STMICROELECTRONICS THDT58S

THDT58S1
THDT58S
TRANSIENT VOLTAGE SUPPRESSOR
FOR SLIC PROTECTION
Application Specific Discretes
A.S.D.
FEATURES
CROWBAR PROTECTION
DUAL ASYMMETRICAL TRANSIENT
SUPPRESSOR
PEAK PULSE CURRENT :
- IPP = 75 A, 10/1000 µs for THDT58S.
- IPP = 35 A, 10/1000 µs for THDT58S1.
HOLDING CURRENT = 150 mA min
BREAKDOWN VOLTAGE = 58 V.
BREAKOVER VOLTAGE = 80V max
SIP 3
DESCRIPTION
This device has been especially designed to
protect subscriber line card interfaces (SLIC)
against transient overvoltages.
Its ion-implanted technology confers its excellent
electrical characteristics.
This is why this device easily fulfils the main
protection standards which are related to the
overvoltages suppression on telecom lines.
The product pinout is compatible with TO202 and
TO220 packages.
COMPLIESWITHTHE FOLLOWING STANDARDS :
CCITT K20 :
VDE 0433 :
VDE 0878 :
CNET I3124:
BELLCORE
TR-NWT-001089 :
10/700 µs
5/310 µs
10/700 µs
5/200 µs
1.2/50 µs
1/20 µs
0.5/700 µs
0.2/310µs
1kV
25A
2kV
45/50A(*)
1.5kV
40A
1kV
25A
10/1000µs
10/1000µs
1kV
35/75A (*)
SCHEMATIC DIAGRAM
NC
1
Tip
2
GND
3
Ring
4
(*) with series resistors or PTC.
TM: ASD is trademarks of SGS-THOMSON Microelectronics.
February 1998 - Ed: 3
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THDT58S / THDT58S1
ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C)
Symbol
Parameter
THDT58S1
THDT58S
Unit
10/1000 µs
8/20 µs
2/10 µs
35
70
80
75
150
A
20
30
A
5
kV/µs
IPP
Peak pulse current (see note 1)
ITSM
Non repetitive surge peak on-state
current (F = 50Hz)
t = 20 ms
dV/dt
Critical rate of rise of off-state
voltage
67% VBR
Tstg
Tj
Storage temperature range
Maximum operating junction temperature
-55 to +150
+150
-40 to +150
+150
°C
°C
TL
Maximum lead temperature for soldering
during 10s
260
260
°C
Note 1 : Pulse waveform :
10/1000µs tr =10µs
5/310µs
tr =5µs
2/10µs
tr =2µs
tp=1000µs
tp=310µs
tp=10µs
% I PP
100
50
0
tr
t
tp
THERMAL RESISTANCES
Symbol
Rth (j-a)
2/7
Parameter
Junction to ambient
Value
Unit
80
°C/W
THDT58S / THDT58S1
ELECTRICAL CHARACTERISTICS (Tamb = 25°C)
Symbol
Parameter
I
IF
VRM
Stand-offvoltage
IRM
Leakage current at VRM
VBR
Breakdown voltage
VBO
Breakover voltage
IH
Holding current
VF
Forward Voltage drop
IBO
Breakover current
IPP
Peak pulse current
C
Capacitance
VBO
VF
VBR
V
VRM
IRM
IH
IBO
Ipp
1 - PARAMETER RELATED TO THE DIODE LINE/GND
Symbol
VF
Test conditions
tp = 500 µs
IF = 5 A
Value
Unit
5
V
2 - PARAMETERS RELATED TO THE PROTECTION THYRISTOR
Type
IRM @ VRM
max.
VBR @ IR
min.
VBO @ IBO
IH
C
max.
min.
note1
min.
note 2
max.
note 3
max.
µA
V
V
mA
V
mA
mA
mA
pF
THDT58S
10
56
58
1
80
150
800
150
400
THDT58S1
10
56
58
1
80
50
800
150
200
Note 1 :
Note 2 :
Note 3 :
See the reference test circuit 1 for IBO and VBO parameters.
See test circuit 2.
VR = 1V, F = 1MHz.
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THDT58S / THDT58S1
REFERENCE TEST CIRCUIT 1 :
t
TEST PROCEDURE :
Pulse Test duration (tp = 20ms):
- For Bidirectional devices = Switch K is closed
- For Unidirectional devices = Switch K is open.
VOUT Selection
- Device with VBO < 200 Volt
- V OUT = 250 VRMS, R1 = 140 Ω.
- Device with VBO ≥ 200 Volt
- VOUT = 480 VRMS, R2 = 240 Ω.
FUNCTIONAL HOLDING CURRENT (IH) TEST CIRCUIT 2
R
VBAT = - 48 V
- VP
D.U.T.
Surge generator
This is a GO-NOGO Test which allows to confirm the holding current (IH) level in a functional
test circuit.
TEST PROCEDURE :
1) Adjust the current level at the IH value by short circuiting the AK of the D.U.T.
2) Fire the D.U.T with a surge Current : Ipp = 10A , 10/1000 µs.
3) The D.U.T will come back off-state within 50 ms max.
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THDT58S / THDT58S1
Fig. 1: Relative variation of holding current
junction temperature.
Fig. 2: Capacitance versus reverse applied
voltage (typical values).
1.0
0.0
Fig. 3: Peak on state voltage versus peak on state
current (typical values).
Fig. 4: Peak forward voltage drop versus peak
forward current (typical values).
2.0
1.0
Fig. 5: Surge peak current versus overload
duration (THDT58S).
Fig. 6: Surge peak current versus overload
duration (THDT58S1).
ITSM(A)
ITSM(A)
40
30
F=50Hz
Tj initial=25°C
F=50Hz
Tj initial=25°C
25
30
20
20
15
10
10
5
t(s)
0
1E-2
1E-1
t(s)
1E+0
1E+1
1E+2
1E+3
0
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
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THDT58S / THDT58S1
APPLICATION CIRCUIT
Typical SLIC protection concept
RING
GENERATOR
- Vbat
PTC
LINE A
TIP
T
E
S
T
RING
RELAY
R
E
L
A
Y
S
RING
THBTXXX
LINE B
SLIC
THDT58S
THDT58S1
PTC
FUNCTIONAL DESCRIPTION
Line A
Tip
D1
P1
D2
P2
Line A Protection =
- For positive Surges versus GND, the
diode D1 will conduct
- For negative Surges versus GND, the
Protection device P1 will trigger at a
maximum voltage equal to the VBO.
Line B Protection =
- For Surges on line B, the operatingmode
is the same, D2 or P2 is activated.
Line B
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Ring
THDT58S / THDT58S1
ORDER CODE
THDT 58
S
1
35A VERSION
Package :
S = SIP3
ASYMETRICAL TRISIL
BREAKDOWN VOLTAGE
MARKING
PACKAGE MECHANICAL DATA.
SIP 3 Plastic
REF.
B
Type
Marking
THDT58S
THDT58S1
THDT58S
THDT58S1
DIMENSIONS
Millimetres
Inches
Min.
Typ. Max. Min.
A
A
I
a1
a2
2.80
1.50
B
a1
a2
L
b1
b2
Z
c1
Typ. Max.
7.10
0.280
0.110
1.90 0.059
0.075
10.15
0.400
b1
b2
1.35
1.75 0.053
0.069
c1
0.38
0.50 0.015
0.020
e
e
e3
e3
I
L
Z
0.50
0.020
2.54
7.62
0.100
0.200
10.50
3.30
0.413
0.130
1.50
0.059
Packaging : Standard packaging is in antistatic tubes
Weight : 0.55g
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
 1998 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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