STMICROELECTRONICS 5NB90

STP5NB90
STP5NB90FP
N - CHANNEL 900V - 2.3 Ω - 5A - TO-220/TO-220FP
PowerMESH MOSFET
PRELIMINARY DATA
TYPE
ST P5NB90
ST P5NB90FP
■
■
■
■
■
V DSS
R DS(on)
ID
900 V
900 V
< 2.5 Ω
< 2.5 Ω
5 A
5 A
TYPICAL RDS(on) = 2.3 Ω
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
3
DESCRIPTION
Using the latest high voltage MESH OVERLAY
process, STMicroelectronics has designed an
advanced family of power MOSFETs with
outstanding performances. The new patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest RDS(on) per area, exceptional avalanche
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
1
3
2
1
TO-220
2
TO-220FP
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ UNINTERRUPTIBLE POWER SUPPLY(UPS)
■ DC-DC & DC-AC CONVERTERS FOR
TELECOM, INDUSTRIAL AND CONSUMER
ENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
STP5NB90
V DS
V DGR
V GS
Un it
STP5NB90F P
Drain-source Voltage (V GS = 0)
900
V
Drain- gate Voltage (R GS = 20 kΩ)
G ate-source Voltage
900
V
± 30
V
ID
Drain Current (continuous) at Tc = 25 o C
5
5(*)
A
ID
Drain Current (continuous) at Tc = 100 oC
3.1
3.1(*)
A
I DM (•)
P tot
dv/dt( 1 )
20
20
A
T otal Dissipation at Tc = 25 C
Drain Current (pulsed)
125
40
W
Derating Factor
1.0
0.32
W /o C
V/ns
o
Peak Diode Recovery voltage slope
4.5
4.5
V ISO
Insulation W ithstand Voltage (DC)

2000
Ts tg
Storage Temperature
Tj
Max. Operating Junction Temperature
(•) Pulse width limited by safe operating area
(*) Limited only by maximum temperature allowed
September 1998
V
-65 to 150
o
C
150
o
C
( 1) ISD ≤5 Α, di/dt ≤ 200 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
1/6
STP5NB90/FP
THERMAL DATA
R thj -case
Thermal Resistance Junction-case
R thj -amb
R thc-sink
Tl
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature For Soldering Purpose
TO-220
TO220-FP
1
3.13
Max
62.5
0.5
300
o
C/W
o
C/W
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symbo l
Parameter
IAR
Avalanche Current, Repetitive or Not-Repetitive
E AS
Single Pulse Avalanche Energy
(starting Tj = 25 o C, I D = IAR , VDD = 50 V)
Max Valu e
Unit
5
A
318
mJ
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbo l
V (BR)DSS
I DSS
IGSS
Parameter
Drain-source
Breakdown Voltage
Test Con ditions
I D = 250 µA
T yp.
Max.
900
V GS = 0
V DS = Max Rating
Zero G ate Voltage
Drain Current (V GS = 0) V DS = Max Rating
Gate-body Leakage
Current (VDS = 0)
Min.
Unit
V
o
T c = 125 C
V GS = ± 30 V
1
50
µA
µA
± 100
nA
ON (∗)
Symbo l
Parameter
Test Con ditions
ID = 250 µA
V GS(th)
Gate Threshold
Voltage
R DS(on)
Static Drain-source O n V GS = 10V
Resistance
I D(o n)
V DS = V GS
Min.
T yp.
Max.
Unit
3
4
5
V
2.3
2.5
Ω
ID = 2.5 A
On State Drain Current V DS > ID(o n) x R DS(on )ma x
V GS = 10 V
5
A
DYNAMIC
Symbo l
g f s (∗)
C iss
C os s
C rss
2/6
Parameter
Test Con ditions
Forward
Transconductance
V DS > ID(o n) x R DS(on )ma x
Input Capacitance
Output Capacitance
Reverse T ransfer
Capacitance
V DS = 25 V
f = 1 MHz
I D = 2.5 A
V GS = 0
Min.
T yp.
2.5
4.1
1250
128
13
Max.
Unit
S
1625
170
20
pF
pF
pF
STP5NB90/FP
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbo l
Parameter
Test Con ditions
t d(on)
tr
Turn-on Time
Rise Time
V DD = 450 V
R G = 4.7 Ω
Qg
Q gs
Q gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD =720 V
Min.
ID = 2.5 A
VGS = 10 V
ID =5 A V GS = 10 V
T yp.
Max.
Unit
18
9
26
13
ns
ns
33
10
13
47
nC
nC
nC
T yp.
Max.
Unit
13
10
17
18
14
24
ns
ns
ns
T yp.
Max.
Unit
5
20
A
A
SWITCHING OFF
Symbo l
tr (Voff)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Con ditions
Min.
V DD = 720 V ID =5 A
R G = 4.7 Ω V GS = 10 V
SOURCE DRAIN DIODE
Symbo l
ISD
I SDM (•)
V SD (∗)
t rr
Q rr
I RRM
Parameter
Test Con ditions
Min.
Source-drain Current
Source-drain Current
(pulsed)
Forward On Voltage
I SD = 5 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 5 A di/dt = 100 A/µs
T j = 150 o C
V DD = 100 V
V GS = 0
1.6
V
700
ns
5.4
µC
16
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
3/6
STP5NB90/FP
TO-220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
0.050
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
G1
2.4
2.7
0.094
0.106
H2
10.0
10.40
0.393
0.409
14.0
0.511
L2
16.4
L4
0.645
13.0
0.551
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
L9
3.5
3.93
0.137
0.154
DIA.
3.75
3.85
0.147
0.151
D1
C
D
A
E
L5
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9
L7
L6
4/6
L4
P011C
STP5NB90/FP
TO-220FP MECHANICAL DATA
mm
DIM.
MIN.
A
4.4
inch
TYP.
MAX.
MIN.
TYP.
MAX.
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L2
16
0.630
28.6
30.6
1.126
1.204
L4
9.8
10.6
0.385
0.417
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L3
L3
L6
F
F1
L7
F2
H
G
G1
¯
1 2 3
L2
L4
5/6
STP5NB90/FP
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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 1998 STMicroelectronics – Printed in Italy – All Rights Reserved
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