STMICROELECTRONICS L3121B

L3121B

Application Specific Discretes
A.S.D.TM
PROGRAMMABLE TRANSIENT VOLTAGE
SUPPRESSOR FOR SLIC PROTECTION
FEATURES
BIDIRECTIONAL FUNCTION WITH VOLTAGE
PROGRAMMABILITY IN BOTH POSITIVE AND
NEGATIVE POLARITIES.
PROGRAMMABLE BREAKDOWN VOLTAGE
UP TO 100 V.
HOLDING CURRENT = 150 mA min.
HIGH SURGE CURRENT CAPABILITY.
IPP = 100A , 10/1000 µs
DESCRIPTION
SIP4
SCHEMATIC DIAGRAM
This device has been especially designed to protect a subscriber line interface circuit (SLIC) with
an integrated ring generator.
Line
Gate P
Used with the recommended application circuit,
each line (TIP and RING) is protected against positive and negative surges. In the positive polarity,
the breakdown voltage is referenced to the + VB ,
and in the negative polarity, the breakdown voltage
is referenced to the -Vbat .
Gate N
Its high surge current capability makes the L3121B
a reliable protectiondevice for very exposed equipment, or when series resistors are very low.
GND
CONNECTION DIAGRAM
May 1999 - Ed:4A
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L3121B
Peak Surge
Voltage
(V)
Voltage
Waveform
(µs)
Current
Waveform
(µs)
Admissible
Ipp
(A)
Necessary
Resistor
(Ω)
ITU-T K20
4000
10/700
5/310
100
-
VDE0433
4000
10/700
5/310
100
-
VDE0878
4000
1.2/50
1/20
100
-
level 4
level 4
10/700
1.2/50
5/310
8/20
100
100
-
FCC Part 68, lightning surge
type A
1500
800
10/160
10/560
10/160
10/560
200
100
-
FCC Part 68, lightning surge
type B
1000
9/720
5/320
25
-
BELLCORE TR-NWT-001089
First level
2500
1000
2/10
10/1000
2/10
10/1000
250
100
-
BELLCORE TR-NWT-001089
Second level
5000
2/10
2/10
250
10
COMPLIES WITH THE
FOLLOWING STANDARDS:
IEC1000-4-5
ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C)
Symbol
Parameter
Value
Unit
Peak pulse current
10/1000 µs
2/10 µs
100
250
A
ITSM
Non repetitive surge peak on-state
current
tp = 10 ms
50
A
VMLG
VMGL
Maximum voltage LINE/GND.
Maximum voltage GATE/LINE.
100
80
V
V
- 40 to + 150
+ 150
°C
°C
260
°C
- 40 to + 85
°C
Value
Unit
80
°C/W
IPP
Tstg
Tj
TL
Top
Storage temperature range
Maximum operating junction temperature
Maximum lead temperature for soldering during 10s
Operating temperature range (see note 1)
Note 1: Variation of electrical parameters is given by curves.
Pulse waveform 10/1000µs
% IPP
100
50
0
tr
tp
t
THERMAL RESISTANCE
Symbol
Rth (j-a)
2/7
Parameter
Junction-to-ambient
L3121B
ELECTRICAL CHARACTERISTICS (Tamb = 25 °C)
Symbol
I
Parameter
IPP
VRM
Stand-off voltage
IRM
Reverse leakage current
VBR
Breakdown voltage
VBO
Breakover voltage
IBO
IH
IH
Holding current
IBO
Breakover current
IPP
Peak pulse current
VGN
IGN, IGP
C
VRM
VBO
VBR
Gate voltage
Triggering gate current
Capacitance
1- OPERATION WITHOUT GATE
IRM @ VRM
Type
max.
VBR @ IR
min.
VBO
@
IBO
IH
C
max.
typ.
max.
min.
max.
note 1
note 2
note 1
L3121B
µA
V
V
mA
V
mA
mA
mA
pF
5
8
60
90
100
1
180
200
500
150
200
2- OPERATION WITH GATE
VGN @ IGN = 200mA
Type
L3121B
IGN @ VAC = 60V
IGP @ VAC = 60V
min.
max.
min.
max.
max.
V
V
mA
mA
mA
0.6
1.8
80
200
180
Note 1 :See the reference test circuits for IH, IBO and VBO parameters.
Note 2 :VR = 5 V, F = 1MHz.
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L3121B
REFERENCE TEST CIRCUIT FOR IBO and VBO parameters:
t p = 20ms
Auto
Transformer
220V/2A
R1
static
relay.
14 0
R2
240
K
220V
Vout
IBO , IH
measure
D.U.T
V BO
measure
Transformer
220V/800V
5A
TEST PROCEDURE :
Pulse Test duration (tp = 20ms):
- For Bidirectional devices = Switch K is closed
- For Unidirectional devices = Switch K is open.
VOUT Selection
- Device with VBO < 200 Volt
- VOUT = 250 VRMS, R1 = 140 Ω.
- Device with VBO ≥ 200 Volt
- VOUT = 480 VRMS, R2 = 240 Ω.
FUNCTIONAL HOLDING CURRENT (IH) TEST CIRCUIT = GO - NOGO TEST.
R
- VP
D.U.T.
VBAT = - 48 V
Surge generator
This is a GO-NOGO Test which allows to confirm the holding current (IH) level in a functional test circuit.
This test can be performed if the reference test circuit can’t be implemented.
TEST PROCEDURE :
1) Adjust the current level at the IH value by short circuiting the line and GND pins of the D.U.T.
2) Fire the D.U.T with a surge Current : Ipp = 10A , 10/1000 µs.
3) The D.U.T will come back to the OFF-State within a duration of 50 ms max.
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L3121B
Fig. 1: Surge peak current versus overload
duration (typical values).
Fig. 2: Typical relative variation of holding current
versus ambient temperature.
IH [Tamb]
IH [Tamb = 25°C]
ITSM(A)
40
1.45
F=50H z
Tj initial=25°C
35
1.30
30
25
1.15
20
15
1.0
10
5
0.85
t(s)
0
1E-2
1E-1
Tamb (°C)
1E+0
1E+1
1E+2
1E+3
Fig. 3: Typical relative variation of breakdown
voltage versus ambient temperature.
0.70
-40
-20
0
20
40
60
80 85
Fig. 4: Junction capacitance versus reverse
applied voltage.
VBR [Tamb]
VBR [Tamb = 25°C]
2.04
IR = 1 mA
2.00
1.06
1.02
0.98
0.94
Tamb (°C)
0.90
-40
-20
0
20
40
60
80 85
Fig. 5: Typical relative variation of leakage current
versus ambient temperature.
Fig. 6: Typical relative variation of peak pulse
current (10/1000µs) versus ambient temperature.
Ipp[Tamb] / Ipp [25°C]
IR[Tj] / IR [Tj=25°C]
1.10
1E+5
1E+4
1.05
1E+3
1.00
1E+2
0.95
1E+1
Tj(°C)
1E+0
25
50
75
Tamb(°C)
100
125
0.90
-40 -30 -20 -10 0
10 20 30 40 50 60 70 80
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L3121B
Typical Slic Protection Concept.
-Vbat +VB
LINE
R1
-Vbat
R3
GN
L3121B
TIP
+VB
GP
SLIC
220nF
GND
220nF
GN
L3121B
R2
L3000N
GP
R4
RING
LINE
GND
ORDER CODE
L3121B
DEVICE CODE
MARKING : Logo, Date Code, Part Number
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L3121B
PACKAGE MECHANICAL DATA
SIP4 (Plastic)
DIMENSIONS
REF.
B
Millimetres
Min.
C
Typ. Max. Min.
A
a1
A
I
2.80
L
b2
Z
c1
e
c2
e3
0.110
1.35
1.75 0.053
0.069
C
3.18
3.43 0.125
0.135
c1
0.38
0.50 0.015
0.020
c2
1.30
0.051
e
2.54
0.100
e3
7.62
0.200
Z
L3121B
0.020
b2
L
Marking
0.400
0.50
I
Ordre code
0.280
10.15
b1
b1
Typ. Max.
7.10
B
a1
Inches
Package
Weight
SIP4
0.55 g
10.50
3.30
0.413
0.130
1.50
Base qty
0.059
Delivery mode
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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