FREESCALE MRF373ALSR1

Freescale Semiconductor
Technical Data
Document Number: MRF373A
Rev. 7, 9/2008
NOT RECOMMENDED FOR NEW DESIGN
N - Channel Enhancement - Mode Lateral MOSFETs
MRF373ALR1
MRF373ALSR1
Designed for broadband commercial and industrial applications with frequencies from 470 to 860 MHz. The high gain and broadband performance of these
devices make them ideal for large - signal, common source amplifier applications in 28/32 volt transmitter equipment.
• Typical CW Performance at 860 MHz, 32 Volts, Narrowband Fixture
Output Power — 75 Watts
Power Gain — 18.2 dB
D
Efficiency — 60%
• Capable of Handling 10:1 VSWR @ 32 Vdc, 860 MHz,
75 Watts CW Output Power
Features
• Integrated ESD Protection
• Excellent Thermal Stability
• Characterized with Series Equivalent Large - Signal
G
Impedance Parameters
• Low Gold Plating Thickness on Leads.
L Suffix Indicates 40μ″ Nominal.
S
• RoHS Compliant
• In Tape and Reel. R1 = 500 units per 32 mm, 13 inch Reel.
470 - 860 MHz, 75 W, 32 V
LATERAL N - CHANNEL
BROADBAND
RF POWER MOSFETs
CASE 360B - 05, STYLE 1
NI - 360
MRF373ALR1
CASE 360C - 05, STYLE 1
NI - 360S
MRF373ALSR1
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
Drain- Source Voltage
VDSS
- 0.5, +70
Vdc
Gate- Source Voltage
VGS
- 0.5, +15
Vdc
PD
197
1.12
278
1.59
W
W/°C
W
W/°C
Storage Temperature Range
Tstg
- 65 to +150
°C
Case Operating Temperature
TC
150
°C
Operating Junction Temperature
TJ
200
°C
Symbol
Value
Unit
RθJC
0.89
0.63
°C/W
Total Device Dissipation @ TC = 25°C
Derate above 25°C
MRF373ALR1
MRF373ALSR1
Table 2. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
MRF373ALR1
MRF373ALSR1
Table 3. ESD Protection Characteristics
Test Conditions
Class
Human Body Model
Machine Model
© Freescale Semiconductor, Inc., 2008. All rights reserved.
Freescale Semiconductor
RF Product Device Data
1 (Minimum)
MRF373ALR1
MRF373ALSR1
NOT RECOMMENDED FOR NEW DESIGN
RF Power Field Effect Transistors
M2 (Minimum)
M1 (Minimum)
MRF373ALR1 MRF373ALSR1
1
Table 4. Electrical Characteristics (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
V(BR)DSS
70
—
—
Vdc
Zero Gate Voltage Drain Current
(VDS = 32 Vdc, VGS = 0 Vdc)
IDSS
—
—
1
μAdc
Gate- Source Leakage Current
(VGS = 5 Vdc, VDS = 0 Vdc)
IGSS
—
—
1
μAdc
Gate Threshold Voltage
(VDS = 10 V, ID = 200 μA)
VGS(th)
2
2.9
4
Vdc
Gate Quiescent Voltage
(VDS = 32 V, ID = 100 mA)
VGS(Q)
2.5
3.3
4.5
Vdc
Drain- Source On - Voltage
(VGS = 10 V, ID = 3 A)
VDS(on)
—
0.41
0.45
Vdc
Input Capacitance
(VDS = 32 V, VGS = 0, f = 1 MHz)
Ciss
—
98.5
—
pF
Output Capacitance
(VDS = 32 V, VGS = 0, f = 1 MHz)
Coss
—
49
—
pF
Reverse Transfer Capacitance
(VDS = 32 V, VGS = 0, f = 1 MHz)
Crss
—
2
—
pF
Common Source Power Gain
(VDD = 32 V, Pout = 75 W CW, IDQ = 200 mA, f = 860 MHz)
Gps
16.5
18.2
—
dB
Drain Efficiency
(VDD = 32 V, Pout = 75 W CW, IDQ = 200 mA, f = 860 MHz)
η
56
60
—
%
NOT RECOMMENDED FOR NEW DESIGN
Drain- Source Breakdown Voltage
(VGS = 0 Vdc, ID =1 μA)
On Characteristics
Dynamic Characteristics
Functional Characteristics (50 ohm system)
NOT RECOMMENDED FOR NEW DESIGN
Off Characteristics
MRF373ALR1 MRF373ALSR1
2
Freescale Semiconductor
RF Product Device Data
R3
C14
VDD
C17
C13
C16
R1
RF INPUT
C11
C15
C7
L1
C1
C10
C3
C2
C9
C8
C4
C5
RF OUTPUT
C6
CUT OUT AREA
NOT RECOMMENDED FOR NEW DESIGN
R2 C12
MRF373A
Rev 01
Freescale has begun the transition of marking Printed Circuit Boards (PCBs) with the Freescale Semiconductor
signature/logo. PCBs may have either Motorola or Freescale markings during the transition period. These changes will
have no impact on form, fit or function of the current product.
Figure 1. MRF373ALR1/ALSR1 Narrowband Test Circuit Component Layout
Table 5. MRF373ALR1/ALSR1 Narrowband Test Circuit Component Layout Designations and Values
Designation
Description
C1, C2
18 pF Chip Capacitors
C3
12 pF Chip Capacitor
C4
1.8 pF Chip Capacitor
C5, C10
51 pF Chip Capacitors
C6
0.3 pF Chip Capacitor (Used only on the MRF373AS)
C7
15 pF Chip Capacitor
C8
10 pF Chip Capacitor
C9
2.7 pF Chip Capacitor
C11
0.5 pF Chip Capacitor
C12
1000 pF Chip Capacitor
C13
39 pF Chip Capacitor
C14, C15
470 pF Chip Capacitors
C16
2.2 mF, 100 V Chip Capacitor
C17
10 mF, 35 V Tantalum Capacitor
L1A
12 nH, Coilcraft
R1, R2
390 Ω, 1/2 W Chip Resistors (2010)
R3
1 kΩ, 1/2 W Chip Resistor (2010)
PCB
Arlon GX - 0300- 55, 30 mils, εr = 2.55
NOT RECOMMENDED FOR NEW DESIGN
VGG
MRF373ALR1 MRF373ALSR1
Freescale Semiconductor
RF Product Device Data
3
TYPICAL CHARACTERISTICS
20
400 mA
300 mA
18
200 mA
17
100 mA
16
15
10
1
100
Pout, OUTPUT POWER (WATTS) CW
Figure 2. Power Gain versus Output Power
62
VDD = 32 Vdc
Pout = 75 W (CW)
IDQ = 200 mA
25
η
60
IRL
20
58
Gps
15
56
10
54
5
800
820
840
860
880
900
η, DRAIN EFFICIENCY (%)
G ps , POWER GAIN (dB)
IRL, INPUT RETURN LOSS (dB)
30
52
920
f, FREQUENCY (MHz)
200
20
150
15
100
Ciss
10
50
Coss
5
Crss
0
0
10
20
30
40
50
C rss , CAPACITANCE (pF)
C oss , C iss , CAPACITANCE (pF)
Figure 3. Performance in Narrowband Circuit
NOT RECOMMENDED FOR NEW DESIGN
G ps , POWER GAIN (dB)
19
NOT RECOMMENDED FOR NEW DESIGN
VDD = 32 Vdc
f = 860 MHz
IDQ = 500 mA
0
60
VDS, DRAIN SOURCE VOLTAGE (VOLTS)
Figure 4. Capacitance versus Voltage
MRF373ALR1 MRF373ALSR1
4
Freescale Semiconductor
RF Product Device Data
Zload
Zsource
f = 875 MHz
f = 875 MHz
f = 845 MHz
f = 845 MHz
VDD = 32 V, IDQ = 200 mA, Pout = 75 W CW
f
MHz
Zsource
Ω
Zload
Ω
845
0.58 - j0.29
1.60 + j0.07
860
0.56 - j0.11
1.65 + j0.22
875
0.56 + j0.06
1.79 + j0.38
Zsource = Test circuit impedance as measured from
gate to ground.
Zload
= Test circuit impedance as measured
from drain to ground.
Output
Matching
Network
Device
Under Test
Input
Matching
Network
Z
source
Z
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
Zo = 2 Ω
load
Figure 5. Series Equivalent Source and Load Impedance
MRF373ALR1 MRF373ALSR1
Freescale Semiconductor
RF Product Device Data
5
PACKAGE DIMENSIONS
B
M
T A
M
B
M
NOTES:
1. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M−1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
1
NOT RECOMMENDED FOR NEW DESIGN
3
B
(FLANGE)
2
D
bbb M T A
K
2X
2X
M
B
R
M
(LID)
ccc
N
(LID)
ccc
M
T A
M
B
M
T A
M
B
M
F
H
M
C
E
S
(INSULATOR)
T
M
(INSULATOR)
A
aaa
SEATING
PLANE
bbb
M
T A
M
B
M
T A
M
B
M
DIM
A
B
C
D
E
F
G
H
K
M
N
Q
R
S
aaa
bbb
ccc
INCHES
MIN
MAX
0.795
0.805
0.225
0.235
0.125
0.175
0.210
0.220
0.055
0.065
0.004
0.006
0.562 BSC
0.077
0.087
0.220
0.250
0.355
0.365
0.357
0.363
0.125
0.135
0.227
0.233
0.225
0.235
0.005 REF
0.010 REF
0.015 REF
STYLE 1:
PIN 1. DRAIN
2. GATE
3. SOURCE
M
A
CASE 360B - 05
ISSUE G
NI - 360
MRF373ALR1
MILLIMETERS
MIN
MAX
20.19
20.45
5.72
5.97
3.18
4.45
5.33
5.59
1.40
1.65
0.10
0.15
14.28 BSC
1.96
2.21
5.59
6.35
9.02
9.27
9.07
9.22
3.18
3.43
5.77
5.92
5.72
5.97
0.13 REF
0.25 REF
0.38 REF
NOT RECOMMENDED FOR NEW DESIGN
Q
aaa
2X
G
MRF373ALR1 MRF373ALSR1
6
Freescale Semiconductor
RF Product Device Data
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
MRF373ALR1 MRF373ALSR1
Freescale Semiconductor
RF Product Device Data
7
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
MRF373ALR1 MRF373ALSR1
8
Freescale Semiconductor
RF Product Device Data
PRODUCT DOCUMENTATION
Refer to the following documents to aid your design process.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
7
Sept. 2008
Description
• Replaced Case Outline 360C - 05, Issue E with Issue F, p. 7 - 8.
• Added Product Documentation and Revision History, p. 9
NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
Engineering Bulletins
• EB212: Using Data Sheet Impedances for RF LDMOS Devices
MRF373ALR1 MRF373ALSR1
Freescale Semiconductor
RF Product Device Data
9
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NOT RECOMMENDED FOR NEW DESIGN
NOT RECOMMENDED FOR NEW DESIGN
How to Reach Us:
MRF373ALR1 MRF373ALSR1
Document Number: MRF373A
Rev. 7, 9/2008
10
Freescale Semiconductor
RF Product Device Data