitter–Base Voltage VEBO 4 Vdc Total Device Dissipation @ TC = 60°C Derate above 60°C PD 34 0.24 Watts W/°C Operating Junction Temperature TJ 200 °C Tstg – 65 to +150 °C Symbol Max Unit RθJC 3.9 °C/W Storage Temperature Range THERMAL CHARACTERISTICS Characteristic Thermal Resistance (TJ = 150°C, TC = 60°C) ELECTRICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit Collector–Emitter Breakdown Voltage (IC = 25 mA, IB = 0) V(BR)CEO 28 32 — Vdc Collector–Emitter Breakdown Voltage (IC = 25 mA, VBE = 0) V(BR)CES 55 75 — Vdc Collector–Base Breakdown Voltage (IC = 25 mA, IE = 0) V(BR)CBO 55 75 — Vdc Emitter–Base Breakdown Voltage (IE = 5 mA, IC = 0) V(BR)EBO 4 5 — Vdc ICES — — 2 mA OFF CHARACTERISTICS Collector Cutoff Current (VCB = 15 V, IE = 0) (continued) Teflon is a registered trademark of du Pont de Nemours & Co., Inc. REV 2 RF DEVICE DATA MOTOROLA Motorola, Inc. 1995 MRF859 MRF859S 1 ELECTRICAL CHARACTERISTICS — continued Characteristic Symbol Min Typ Max Unit hFE 20 60 120 — Cob 13 — 26 pF Common–Emitter Power Gain (VCE = 24 V, IC = 0.9 A, f = 840– 900 MHz, Pout = 6.5 W) Pg 11.5 13 — dB Load Mismatch (VCE = 24 V, IC = 0.9 A, f = 840 MHz, Pout = 6.5 W, Load VSWR = 30:1, All Phase Angles) ψ ON CHARACTERISTICS DC Current Gain (IC = 1 A, VCE = 5 V) DYNAMIC CHARACTERISTICS Output Capacitance (VCB = 24 V, f = 1 MHz) FUNCTIONAL CHARACTERISTICS RF Input Overdrive (VCE = 24 V, IC = 0.9 A, f = 840 MHz) No degradation No Degradation in Output Power Pin(over) — — 2 W Third Order Intercept Point (VCE = 24 V, IC = 0.9 A, f1 = 900 MHz, f2 = 900.1 MHz, Meas. @ IMD 3rd Order = –40 dBc) ITO + 47 + 48 — dBm Noise Figure (VCE = 24 V, IC = 0.9 A, f = 900 MHz) NF — 6 — dB Input Return Loss (VCE = 24 V, IC = 0.9 A, f = 840– 900 MHz, Pout = 6.5 W) IRL — — –9 dB Table 1. Common Emitter S–Parameters S11 S21 S12 S22 VCE (V) IC (A) f (MHz) |S11| ∠φ |S21| ∠φ |S12| ∠φ |S22| ∠φ 24 0.9 800 820 840 860 880 900 920 940 960 0.906 0.902 0.897 0.894 0.893 0.893 0.894 0.897 0.903 170 170 171 171 171 171 172 172 172 1.022 1.022 1.018 1.012 1.005 0.988 0.962 0.924 0.884 12 7 3 –3 –8 – 14 – 20 – 26 – 32 0.016 0.015 0.013 0.011 0.009 0.007 0.005 0.008 0.004 11 8 6 4 3 5 14 47 102 0.804 0.823 0.845 0.870 0.895 0.920 0.946 0.969 0.987 – 168 – 167 – 167 – 167 – 168 – 168 – 169 – 170 – 172 Table 2. Zin and ZOL* versus Frequency f (MHz) 840 870 900 Zin (Ohms) 1.6 1.5 2.2 ZOL* (Ohms) 3.3 3.6 3.5 2 1.6 1.7 – 4.1 – 3.3 – 2.7 VCE = 24 V, IC = 0.9 A, Po = 6.5 W ZOL* = Conjugate of optimum load impedance into which the device operates at a given output power, voltage and frequency. MRF859 MRF859S 2 MOTOROLA RF DEVICE DATA + F1 R8 R1 R2 VCE V SUPPLY C1 Q1 Q2 R3 R4 R5 R7 + C2 C3 C4 L3 B1 R6 B2 C16 C7 + C5 C6 L1 L2 TL1 DUT C9 C8 TL4 C15 INPUT TL5 OUTPUT C12 C10 C11 TL2 C13 C14 0.880″ TL3 SB1 B1, B2 C1 C2, C5 C3, C6 C4 C7, C16 C8, C15 C9, C10 C11 C12, C13, C14 F1 L1, L2 L3 Q1 Q2 Ferrite Bead, Ferroxcube (56–390–65/3B) 250 µF, 50 Vdc, Electrolytic Capacitor 10 µF, 50 Vdc, Electrolytic Capacitor 0.1 µF, Chip Capacitor 1000 pF, Chip Capacitor 100 pF, Chip Capacitor 43 pF, 100 Mil Chip Capacitor 6.8 pF, Mini–Unelco 18 pF, Mini–Unelco 0.8 – 8.0 pF, Johanson Gigatrim 3 Amp Micro–Fuse 3 Turns, 18 AWG, 0.170″ ID 12 Turns, 22 AWG, 0.150″ ID (10 Ω 1/2 W Resistor) MMBT2222ALT1, NPN Transistor BD136, PNP Transistor R1 R2 R3 R4 R5 R6 R7 R8 SB1 TL1, TL5 TL2 TL3 TL4 Board V Supply VCE 470 Ω, 1/4 W 500 Ω Potentiometer, 1/4 W 4.7K Ω, 1/4 W 2 x 4.7K Ω, 1/4 W 50 Ω, 2 W 75 Ω, 1/4 W 4.7 Ω, 1/4 W 4 Ω, 10 W Copper Block 0.550″ x 0.180″ x 0.050″ 50 Ω, Microstrip Transmission Line Microstrip Transmission Line Microstrip Transmission Line Microstrip Transmission Line 0.030″ Glass–Teflon 2 oz. Cu, εr = 2.55 + 27.6 Vdc ± 0.5 Vdc Due to Resistor Tolerance + 24 Vdc @ 0.9 A Figure 1. MRF859 Class A RF Test Fixture Schematic MOTOROLA RF DEVICE DATA MRF859 MRF859S 3 TYPICAL CHARACTERISTICS 15 4 Gpe 3.5 3 14 VCC = 24 Vdc IC = 900 mA Pout = 6.5 W (CW) 13.5 2.5 2 13 VSWR in , INPUT VSWR G pe , POWER GAIN (dB) 14.5 1.5 12.5 VSWR 12 830 840 850 860 870 880 f, FREQUENCY (MHz) 890 1 910 900 Figure 2. Performance in Broadband Circuit 15 Gpe 12 2500 14 VCC = 24 Vdc IC = 900 mA f = 870 MHz 8 12 11 6 Pout 4 10 IC (mAdc) 2000 13 10 G pe , POWER GAIN (dB) Pout , OUTPUT POWER (WATTS) 14 1500 TJ = 150°C Tf = 60°C 1000 500 9 2 0 8 0.2 0 1 1.2 1.4 0.6 0.8 Pin, INPUT POWER (WATTS) 0.4 1.6 1.8 0 2 0 2 4 6 Figure 3. Output Power & Power Gain versus Input Power 10 12 14 16 18 20 22 24 26 28 30 VCE (Vdc) Figure 4. DC SOA 2500 1500 TJ = 175°C Tf = 60°C 1000 500 MTBF FACTOR (HOURS x AMPS2) 1.00E+09 2000 IC (mAdc) 8 1.02E+08 1.00E+08 2.09E+07 1.00E+07 5.00E+06 1.37E+06 1.00E+06 4.19E+05 1.42E+05 5.24E+04 1.00E+05 2.11E+04 1.00E+04 8.94E+03 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 VCE (Vdc) Figure 5. DC SOA MRF859 MRF859S 4 1.00E+03 100 120 140 160 180 200 220 TJ, JUNCTION TEMPERATURE (°C) 240 260 Figure 6. MTBF Factor versus Junction Temperature MOTOROLA RF DEVICE DATA R3 R2 R1 Q1 C5 + R5 R7 R6 C6 Q2 R8 R4 B2 C4 L3 B1 + C2 C7 C16 C3 C1 L1 C9 L2 C8 C12 C15 C10 C11 C13 C14 SB1 MRF859 Figure 7. MRF859 Test Fixture Component Layout Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA RF DEVICE DATA MRF859 MRF859S 5 PACKAGE DIMENSIONS Q 2 PL -AL IDENTIFICATION NOTCH 6 0.15 (0.006) 5 M T A M N M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 -N1 2 3 DIM A B C D E F H J K L N Q K F D 2 PL 0.38 (0.015) M B 0.38 (0.015) T A M N M T A M M N M INCHES MIN MAX 0.965 0.985 0.355 0.375 0.230 0.260 0.115 0.125 0.102 0.114 0.075 0.085 0.160 0.170 0.004 0.006 0.090 0.110 0.725 BSC 0.225 0.241 0.125 0.135 MILLIMETER MIN MAX 24.52 25.01 9.02 9.52 5.85 6.60 2.93 3.17 2.59 2.90 1.91 2.15 4.07 4.31 0.11 0.15 2.29 2.79 18.42 BSC 5.72 6.12 3.18 3.42 J STYLE 2: PIN 1. 2. 3. 4. 5. 6. C H E -T- SEATING PLANE EMITTER (COMMON) BASE (INPUT) EMITTER (COMMON) EMITTER (COMMON) COLLECTOR (OUTPUT) EMITTER (COMMON) CASE 319–07 ISSUE M MRF859 IDENTIFICATION NOTCH A 6 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. K 4 B 1 2 DIM A B C D F H J K 3 F D J C SEATING PLANE H INCHES MIN MAX 0.355 0.365 0.225 0.235 0.110 0.125 0.115 0.125 0.075 0.085 0.035 0.045 0.004 0.006 0.090 0.110 STYLE 2: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 9.02 9.27 5.72 5.96 2.80 3.17 2.93 3.17 1.91 2.15 0.89 1.14 0.11 0.15 2.29 2.79 EMITTER BASE EMITTER EMITTER COLLECTOR EMITTER CASE 319A–02 ISSUE B MRF859S How to reach us: USA / EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 MFAX: [email protected] – TOUCHTONE (602) 244–6609 INTERNET: http://Design–NET.com HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MRF859 MRF859S 6 ◊ *MRF859/D* MOTOROLA RF DEVICEMRF859/D DATA