STPS0530Z ® SCHOTTKY RECTIFIERS MAIN PRODUCT CHARACTERISTICS IF(AV) 0.5 A VRRM 30 V VF (max) 0.33 V FEATURES AND BENEFITS ■ ■ ■ VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING DESCRIPTION Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. SOD-123 Packaged in SOD-123, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package this device fits GSM and PCMCIA requirements. ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 30 V IF(RMS) RMS forward current 2 A IF(AV) Average forward current δ=0.5 Ta=55°C 0.5 A IFSM Surge non repetitive forward current tp=10ms sinusoidal 5.5 A dV/dt Critical rate of rise of reverse voltage 10000 V/µs - 65 to + 125 °C Tstg * : Storage temperature range Tj Maximum operating junction temperature * 125 °C TL Maximum temperature for soldering during 10s 260 °C dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) March 2003 - Ed : 1A 1/5 STPS0530Z THERMAL RESISTANCE Symbol Rth (j-a) Parameter Junction to ambient Value Unit 340 * °C/W (*) Copper area on PCB S = 2.5mm² STATIC ELECTRICAL CHARACTERISTICS Value Symbol Parameter Tests conditions STPS0530Z typ. IR * Reverse leakage current Tj = 25°C VR = 15 V Tj = 125°C Tj = 25°C 3 VR = VRRM Tj = 125°C VF ** Forward voltage drop Tj = 25°C 9 IF = 0.1 A Tj = 125°C Tj = 25°C 0.20 IF = 0.5 A Tj=125°C Pulse test : * tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation : P = 0.23 x IF(AV) + 0.18 x IF2(RMS) 2/5 max. 12 µA 5 mA 130 µA 21 mA 0.375 V 0.22 0.43 0.31 Unit 0.33 STPS0530Z Fig. 1: Conduction losses versus average current. Fig. 2: Average forward current versus ambient temperature (δ = 0.5) PF(AV)(W) IF(AV)(A) 0.22 δ = 0.1 δ = 0.05 0.20 δ = 0.2 0.55 δ = 0.5 0.50 0.18 0.45 0.16 δ=1 0.40 0.14 0.35 0.12 0.30 0.10 0.25 0.08 0.20 0.06 Rth(j-a)=340°C/W S=2.5mm² 0.15 T 0.04 0.10 0.02 IF(AV)(A) 0.0 0.1 0.2 0.05 δ=tp/T 0.00 0.3 0.4 tp 0.5 Tamb(°C) 0.00 0.6 Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). 0 25 50 75 100 125 Fig. 4: Relative variation of thermal impedance junction to ambient versus pulse duration. IM(A) Zth(j-a)/Rth(j-a) 4.0 1.0E+00 δ = 0.5 3.5 δ = 0.2 3.0 δ = 0.1 1.0E-01 2.5 2.0 Tamb=25°C 1.5 1.0E-02 Tamb=50°C 1.0 T Single pulse IM Tamb=75°C 0.5 t tp(s) t(s) δ=0.5 0.0 δ=tp/T 1.0E-03 1.E-03 1.E-02 1.E-01 1.E+00 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 tp 1.E+02 Fig. 6: Reverse leakage current versus junction temperature (typical values). IR(mA) IR(mA) 1.E+01 1.E+01 VR=30V Tj=125°C 1.E+00 1.E+00 Tj=100°C Tj=75°C 1.E-01 1.E-01 Tj=50°C 1.E-02 1.E-02 Tj=25°C Tj(°C) VR(V) 1.E-03 1.E-03 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 0 25 50 75 100 125 3/5 STPS0530Z Fig. 7: Junction capacitance versus reverse voltage applied (typical values). Fig. 8: Forward voltage drop versus forward current. C(pF) IFM(A) 1000 2.0 F=1MHz VOSC=30mVRMS Tj=25°C 1.8 Tj=125°C (Maximum values) 1.6 1.4 1.2 100 Tj=25°C (Maximum values) Tj=125°C (Typical values) 1.0 0.8 0.6 0.4 VR(V) 0.2 10 1 10 100 Fig. 9: Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, Cu=35µm, typical values). Rth(j-a)(°C/W) 350 300 250 200 150 100 50 S(mm²) 0 0 4/5 VFM(V) 0.0 10 20 30 40 50 60 70 80 90 100 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 STPS0530Z PACKAGE MECHANICAL DATA SOD-123 DIMENSIONS H A2 A1 b REF. Millimeters Min. Max. A E A D c G Inches Min. 1.45 Max. 0.057 A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053 b 0.55 Typ. 0.022 Typ. c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067 G 0.25 H 3.55 0.01 3.95 0.14 0.156 FOOTPRINT (in millimeters) 4.45 0.65 0.97 2.51 0.97 MARKING ■ ■ Type Marking Package Weight Base qty Delivery mode STPS0530Z Z53 SOD-123 0.01g. 3000 Tape & reel Epoxy meets UL94, V0. Band indicates cathode. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5