STS5N15M3 N-channel 150 V, 45 mΩ, 5 A, SO-8 ultra low gate charge MDmesh™ III Power MOSFET Features Type VDSS RDS(on) max ID STS5N15M3 150 V < 0.057 Ω 5A ■ Low on-resistance ■ Low input capacitance and gate charge ■ Low gate input resistance ■ High dv/dt avalanche capabilities SO-8 c u d Application ■ Figure 1. Switching applications o r P Internal schematic diagram e t le Description o s b O - This device is realized with the third generation of MDmesh™ technology. This Power MOSFET associates an improved vertical structure to the company’s strip layout to yield one of the world’s lowest on-resistance and gate charge. It is therefore suitable for the most demanding high efficiency converters. ) s ( ct ) s t( u d o t e l o r P e Table 1. Device summary Order code Marking Package Packaging STS5N15M3 5R15- SO-8 Tape and reel s b O June 2008 Rev 2 1/12 www.st.com 12 Contents STS5N15M3 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuit ................................................ 8 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 c u d e t le ) s ( ct u d o r P e t e l o s b O 2/12 o s b O - o r P ) s t( STS5N15M3 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage (VGS = 0) 150 V VGS Gate-source voltage ± 20 V ID Drain current (continuous) at TC = 25 °C 5 A ID Drain current (continuous) at TC=100 °C 3.2 A IDM(1) Drain current (pulsed) 20 A PTOT Total dissipation at TC = 2 5°C 2.5 W Tstg Storage temperature -55 to 150 °C Tj Operating junction temperature 1. Pulse width limited by safe operating area Table 3. Symbol Rthj-pcb (1) c u d Thermal data Parameter Thermal resistance junction-pcb max e t le 1. When mounted on FR-4 board of 1 inch², 2 oz Cu, t < 10 sec Table 4. o s b O - Avalanche characteristics Symbol Parameter (s) o r P ) s t( Value Unit 50 °C/W Max value Unit IAS Avalanche current, repetitive or not-repetitive (pulse width limited by Tj max) 2.5 A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAS, VDD = 140 V) 1.6 J t c u d o r P e t e l o s b O 3/12 Electrical characteristics 2 STS5N15M3 Electrical characteristics (TJ = 25 °C unless otherwise specified) Table 5. On/off states Symbol V(BR)DSS Parameter Drain-source breakdown voltage IGSS Gate body leakage current (VDS = 0) VGS = ±20 V VGS(th) Gate threshold voltage VDS= VGS, ID = 250 µA RDS(on) Static drain-source on resistance VGS= 10 V, ID= 2.5 A Ciss Coss Crss Qg Parameter Test conditions Input capacitance Output capacitance Reverse transfer capacitance VDS =25 V, f = 1 MHz, VGS = 0 Qgd Rg Gate input resistance Qgs r P e u d o t e l o ct (s) Typ. e t le o s b O - VDD = 75 V, ID = 5 A VGS =10 V Figure 14 on page 8 f=1 MHz Gate DC Bias=0 Test signal level=20 mV open drain Max. 150 1 10 µA µA ±100 nA 4 V 0.057 Ω 2 0.045 c u d o r P Min. Unit V VDS = 150 V, @125 °C Dynamic Total gate charge Gate-source charge Gate-drain charge Min. VDS = 150 V, Zero gate voltage drain current (VGS = 0) Symbol 4/12 ID = 1 mA, VGS= 0 IDSS Table 6. s b O Test conditions Typ. ) s t( Max. Unit 1300 140 20.5 pF pF pF 29 3.6 14.6 nC nC nC 3.7 Ω STS5N15M3 Electrical characteristics Table 7. Switching times Symbol Parameter td(on) tr td(off) tf Table 8. Test conditions Turn-on delay time Rise time Turn-off delay time Fall time Min. Typ. Max. 9 13 46 20 VDD= 75 V, ID= 2.5 A, RG=4.7 Ω, VGS=10 V Figure 13 on page 8 Unit ns ns ns ns Source drain diode Symbol Max Unit Source-drain current 5 A ISDM(1) Source-drain current (pulsed) 20 A VSD(2) Forward on voltage 1.3 V ISD trr Qrr IRRM Parameter Test conditions Typ. ISD = 5 A, VGS = 0 ISD = 5 A, Reverse recovery time Reverse recovery charge Reverse recovery current Figure 15 on page 8 e t le 2. Pulsed: pulse duration=300µs, duty cycle 1.5% 110 498 9.1 c u d di/dt = 100 A/µs, VR = 40 V, TJ = 150 °C 1. Pulse width limited by safe operating area ) s ( ct Min o r P ) s t( ns nC A o s b O - u d o r P e t e l o s b O 5/12 Electrical characteristics STS5N15M3 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 5. Transfer characteristics c u d e t le Figure 6. ) s ( ct t e l o 6/12 o r P o s b O - Normalized BVDSS vs temperature o r P e s b O du ) s t( Figure 7. Static drain-source on resistance STS5N15M3 Figure 8. Electrical characteristics Capacitance variations Figure 9. Figure 10. Normalized gate threshold voltage vs temperature Gate charge vs gate-source voltage Figure 11. Normalized on resistance vs temperature c u d e t le ) s ( ct ) s t( o r P o s b O - Figure 12. Source-drain diode forward characteristics u d o r P e t e l o s b O 7/12 Test circuit 3 STS5N15M3 Test circuit Figure 13. Switching times test circuit for resistive load Figure 14. Gate charge test circuit c u d ) s t( Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test switching and diode recovery times circuit e t le ) s ( ct u d o Figure 17. Unclamped inductive waveform r P e t e l o s b O 8/12 o r P o s b O - Figure 18. Switching time waveform STS5N15M3 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 9/12 Package mechanical data STS5N15M3 SO-8 MECHANICAL DATA mm. DIM. MIN. TYP A inch MAX. MIN. 0.1 0.068 0.25 a2 0.003 1.65 0.064 0.65 0.85 0.025 0.033 b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.25 0.5 0.010 0.019 D 4.8 5.0 0.188 0.196 E 5.8 6.2 0.228 45 (typ.) 1.27 e e3 3.81 4.0 0.14 L 0.4 1.27 0.015 0.6 S 8 (max.) e t le ) s ( ct u d o r P e c u d 0.150 3.8 o s b O - ) s t( 0.244 0.050 F M 10/12 0.009 a3 c1 s b O MAX. 1.75 a1 t e l o TYP. 0.157 o r P 0.050 0.023 STS5N15M3 5 Revision history Revision history Table 9. Document revision history Date Revision Changes 02-Apr-2007 1 First release 25-Jun-2008 2 Modified values in Table 6: Dynamic c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 11/12 STS5N15M3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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