J174 / J175 / J176 / J177 MMBFJ175 / MMBFJ176 / MMBFJ177 P-Channel Switch Description This device is designed for low-level analog switching sample-and-hold circuits and chopper-stabilized amplifiers. Sourced from process 88. J174 / 175 / 176 / 177(1) MMBFJ175 / 176 / 177 G S S G D D TO-92 SOT-23 Mark: 6W / 6X / 6Y Note: Source & drain are interchangeable. Ordering Information Part Number Top Mark Package Packing Method J175_D26Z J175 TO-92-3L Tape and Reel J176_D74Z J176 TO-92-3L Ammo MMBFJ175 6W SOT-23 3L Tape and Reel MMBFJ176 6X SOT-23 3L Tape and Reel MMBFJ177 6Y SOT-23 3L Tape and Reel Note: 1. J174 & J177 are obsoleted. © 1997 Fairchild Semiconductor Corporation J174 / J175 / J176 / J177 Rev. 1.1.0 www.fairchildsemi.com 1 J174 / J175 / J176 / J177_MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch June 2013 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted. Symbol VDG VGS IGF TJ, TSTG(3) Parameter Drain-Gate Voltage Gate-Source Voltage Forward Gate Current Operating and Storage Junction Temperature Range Ratings Units -30 30 50 -55 to + 150 V V mA °C Notes: 2. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. 3. These ratings are based on a maximum junction temperature of 150°C. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or low duty cycle operations. Thermal Characteristics(4) Values are at TA = 25°C unless otherwise noted. Symbol Maximum Parameter Units J175 - 176 MMBFJ175 - 177 Total Device Dissipation 350 225 mW Derate above 25°C 2.8 1.8 mW/°C RθJC Thermal Resistance, Junction to Case 125 RθJA Thermal Resistance, Junction to Ambient 357 PD °C/W 556 °C/W Note: 4. PCB size: FR-4 76 x 114 x 0.6 T mm3 (3.0” x 4.5” x 0.062”) with minimum land pattern size. © 1997 Fairchild Semiconductor Corporation MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.1.0 www.fairchildsemi.com 2 J174 / J175 / J176 / J177_MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch Absolute Maximum Ratings(2) Values are at TA = 25°C unless otherwise noted. Symbol Parameter Test Condition Min. Max. Units Off Characteristics B(BR)GSS IGSS VGS(off) Gate-Source Breakdown Voltage IG = 1.0 μA, VDS = 0 Gate Reverse Current VGS = 20 V, VDS = 0 Gate-Source Cut-Off Voltage VDS = -15 V, ID = -10 nA 30 V 1.0 nA 174 5.0 10.0 V 175 3.0 6.0 V 176 1.0 4.0 V 177 0.8 2.5 V 174 -20 -100 175 -7.0 -60.0 176 -2.0 -25 177 -1.5 -20.0 On Characteristics IDSS rDS(on) Zero-Gate Voltage Drain Current Drain-Source On Resistance VDS = -15 V, IGS = 0 IC ≤ 50 mA, IB = 5.0 mA © 1997 Fairchild Semiconductor Corporation MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.1.0 174 85 175 125 176 250 177 300 mA Ω www.fairchildsemi.com 3 J174 / J175 / J176 / J177_MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch Electrical Characteristics Figure 1. Common Drain-Source Figure 2. Parameter Interactions Figure 3. Transfer Characteristics Figure 4. Transfer Characteristics Figure 5. Normalized Drain Resistance vs. Bias Voltage Figure 6. Output Conductance vs. Drain Current © 1997 Fairchild Semiconductor Corporation MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.1.0 www.fairchildsemi.com 4 J174 / J175 / J176 / J177_MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch Typical Performance Characteristics Figure 7. Transconductance vs. Drain Current Figure 8. Capacitance vs. Voltage Figure 9. Noise Voltage vs. Frequency Figure 10. Channel Resistance vs. Temperature Figure 11. Power Dissipation vs. Ambient Temperature © 1997 Fairchild Semiconductor Corporation MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.1.0 www.fairchildsemi.com 5 J174 / J175 / J176 / J177_MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch Typical Performance Characteristics (Continued) J174 / J175 / J176 / J177_MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch Physical Dimensions TO-92 D Figure 12. 3-LEAD, TO92, MOLDED, 0.200 IN LINE SPACING LD FORM (J61Z OPTION) (ACTIVE) Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packaging/tr/to92_tr.pdf. © 1997 Fairchild Semiconductor Corporation MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.1.0 www.fairchildsemi.com 6 J174 / J175 / J176 / J177_MMBFJ175 / MMBFJ176 / MMBFJ177 — P-Channel Switch Physical Dimensions (Continued) SOT-23 0.95 2.92±0.20 3 1.40 1.30+0.20 -0.15 1 2.20 2 0.60 0.37 (0.29) 0.95 0.20 1.00 A B 1.90 1.90 LAND PATTERN RECOMMENDATION SEE DETAIL A 1.20 MAX 0.10 0.00 (0.93) 0.10 C C 2.40±0.30 NOTES: UNLESS OTHERWISE SPECIFIED GAGE PLANE 0.23 0.08 A) REFERENCE JEDEC REGISTRATION TO-236, VARIATION AB, ISSUE H. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS ARE INCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR EXTRUSIONS. D) DIMENSIONING AND TOLERANCING PER ASME Y14.5M - 1994. E) DRAWING FILE NAME: MA03DREV10 0.25 0.20 MIN (0.55) SEATING PLANE SCALE: 2X Figure 13. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE (ACTIVE) Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packaging/tr/SOT23-3L_tr.pdf. © 1997 Fairchild Semiconductor Corporation MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.1.0 www.fairchildsemi.com 7 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. FPS¥ F-PFS¥ FRFET® SM Global Power Resource GreenBridge¥ Green FPS¥ Green FPS¥ e-Series¥ Gmax¥ GTO¥ IntelliMAX¥ ISOPLANAR¥ Making Small Speakers Sound Louder and Better™ MegaBuck¥ MICROCOUPLER¥ MicroFET¥ MicroPak¥ MicroPak2¥ MillerDrive¥ MotionMax¥ mWSaver¥ OptoHiT¥ OPTOLOGIC® OPTOPLANAR® 2Cool¥ AccuPower¥ AX-CAP®* BitSiC¥ Build it Now¥ CorePLUS¥ CorePOWER¥ CROSSVOLT¥ CTL¥ Current Transfer Logic¥ DEUXPEED® Dual Cool™ EcoSPARK® EfficientMax¥ ESBC¥ ® Fairchild® Fairchild Semiconductor® FACT Quiet Series¥ FACT® FAST® FastvCore¥ FETBench¥ Sync-Lock™ ® PowerTrench® PowerXS™ Programmable Active Droop¥ QFET® QS¥ Quiet Series¥ RapidConfigure¥ ¥ Saving our world, 1mW/W/kW at a time™ SignalWise¥ SmartMax¥ SMART START¥ Solutions for Your Success¥ SPM® STEALTH¥ SuperFET® SuperSOT¥-3 SuperSOT¥-6 SuperSOT¥-8 SupreMOS® SyncFET¥ ®* TinyBoost¥ TinyBuck¥ TinyCalc¥ TinyLogic® TINYOPTO¥ TinyPower¥ TinyPWM¥ TinyWire¥ TranSiC¥ TriFault Detect¥ TRUECURRENT®* PSerDes¥ UHC® Ultra FRFET¥ UniFET¥ VCX¥ VisualMax¥ VoltagePlus¥ XS™ * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 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A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in cause the failure of the life support device or system, or to affect its accordance with instructions for use provided in the labeling, can be safety or effectiveness. reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I64 © Fairchild Semiconductor Corporation www.fairchildsemi.com Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Fairchild Semiconductor: J176_D27Z J176_D26Z J176_D74Z J176