TS420-B/T SENSITIVE SCR FEATURES A IT(RMS) = 4A VDRM/VRRM = 400, 600V, 700V IGT < 200µA SMD PACKAGE A A DESCRIPTION G K The TS420-B/T series of SCR use a high performance TOPGLASS PNPN technology. The parts are intended for general purpose applications using surface mount or through hole technology. K A G TO-220AB (Plastic) TS420-T DPAK (Plastic) TS420-B ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit IT(RMS) RMS on-state current (180° conductionangle) Tc= 115°C 4 A IT(AV) Average on-state current (180° conductionangle) Tc= 115°C 2.5 A ITSM Non repetitive surge peak on-state current tp = 8.3ms 33 A (Tj initial = 25°C ) tp = 10ms 30 I2t Value for fusing tp = 10ms 4.5 A2s I2 t dI/dt Critical rate of rise of on-state current IG = 10 mA dIG /dt = 0.1 A/µs. 100 A/µs T stg Tj Storage junction temperature range Operating junction temperature range - 40 to + 150 - 40 to + 125 °C 260 °C Tl Maximum temperature for soldering during 10s Symbol Parameter VDRM Repetitive peak off-state voltage VRRM Tj = 125°C November 1998 - Ed: 8A TS420- Unit 400B/T 600B/T 700B/T 400 600 700 V RGK = 220 Ω 1/6 TS420-xxxB/T THERMAL RESISTANCES Symbol Rth(j-a) Rth(j-c) Parameter Junction to ambient (S=0.5cm2) Junction to case for DC Value Unit DPAK 70 °C/W TO-220AB 60 DPAK / TO-220AB 3.0 °C/W GATE CHARACTERISTICS (maximum values) PG (AV)= 0.2 W PGM = 3 W (tp = 20 µs) IGM = 1.2 A (tp = 20 µs) ELECTRICAL CHARACTERISTICS Symbol Test Conditions Value Unit IGT VD=12V (DC) RL=33Ω Tj= 25°C MAX 200 µA VGT VD=12V (DC) RL=33Ω Tj= 25°C MAX 0.8 V VGD VD=VDRM RL=3.3kΩ RGK = 220 Ω Tj= 125°C MIN 0.1 V VRG IRG = 10µA Tj= 25°C MIN 8 V IH IT= 50mA Tj= 25°C MAX 5 mA Tj= 25°C MAX 1.6 V RGK = 1 KΩ VTM ITM= 8A tp= 380µs IDRM VD= VDRM RGK = 220 Ω Tj= 25°C MAX 5 mA IRRM VR= VRRM RGK = 220 Ω Tj= 125°C MAX 1 mA dV/dt VD=67%VDRM RGK = 220 Ω Tj= 125°C MIN 5 V/µs Fig. 1: Maximum average power dissipation versus average on-state current. Fig. 2: Correlationbetweenmaximum averagepower dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink + contact. P(W) P(W) 4.0 D.C. Rth=0°C/W 115 Rth=37°C/W 2.5 α = 30° 2.0 120 1.5 1.5 360° 1.0 0.5 0.0 0.0 Rth=10°C/W Rth=5°C/W Rth=15°C/W 3.0 α = 60° 2.5 Tcase (°C) α = 180° 3.5 α = 90° 3.0 2.0 4.0 α = 180° α = 120° 3.5 2/6 Type 0.5 IT(av)(A) 0.5 1.0 1.5 2.0 1.0 α 2.5 0.0 3.0 3.5 Tamb(°C) 0 25 50 75 100 125 125 TS420-xxxB/T Fig. 3-1: Average and DC on-state current versus case temperature (TO-220AB). Fig. 3-2: Average and DC on-state current versus ambient temperature(device mounted on FR4 with recommended pad layout) (DPAK). IT(av)(A) IT(av)(A) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 DC α=180° Tcase(°C) 0 25 50 75 100 125 Fig. 4-1: Relative variation of thermal impedance junction to case versus pulse duration. 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 DC α=180° Tamb(°C) 0 25 50 75 100 125 Fig. 4-2: Relative variation of thermal impedance junction to ambient versus pulse duration. (recomended pad layout) (DPAK). K=[Zth(j-c)/Rth(j-c)] K=[Zth(j-a)/Rth(j-a)] 1.0 1.00 0.5 0.10 0.2 tp(s) 0.1 1E-3 1E-2 tp(s) 1E-1 1E+0 Fig. 5: Relative variation of gate trigger currentand holding current versus junction temperature. IGT,IH [Tj] / IGT,IH [Tj=25°C] 2.0 1.8 IGT 1.6 1.4 1.2 IH 1.0 0.8 0.6 0.4 0.2 Tj(°C) 0.0 -40 -20 0 20 40 60 0.01 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Fig. 6: Non repetitive surge peak on-state current versus number of cycles. ITSM(A) 35 Tj initial=25°C F=50Hz 30 25 20 15 10 5 80 100 120 140 0 Number of cycles 1 10 100 1000 3/6 TS420-xxxB/T Fig. 7: Non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and corresponding value of I2t. Fig. 8: On-statecharacteristics(maximum values). ITM(A) ITSM(A),I t(A s) 50.0 100 Tj initial=25°C ITSM Tj max.: Vto=0.85V Rd=90m Ω 10.0 Tj=Tj max. 10 It 1.0 Tj=25°C tp(ms) 1 1 VTM(V) 2 5 10 Fig. 9: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm) (DPAK). 0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Fig. 10: Typical reflow soldering heat profile, either for mounting on FR4 or metal-backed boards. T (°C) Rth(j-a) (°C/W) 250 100 245°C 215°C 200 80 60 150 40 100 20 Epoxy FR4 board Metal-backed board 50 S(cm ) 0 0 2 4 6 8 10 12 ORDERING INFORMATION TS 14 16 18 20 t (s) 0 4/6 40 80 120 160 200 240 Add ”-TR” suffix for Tape & Reel shipment 4 20 - 600 B/T PACKAGE: B: DPAK T: TO-220 SENSITIVE SCR CURRENT 0 SENSITIVITY VOLTAGE 280 320 360 TS420-xxxB/T PACKAGE MECHANICAL DATA DPAK (Plastic) DIMENSIONS REF. Millimeters Inches Min. Typ. Max Min. Typ. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 B 0.03 0.64 0.23 0.001 0.90 0.025 0.009 0.035 B2 C 5.20 0.45 5.40 0.204 0.60 0.017 0.212 0.023 C2 D 0.48 6.00 0.60 0.018 6.20 0.236 0.023 0.244 E 6.40 6.60 0.251 0.259 G H 4.40 9.35 4.60 0.173 10.10 0.368 0.181 0.397 L2 L4 V2 0.80 0.60 0° 0.031 1.00 0.023 8° 0° 0.039 8° FOOT PRINT DIMENSIONS (in millimeters) 6.7 6.7 6.7 3 1.6 1.6 2.3 2.3 5/6 TS420-xxxB/T PACKAGE MECHANICAL DATA TO-220AB(Plastic) REF. A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 F M G1 Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C D 1.23 2.40 1.32 2.72 0.048 0.094 0.051 0.107 E 0.49 0.70 0.019 0.027 F F1 0.61 1.14 0.88 1.70 0.024 0.044 0.034 0.066 F2 1.14 1.70 0.044 0.066 G G1 4.95 2.40 5.15 2.70 0.194 0.094 0.202 0.106 H2 L2 L4 E G DIMENSIONS Millimeters Inches 10 10.40 16.4 typ. 0.393 0.409 0.645 typ. L4 L5 13 2.65 14 2.95 0.511 0.104 0.551 0.116 L6 15.25 15.75 0.600 0.620 L7 L9 6.20 3.50 6.60 3.93 0.244 0.137 0.259 0.154 M Diam. 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 Type Marking Package Weight Base qty Delivery mode TS420-B TS420x0 DPAK 0.3 g. 75 Tube 2500 Tape and Reel 50 Tube TS420-T TS420x00T TO-220AB 20 g. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsIbility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 1998 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. http://www.st.com 6/6