STMICROELECTRONICS LCP150S

LCP150S

Application Specific Discretes
A.S.D.
PROGRAMMABLE TRANSIENT VOLTAGE
SUPPRESSOR FOR SLIC PROTECTION
FEATURES
DUAL PROGRAMMABLE TRANSIENT
SUPPRESSOR
HIGH SURGE CURRENT CAPABILITY.
- IPP = 50A, 10/1000 µs.
- IPP = 60 A, 5/310 µs.
- IPP = 150 A, 2/10 µs.
HOLDING CURRENT = 150 mA min.
LOW GATE TRIGGERING CURRENT :
IGT = 15 mA max.
DESCRIPTION
SIP 4
This device has been especially designed to
protect a subscriber line card interface (SLIC)
against transient overvoltage.
Positive overloads are clipped with two diodes,
while negative surges are suppressed by two
protection thyristors, their breakdown voltage
being is referencedto the -Vbat.
This component presents a very low gate
triggering current (I GT) in order to reduce the
current consumption on the PC board during the
firing phase.
SCHEMATIC DIAGRAM
COMPLIES WITHTHE FOLLOWING STANDARDS:
CCITT - K20
VDE 0433
VDE 0878
FCC part 68
10/700µs
5/310µs
10/700µs
5/200µs
1.2/50µs
1/20µs
2/10µs
2/10µs
BELLCORE
TR-NWT-001089 : 2/10µs
2/10µs
10/1000µs
10/1000µs
CNET
0.5/700µs
0.2/310µs
1kV
25A
2kV
50A
1.5kV
40A
2.5kV
150A(*)
CONNECTION DIAGRAM
2.5kV
150A(*)
1kV
50A(*)
1kV
25A
(*) with series resistors or PTC.
TM: ASD is trademarks of SGS-THOMSON Microelectronics.
February 1998 - Ed: 3
1/6
LCP150S
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C)
Symbol
Parameter
10/1000 µs
5/320 µs
2/10 µs
IPP
Peak pulse current (see note 1)
ITSM
Non repetitivesurge peakon-statecurrent
F = 50 Hz
IGSM
Maximum gate current (half sine wave tp = 10 ms)
VMLG
VMGL
Maximum Voltage LINE/GND
Maximum Voltage GATE/LINE
tp = 10 ms
t=1s
Tstg
Tj
Storage temperature range
Maximum operating junction temperature
TL
Maximum lead temperature for soldering during 10s
Note 1: Pulse waveform
10/1000 µs tr = 10 µs
5/320 µs
tr = 5 µs
2/10 µs
tr = 2 µs,
Value
Unit
50
60
150
A
25
8
A
2
A
- 100
- 80
V
- 55 to + 150
150
°C
°C
260
°C
Value
Unit
80
°C/W
tp = 1000 µs
tp = 320 µs
tp = 10 µs
% I PP
100
50
0
tr
tp
t
THERMAL RESISTANCE
Symbol
Rth (j-a)
Parameter
Junction-to-ambient
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
LCP150S
ELECTRICAL CHARACTERITICS (Tamb = 25°C, unless otherwise specified)
Symbol
I
Parameter
IF
IGT
Gate Trigger Current
IH
IR
Holding Current
Reverse Leakage Current LINE/GND
IRG
Reverse Leakage Current GATE/LINE
VR
Reverse Voltage LINE/GND
Forward Voltage LINE/GND
VF
VGT
VFP
Gate Trigger Voltage
VSGL
Dynamic Switching Voltage
GND/LINE
Vgate
GATE/GND Voltage
VLG
LINE/GND Voltage
Off State Capacitance LINE/GND
C
VF
V SGL
VGL
VR
IR
Peak Forward Voltage LINE/GND
IH
Ipp
1 - PARAMETERS RELATED TO THE DIODE LINE/GND
Symbol
Test Conditions
Max.
Unit
VF
Square pulse, Tp = 500 µs, IF = 5 A
3
V
VFP
Ipp = 40 A, 10/1000µs.
15
V
2 - PARAMETERS RELATED TO PROTECTION THYRISTOR
Symbol
Tests Conditions
IGT
IH
VGND/LINE = -48 V
VGATE= -48 V
VGT
at IGT
IRG
Tc = 25°C
Tc = 70°C
VRG = -75 V
VRG = -75 V
VGATE= -48 V
Note 2
VSGL
Note 2
Min.
Max.
Unit
0.2
150
15
mA
mA
2.5
V
5
50
- 63
µA
µA
V
Max.
Unit
3 - PARAMETERS RELATIVE TO DIODE AND PROTECTION THYRISTOR
Symbol
Tests Conditions
IR
Tc = 25°C
Tc = 70°C
-1 < VGL < -Vbat
-1 < VGL < -Vbat
C
VR = - 3 V
VR = - 48 V
F < 1MHz
F < 1MHz
VR = - 85 V
VR = - 85 V
Min.
5
50
150
80
µA
µA
pF
pF
Note 2 : See test circuit for IH and VSGL.
3/6

LCP150S
Fig. 1 : Surge peak current versus overload
duration (typical values).
ITSM(A)
30
Tj initial = 25°C
25
20
15
10
5
t(s)
0
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
FUNCTIONAL HOLDING CURRENT (IH) TEST CIRCUIT = GO - NOGO TEST.
R
- Vpp
Vbat = - 48V
VSGL
Ipp = 10A,10/1000 s
This is a GO-NOGO Test which allows to confirm the holding current (IH) level in a functional
test circuit.
This test can be performedif the reference test circuit can’t be implemented.
TEST PROCEDURE :
1) Adjust the current level at the IH value by short circuiting the AK of the D.U.T.
2) Fire the D.U.T with a surge Current : Ipp = 10A , 10/1000 µs.
3) The D.U.T will come back to the OFF-State within a duration of 50 ms max.
The VSGL is measured just before firing
4/6

LCP150S
APPLICATION CIRCUIT
Typical SLIC Protection Concept.
RING GENERATOR
- VBAT
PTC
LINE A
T
E
S
T
RING
RELAY
R
E
L
A
Y
S
LINE B
SLIC
220
nF
PTC
LCP150S
THBT200S
FUNCTIONAL DESCRIPTION
LINE A PROTECTION:
- For positive surges versus GND, the diode D1
will conduct.
- For negative surges versus GND, the protection device P1 will trigger at a voltage fixed by
the -VBAT reference.
LINE B PROTECTION:
- For surges on Line B, the operating mode is the
same , D2 or P2 is activated.
A capacitor (C = 220nF) can be added close to
the gate of the LCP15xx, in order to speed up
the triggering.
5/6

LCP150S
MARKING : Logo, Date Code, LCP150S.
ORDER CODE
LCP 150
S
LINE CARD PROTECTION
PACKAGE
S = SIP4 PLASTIC
HOLDING CURRENT : 150 mA
PACKAGE MECHANICAL DATA
SIP 4
DIMENSIONS
REF.
Millimetres
Inches
Min. Typ. Max. Min. Typ. Max.
A
a1
7.10
2.80
B
b1
0.280
0.110
10.15
0.50
0.400
0.020
b2
1.35
1.75 0.053
0.069
c1
e
0.38
0.50 0.015
0.020
e3
I
L
Z
2.54
0.100
7.62
0.200
10.50
3.30
0.413
0.130
1.50
0.059
PACKAGING : Productssuppliedin antistatic tubes.
WEIGHT : 0.55g
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
 1998 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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