STPS2045C ® POWER SCHOTTKY RECTIFIER Table 1: Main Product Characteristics IF(AV) 2 x 10 A VRRM 45 V Tj (max) 175°C VF (typ) 0.57 V A1 K A2 FEATURES AND BENEFITS ■ ■ ■ ■ ■ Very small conduction losses Negligible switching losses Extremely fast switching Insulated package: TO-220FPAB Insulating voltage = 2000V DC Capacitance = 12 pF Avalanche rated A2 A1 K K A2 A1 TO-220AB STPS2045CT I2PAK STPS2045CR DESCRIPTION Dual center tap Schottky rectifier suited for SwitchMode Power Supply and high frequency DC to DC converters. Packaged either in TO-220AB, TO-220FPAB, I2PAK, or D2PAK, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. K K A1 TO-220FPAB STPS2045CFP Table 2: Order Codes Part Number November 2004 A2 A2 A1 D2PAK STPS2045CG Marking STPS2045CT STPS2045CT STPS2045CFP STPS2045CFP STPS2045CG STPS2045CG STPS2045CG-TR STPS2045CG STPS2045CR STPS2045CR REV. 5 1/8 STPS2045C Table 3: Absolute Ratings (limiting values, per diode) Symbol VRRM IF(RMS) Parameter Value Unit Repetitive peak reverse voltage 45 V RMS forward voltage 30 A TO-220AB / Average forward current D2PAK / I2PAK δ = 0.5 TO-220FPAB Tc = 155°C Per diode 10 Tc = 125°C Per device 20 IFSM Surge non repetitive forward current tp = 10ms sinusoidal 180 A IRRM Repetitive peak reverse current tp = 2µs F = 1kHz square 1 A IRSM Non repetitive peak reverse current tp = 100ms square 2 A PARM Repetitive peak avalanche power tp = 1µs Tj = 25°C 4000 W -65 to + 175 °C 175 °C 10000 V/µs IF(AV) Tstg Storage temperature range Tj Maximum operating junction temperature * dV/dt dPtot * : --------------dTj Critical rate of rise of reverse voltage 1 < ------------------------Rth ( j – a ) A thermal runaway condition for a diode on its own heatsink Table 4: Thermal Resistance Parameters Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Value 2.2 1.3 4.5 3.5 0.3 TO-220AB / D PAK / I PAK Per diode Total TO-220FPAB Per diode Total TO-220AB / D2PAK / I2PAK Coupling TO-220FPAB 2 2 Unit °C/W °C/W 2.5 When the diodes 1 and 2 are used simultaneously: Tj(diode 1) = P(diode 1) x Rth(j-c)(per diode) + P(diode 2) x Rth(c) Table 5: Static Electrical Characteristics (per diode) Symbol IR * Parameter Tests conditions Tj = 25°C VR = VRRM Reverse leakage current Tj = 125°C Tj = 125°C VF * Forward voltage drop Tj = 25°C Tj = 125°C Pulse test: Min. IF = 10A Max. 100 Unit µA 7 15 mA 0.5 0.57 0.84 IF = 20A 0.65 * tp = 380 µs, δ < 2% 2 To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.015 IF (RMS) 2/8 Typ 0.72 V STPS2045C Figure 1: Average forward power dissipation versus average forward current (per diode) Figure 2: Average forward current versus ambient temperature (δ = 0.5, per diode) PF(AV)(W) IF(AV)(A) 8 δ = 0.1 δ = 0.05 7 12 δ = 0.2 δ = 0.5 TO-220AB D²PAK Rth(j-a)=Rth(j-c) 10 6 TO-220FPAB 8 δ=1 5 Rth(j-a)=15°C/W 4 6 3 4 T T 2 2 1 IF(AV)(A) δ=tp/T 0 0 1 2 3 4 5 6 7 8 9 10 Figure 3: Normalized avalanche derating versus pulse duration δ=tp/T tp tp Tamb(°C) 0 11 12 power 0 25 50 75 100 125 150 Figure 4: Normalized avalanche derating versus junction temperature PARM(tp) PARM(1µs) 175 power PARM(tp) PARM(25°C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 0 10 1 100 25 1000 Figure 5: Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220AB, D2PAK, I2PAK) 50 75 100 125 150 Figure 6: Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB) IM(A) IM(A) 100 140 120 80 100 60 80 TC=75°C TC=75°C 60 40 TC=100°C 40 20 TC=100°C TC=125°C IM TC=125°C IM 20 t t t(s) δ=0.5 t(s) δ=0.5 0 0 1E-3 1E-2 1E-1 1E+0 1E-3 1E-2 1E-1 1E+0 3/8 STPS2045C Figure 7: Relative variation of thermal impedance junction to ambient versus pulse duration (TO-220AB, D2PAK, I2PAK) Figure 8: Relative variation of thermal impedance junction to ambient versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 0.8 0.8 0.6 0.6 δ = 0.5 δ = 0.5 0.4 0.4 T T δ = 0.2 0.2 δ = 0.2 0.2 δ = 0.1 δ = 0.1 tp(s) Single pulse δ=tp/T 0.0 1E-4 1E-3 1E-2 tp tp(s) Single pulse δ=tp/T 0.0 1E-1 1E+0 Figure 9: Reverse leakage current versus reverse voltage applied (typical values, per diode) 1E-3 1E-2 1E-1 tp 1E+0 1E+1 Figure 10: Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) IR(µA) 1000 5E+4 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1E+4 Tj=125°C Tj=100°C 1E+3 500 Tj=75°C 1E+2 Tj=50°C 1E+1 Tj=25°C 200 1E+0 VR(V) VR(V) 1E-1 100 0 5 10 15 20 25 30 35 40 45 Figure 11: Forward voltage drop versus forward current (maximum values, per diode) 1 2 5 10 20 50 Figure 12: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35µm) (D2PAK) IFM(A) Rth(j-a)(°C/W) 100.0 80 Tj=125°C (typical values) 70 60 10.0 Tj=125°C Tj=25°C 50 40 30 1.0 20 10 S(cm²) VFM(V) 0 0.1 0.0 4/8 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 5 10 15 20 25 30 35 40 STPS2045C Figure 13: D2PAK Package Mechanical Data REF. A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.14 1.70 0.045 0.067 0.45 0.60 0.017 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 10.00 10.40 0.393 0.409 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 2.40 3.20 0.094 0.126 0.40 typ. 0.016 typ. 0° 8° 0° 8° Figure 14: Foot Print Dimensions (in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 5/8 STPS2045C Figure 15: TO-220AB Package Mechanical Data REF. A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 F M G1 E G A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 2.40 2.70 0.094 0.106 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. 13 14 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 Figure 16: I2PAK Package Mechanical Data DIMENSIONS REF. A A E c2 L2 D L1 A1 b2 L b1 b e 6/8 c Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.70 0.044 0.067 b2 1.14 1.70 0.044 0.067 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 E 10.0 10.4 0.394 0.409 L 13.1 13.6 0.516 0.535 L1 3.48 3.78 0.137 0.149 L2 1.27 1.40 0.050 0.055 STPS2045C Figure 17: TO-220FPAB Package Mechanical Data REF. A A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Dia. B H Dia L6 L2 L7 L3 L5 D F1 L4 F2 F E G1 G DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.4 4.6 0.173 0.181 2.5 2.7 0.098 0.106 2.5 2.75 0.098 0.108 0.45 0.70 0.018 0.027 0.75 1 0.030 0.039 1.15 1.70 0.045 0.067 1.15 1.70 0.045 0.067 4.95 5.20 0.195 0.205 2.4 2.7 0.094 0.106 10 10.4 0.393 0.409 16 Typ. 0.63 Typ. 28.6 30.6 1.126 1.205 9.8 10.6 0.386 0.417 2.9 3.6 0.114 0.142 15.9 16.4 0.626 0.646 9.00 9.30 0.354 0.366 3.00 3.20 0.118 0.126 Table 6: Ordering Information Ordering type STPS2045CT STPS2045CR STPS2045CFP STPS2045CG STPS2045CG-TR ■ ■ ■ ■ Marking STPS2045CT STPS2045CR STPS2045CFP STPS2045CG STPS2045CG Package TO-220AB I2PAK TO-220FPAB Weight 2.23 g 1.49 g 2.0 g D2PAK 1.48 g Base qty 50 50 50 50 1000 Delivery mode Tube Tube Tube Tube Tape & reel Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 m.N. Maximum torque value: 1.0 m.N. Table 7: Revision History Date Revision 05-Oct-2004 4F 01-Dec-2004 5 Description of Changes Last update. Figure 16 (I2PAK Package Mechanical Data): references b1 and b2 changed from 1.17mm to 1.70mm. 7/8 STPS2045C Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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