FAIRCHILD FDP075N15A

FDP075N15A_F102 / FDB075N15A
N-Channel PowerTrench® MOSFET
150V, 130A, 7.5mΩ
Features
Description
• RDS(on) = 6.25mΩ ( Typ.)@ VGS = 10V, ID = 100A
This N-Channel MOSFET is produced using Fairchild
Semiconductor’s advanced PowerTrench® process that has
been especially tailored to minimize the on-state resistance and
yet maintain superior switching performance.
• Fast Switching
• Low Gate Charge
• High Performance Trench Technology for Extremely Low
RDS(on)
Application
• High Power and Current Handling Capability
• DC to DC Converters
• RoHS Compliant
• Synchronous Rectification for Telecommunication PSU
• Battery Charger
• AC motor drives and Uninterruptible Power Supplies
• Off-line UPS
D
D
G
TO-220
D
G
S
D2-PAK
FDB Series
G
S
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*
VDSS
Drain to Source Voltage
FDP075N15A_F102
FDB075N15A
150
VGSS
Gate to Source Voltage
±20
ID
Drain Current
IDM
Drain Current
EAS
Single Pulsed Avalanche Energy
dv/dt
Peak Diode Recovery dv/dt
Symbol
Parameter
-Continuous (TC = 25oC)
130
-Continuous (TC = 100oC)
92
- Pulsed
V
V
A
(Note 1)
522
A
(Note 2)
588
mJ
6.0
V/ns
(Note 3)
(TC = 25oC)
333
W
- Derate above 25oC
2.22
W/oC
-55 to +175
oC
300
oC
PD
Power Dissipation
TJ, TSTG
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
TL
Units
*Package limitation current is 120A.
Thermal Characteristics
Symbol
RθJC
RθJA
FDP075N15A_F102
FDB075N15A
0.45
Parameter
Thermal Resistance, Junction to Case, Max
Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max
2
Thermal Resistance, Junction to Ambient D2-PAK (1 in pad of 2 oz copper), Max
©2012 Fairchild Semiconductor Corporation
FDP075N15A_F102 / FDB075N15A Rev. C1
1
62.5
Units
o
C/W
40
www.fairchildsemi.com
FDP075N15A_F102/FDB075N15A N-Channel PowerTrench® MOSFET
October 2012
Device Marking
FDP075N15A
Device
FDP075N15A_F102
Package
TO-220
Device Marking
FDB075N15A
Device
FDB075N15A
Package
D2-PAK
Description
F102: Trimmed Leads
Reel Size
330mm
Quantity
50
Tape Width
24mm
Quantity
800
Electrical Characteristics TC = 25oC unless otherwise noted
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
150
-
-
V
-
0.1
-
V/oC
μA
Off Characteristics
BVDSS
ΔBVDSS
ΔTJ
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
ID = 250μA, VGS = 0V
IDSS
Zero Gate Voltage Drain Current
VDS = 120V, VGS = 0V
-
-
1
VDS = 120V, TC = 150oC
-
-
500
IGSS
Gate to Body Leakage Current
VGS = ±20V, VDS = 0V
-
-
±100
2.0
-
4.0
V
-
6.25
7.5
mΩ
-
164
-
S
-
5525
7350
pF
-
516
685
pF
-
21
-
pF
-
909
-
pF
-
77
100
nC
-
26
-
nC
-
11
-
nC
-
16
-
nC
-
2.29
-
Ω
-
28
66
ns
-
37
84
ns
-
62
134
ns
-
21
52
ns
ID = 250μA, Referenced to
25oC
μA
On Characteristics
VGS(th)
RDS(on)
Gate Threshold Voltage
VGS = VDS, ID = 250μA
Static Drain to Source On Resistance
gFS
Forward Transconductance
VGS = 10V, ID = 100A
VDS = 10V, ID = 100A
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Coss(er)
Energy Related Output Capacitance
Qg(tot)
Total Gate Charge at 10V
Qgs
Gate to Source Gate Charge
Qgs2
Gate Charge Threshold to Plateau
Qgd
Gate to Drain “Miller” Charge
ESR
Equivalent Series Resistance(G-S)
VDS = 75V, VGS = 0V
f = 1MHz
VDS = 75V, VGS = 0V
VDS = 75V, ID = 100A
VGS = 10V
(Note 4)
f = 1MHz
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
VDD = 75V, ID = 100A
VGS = 10V, RGEN = 4.7Ω
(Note 4)
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
130
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
520
A
VSD
Drain to Source Diode Forward Voltage
VGS = 0V, ISD = 100A
-
-
1.25
V
trr
Reverse Recovery Time
-
97
-
ns
Qrr
Reverse Recovery Charge
VGS = 0V, VDD = 75V, ISD = 100A
dIF/dt = 100A/μs
-
264
-
nC
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. Starting TJ = 25°C, L = 3 mH, IAS = 19.8 A
3. ISD ≤ 100 A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Essentially Independent of Operating Temperature Typical Characteristics
FDP075N15A_F102 / FDB075N15A Rev. C1
2
www.fairchildsemi.com
FDP075N15A_F102/FDB075N15A N-Channel PowerTrench® MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
400
VGS = 15.0V
10.0V
8.0V
7.0V
6.5V
6.0V
5.5V
5.0V
100
*Notes:
1. VDS = 10V
2. 250μs Pulse Test
100
ID, Drain Current[A]
ID, Drain Current[A]
400
o
25 C
o
-55 C
10
*Notes:
1. 250μs Pulse Test
10
o
2. TC = 25 C
7
0.1
1
1
VDS, Drain-Source Voltage[V]
3
2
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
3
4
5
VGS, Gate-Source Voltage[V]
400
IS, Reverse Drain Current [A]
8
VGS = 10V
VGS = 20V
6
100
o
175 C
o
25 C
10
*Notes:
1. VGS = 0V
o
*Note: TC = 25 C
4
0
100
200
300
ID, Drain Current [A]
1
0.0
400
Figure 5. Capacitance Characteristics
VGS, Gate-Source Voltage [V]
1000
Coss
*Note:
1. VGS = 0V
2. f = 1MHz
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
10
0.1
1.5
10
Ciss
100
2. 250μs Pulse Test
0.5
1.0
VSD, Body Diode Forward Voltage [V]
Figure 6. Gate Charge Characteristics
10000
Capacitances [pF]
6
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
10
RDS(ON) [mΩ],
Drain-Source On-Resistance
o
175 C
1
10
VDS, Drain-Source Voltage [V]
FDP075N15A_F102 / FDB075N15A Rev. C1
Crss
VDS = 30V
VDS = 75V
VDS = 120V
8
6
4
2
*Note: ID = 100A
0
100 200
0
3
30
60
Qg, Total Gate Charge [nC]
90
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FDP075N15A_F102/FDB075N15A N-Channel PowerTrench® MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
1.05
1.00
0.95
*Notes:
1. VGS = 0V
2. ID = 250μA
0.90
-100
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
RDS(on), [Normalized]
Drain-Source On-Resistance
BVDSS, [Normalized]
Drain-Source Breakdown Voltage
1.10
2.5
2.0
1.5
1.0
*Notes:
1. VGS = 10V
2. ID = 100A
0.5
0.0
-100
200
Figure 9. Maximum Safe Operating Area
vs. Case Temperature
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
200
Figure 10. Maximum Drain Current
1000
140
100
1ms
10
1
Operation in This Area
is Limited by R DS(on)
10ms
100ms
DC
*Notes:
0.1
100
ID, Drain Current [A]
ID, Drain Current [A]
VGS = 10V
120
100μs
o
Limited by package
80
60
40
o
1. TC = 25 C
RθJC = 0.45 C/W
o
0.01
0.1
20
2. TJ = 175 C
3. Single Pulse
1
10
100
VDS, Drain-Source Voltage [V]
0
25
300
Figure 11. Eoss vs. Drain to Source Voltage
6
100
IAS, AVALANCHE CURRENT (A)
200
EOSS, [μJ]
5
4
3
2
1
0
25
50
75
100
125
VDS, Drain to Source Voltage [V]
FDP075N15A_F102 / FDB075N15A Rev. C1
175
Figure 12. Unclamped Inductive
Switching Capability
7
0
50
75
100
125
150
o
TC, Case Temperature [ C]
TJ = 25 oC
10
TJ = 150 oC
1
0.001
150
0.01
0.1
1
10
100
1000
tAV, TIME IN AVALANCHE (ms)
4
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FDP075N15A_F102/FDB075N15A N-Channel PowerTrench® MOSFET
Typical Performance Characteristics (Continued)
FDP075N15A_F102/FDB075N15A N-Channel PowerTrench® MOSFET
Typical Performance Characteristics (Continued)
Figure 13. Transient Thermal Response Curve
Thermal Response [ZθJC]
1
0.5
0.1
0.2
0.1
PDM
0.05
0.01
t1
0.02
0.01
t2
*Notes:
o
Single pulse
0.001
-5
10
FDP075N15A_F102 / FDB075N15A Rev. C1
1. ZθJC(t) = 0.45 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
-4
10
-3
-2
10
10
Rectangular Pulse Duration [sec]
5
-1
10
1
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FDP075N15A_F102/FDB075N15A N-Channel PowerTrench® MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDP075N15A_F102 / FDB075N15A Rev. C1
6
www.fairchildsemi.com
FDP075N15A_F102/FDB075N15A N-Channel PowerTrench® MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
+
VDS
_
I SD
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• ISD controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
I SD
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
VDD
VSD
Body Diode
Forward Voltage Drop
FDP075N15A_F102 / FDB075N15A Rev. C1
7
www.fairchildsemi.com
FDP075N15A_F102/FDB075N15A N-Channel PowerTrench® MOSFET
Mechanical Dimensions
TO-220
(F102: Trimmed Leads)
Dimensions in Millimeters
FDP075N15A_F102 / FDB075N15A Rev. C1
8
www.fairchildsemi.com
FDP075N15A_F102/FDB075N15A N-Channel PowerTrench® MOSFET
Mechanical Dimensions
D2PAK
Dimensions in Millimeters
FDP075N15A_F102 / FDB075N15A Rev. C1
9
www.fairchildsemi.com
tm
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I61
FDP075N15A_F102 / FDB075N15A Rev. C1
www.fairchildsemi.com
10
FDP075N15A_F102/FDB075N15A N-Channel PowerTrench® MOSFET
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