STPS360B(-TR)/B-1 POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 3A VRRM 60 V VF (max) 2 4 (TAB) 3 0.59 V FEATURES AND BENEFITS 4 NEGLIGIBLE SWITCHING LOSSES LOW FORWARD DROP VOLTAGE LOW CAPACITANCE HIGH REVERSE AVALANCHE SURGE CAPABILITY TAPE AND REEL OPTION : -TR 4 2 3 3 1 1 2 DESCRIPTION High voltage Schottky rectifier suited to Switch Mode Power Supplies and other Power Converters. Packaged in DPAK and IPAK, this device is intended for use in medium voltage operation, and particularly, in high frequency circuitries where low switching losses are required. DPAK STPS360B IPAK STPS360B-1 ABSOLUTE RATINGS (limiting value) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) RMS forward current 6 A IF(AV) Average forward current Tcase = 140°C δ = 0.5 3 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 50 A IRRM Repetitive peak reverse current tp = 2 µs F = 1kHz 1 A Tstg Storage temperature range - 65 to + 150 °C Tj dV/dt Maximum junction temperature Critical rate of rise of reverse voltage July 1998 - Ed : 2B 150 10000 V/µs 1/5 STPS360B(-TR)/B-1 THERMAL RESISTANCES Symbol Parameter Value Junction to case Rth(j-c) Unit °C/W 3.5 STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions IR * Reverse leakage current VF ** Tests Conditions Forward voltage drop Pulse test : Min. Tj = 25°C Tj = 125°C VR = 60 V Tj = 25°C IF = 3 A Tj = 125°C IF = 3 A Typ. Max. Unit µA 3 30 10 mA 0.65 V 0.55 0.59 * tp = 380 µs, δ < 2 % ** tp = 5 ms, δ < 2% To evaluate the maximum conduction losses use the following equation : 2 P = 0.49 x IF(AV) + 0.035 IF (RMS) Typical junction capacitance, VR = 0V F = 1MHz Tj = 25°C C = 700pF Fig. 1: Average forward power dissipation versus average forward current. Fig. 2: Average forward current versus ambient temperature (δ=0.5). PF(av)(W) 2.5 IF(av)(A) δ = 0.1 3.5 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-c) 3.0 δ = 0.05 2.0 2.5 δ= 1 1.5 Rth(j-a)=65°C/W 2.0 1.5 1.0 1.0 T 0.5 0.5 IF(av) (A) 0.0 0.0 2/5 T 0.5 1.0 1.5 2.0 2.5 δ=tp/T 3.0 tp 3.5 0.0 4.0 δ=tp/T 0 25 Tamb(°C) tp 50 75 100 125 150 STPS360B(-TR)/B-1 Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). Fig. 4: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) IM(A) 16 14 12 10 Ta=25°C 8 Ta=50°C 6 4 Ta=100°C IM 2 t t(s) δ =0.5 0 1E-3 1E-2 1E-1 1E+0 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). 1.0 0.9 0.8 0.7 δ = 0.5 0.6 0.5 0.4 δ = 0.2 0.3 δ = 0.1 0.2 Single pulse 0.1 0.0 1E-3 T δ=tp/T tp(s) 1E-2 1E-1 C(pF) 500 1E-2 F=1MHz Tj=25°C Tj=125°C 1E-4 1E+0 Fig. 6: Junction capacitance versus reverse voltage applied (typical values). IR(A) 1E-3 tp Tj=100°C 200 Tj=75°C 100 50 1E-5 Tj=25°C 1E-6 1E-7 20 VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60 Fig. 7: Forward voltage drop versus forward current (maximum values). 10 VR(V) 1 2 5 10 20 50 100 Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (Epoxyprinted circuit board FR4, copper thickness: 35µm). IFM(A) Rth(j-a) (°C/W) 50.0 100 80 Tj=125°C 10.0 Tj=25°C 1.0 60 40 20 VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 S(Cu) (cm ) 0 0 2 4 6 8 10 12 14 16 18 20 3/5 STPS360B(-TR)/B-1 PACKAGE MECHANICAL DATA IPAK DIMENSIONS REF. A E C2 B2 L2 D H L L1 B3 B6 B A1 V1 B5 G 4/5 C A3 A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 V1 Millimeters Inches Min. Typ. Max. Min. 2.2 0.9 0.7 0.64 5.2 2.4 1.1 1.3 0.9 5.4 0.85 0.086 0.035 0.027 0.025 0.204 0.3 0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 10° Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.033 0.035 0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.031 0.039 10° STPS360B(-TR)/B-1 PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. A A1 A2 B B2 C C2 D E G H L2 L4 V2 Millimeters Min. Typ. Max Inches Min. Typ. Max. 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 0.80 0.60 0° 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 0.031 1.00 0.023 8° 0° 0.039 8° FOOT PRINT DIMENSIONS (in millimeters) 6.7 6.7 6.7 3 1.6 1.6 2.3 2.3 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsIbility for the consequences of use of such informationnor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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