STMICROELECTRONICS PEP01-5841

PEP01-5841
Power over ethernet power supply protection
Features
■
Peak pulse power: up to 2.7 kW (8/20 µs)
■
Stand-off voltage: 58 V
■
4 unidirectional Transils™ and 4 decoupling
capacitances
■
Low clamping voltage: 100 V
■
Low leakage current:
– 0.2 µA at 25 °C
– 1 µA at 85 °C
■
Operating Tj max: 150 °C
■
JEDEC registered package outline
SO-8 package
PEP01-5841
Figure 1.
Gnd
- - 2-3-6-7
Functional diagram
PS1
1
PS2
4
PS3
5
PS4
8
Complies with the following standards
■
IEC61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
■
IEC61000-4-5 level 2
– +/- 1 kV 42 Ω
■
IEEE 802.3af-2003
■
IEEE 802.3at-2008
Description
The PEP01-5841 has been designed to protect
power over ethernet PSE equipment against line
overvoltages. It embeds 4 decoupling capacititors
to stabilize power supplies.
It is compatible with IEEE 802.3af-2003 and
IEEE 802.3at-2008 requirements and it allows
PoE based systems to be protected against both
electrical overstress (EOS) and electrostatic
discharges (ESD) according to IEC61000-4-5 and
IEC61000-4-2.
The low clamping voltage (100 V) makes it
compatible with PMOS and PSE controller
technologies. Developed in Planar technology, it
provides high reliability level.
Packaged in SO-8, this minimizes PCB
consumption (footprint in accordance with the
IPC 7531 standard).
TM: Transil is a trademark of STMicroelectronics
May 2009
Doc ID 15657 Rev 2
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www.st.com
10
Characteristics
1
PEP01-5841
Characteristics
Table 1.
Absolute ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
30
kV
2700
W
VPP
Peak pulse voltage (IEC61000-4-2 contact discharge)
PPP
Peak pulse power dissipation
Tstg
Storage temperature range
-65 to + 150
°C
Tj
Operating junction temperature range
-55 to + 150
°C
TL
Maximum lead temperature for soldering during 10 s.
260
°C
Table 2.
Tj initial = Tamb
Electrical characteristics definitions(Tamb = 25 °C)
Symbol
Parameter
I
VRM
Stand-off voltage
VBR
Breakdown voltage
VCL
Clamping voltage
IRM
Leakage current @ VRM
IPP
Peak pulse current
αT
Voltage temperature coefficient
C
Capacitance
RD
Dynamic impedance
IF
VF
VCL VBR VRM
V
I RM
IR
Slope = 1/ Rd
I PP
8/20 µs
VBR @IR (1)
IRM [email protected]
VCL @IPP
RD(2)
C
αT(3)
typ.
max.
Type
25 °C 85 °C
PEP01-5841
min.
µA
µA
V
V
0.2
1
58
64.4
typ.
67.8
max.
71.2
max.
mA
V
A
Ω
pF
10-4 °C
1
100
24
1.2
55
10.4
1. Pulse test: tp < 50 ms
2. To calculate maximum clamping voltage at other surge level, use the following formula:
VCLmax = RD x IPP + VBRmax
3. To calculate VBR versus junction temperature, use the following formula:
VBR @ TJ = VBR @ 25 °C x (1 + αT x (TJ - 25))
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PEP01-5841
Figure 2.
Characteristics
Pulse waveform
% I PP
100
Repetitive peak pulse current
tr = rise time (µs)
tp = pulse duration time (µs)
50
0
Figure 3.
tr
t
tp
Peak power dissipation versus
initial junction temperature
Figure 4.
Ppp[Tj initial] / Ppp [Tj initial = 25°C]
100.0
110
Peak pulse power versus
exponential pulse duration
(Tj initial = 25 °C)
PPP (kW)
Tj initial = 25 °C
100
90
80
10.0
70
60
50
40
1.0
30
20
10
0
tp (ms)
Tj T(°C)
j(°
0
25
Figure 5.
100.0
50
75
100
125
150
0.1
175
Clamping voltage versus peak
pulse current (exponential
waveform, maximum values)
1.0E-03
Figure 6.
IPP (A)
100
Tj initial = 25 °C
1.0E-02
1.0E-01
1.0E+00
1.0E+01
Capacitance versus voltage
(typical values)
C(pF)
F=1 MHz
VOSC =30 mV rms
8/20 µs
Tj = 25 °C
10.0
1.0
VCL (V)
0.1
70
80
90
VR (V)
10
100
44
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46
48
50
52
54
56
58
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Characteristics
Figure 7.
1.0E+01
PEP01-5841
Peak forward voltage drop versus
peak forward current
(typical values)
IFM (A)
Figure 8.
1.00
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Zth(j-a) / Rth(j-a)
With recommended pad layout
1.0E+00
Tj = 125 °C
Tj = 25 °C
0.10
1.0E-01
2
VFM (V)
1.0E-02
0.0
Figure 9.
0.5
1.0
1.5
2.0
2.5
(printed ciruit board FR4, SCU = 1 cm )
3.0
0.01
1.0E-03
1.0E-02
1.0E-01
1.0E+00
Leakage current versus junction temperature (typical values)
1.E+04
IR(nA)
VR = VRM
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
25
4/10
Tj (°C)
50
75
100
Doc ID 15657 Rev 2
125
150
1.0E+01
tp (s)
1.0E+02
1.0E+03
PEP01-5841
Application
Figure 10. Typical application circuit with PMOS integrated in PSE controller
+
Tx
48V
Rx
-
I²C
V1
om
Co
Tx
Rx
Gnd
PS1
PoE
Controller
PS2
PEP01-5841
2
Application
PS3
Tx
PS4
Rx
Tx
Rx
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Application
PEP01-5841
Figure 11. Typical application circuit with external PMOS
PSE
controller
PEP01-5841
- 48V
Figure 10 and 11 shows typical application schematics of PoE network. Power sourcing
equipment (PSE) allows communication and power sourcing for several power devices (PD).
The number of ways is generally a multiple of 4, this optimizes the PEP01-5841 for track
layout and crosstalk, as well as PCB surface occupation. This protection device has been
studied to comply with the latest IEEE 802.3af-2003 requirements and to withstand the
surge defined in the IEC 61000-4-5 level 4 requirements.
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PEP01-5841
3
Ordering information scheme
Ordering information scheme
Figure 12. Ordering information scheme
PEP
01
-
58
4
1
Power over ethernet protection
Version
Stand off voltage
58 = 58 V
Number of power supply lines to be protected
Packaging
1 = SO-8
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Package information
4
PEP01-5841
Package information
●
Case: JEDEC SO-8 molded plastic over planar junction
●
Terminals: solder plated, solderable according to MIL-STD-750, Method 2026
●
Flammability: epoxy is rated UL94V-0
●
RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 3.
SO-8 dimensions
Dimensions
Ref.
Min.
Seating
Plane
C
A2
h x 45°
C
A1
e
b
A
Millimeters
L
k
ppp C
L1
Typ.
Inches
Max.
Min.
Typ.
Max.
A
-
-
1.75
-
-
0.069
A1
0.1
-
0.25
0.004
-
0.010
A2
1.25
-
-
0.049
-
-
b
0.28
-
0.48
0.011
-
0.019
C
0.17
-
0.23
0.007
-
0.009
D
4.80
4.90
5.00
0.189 0.193 0.197
E
5.80
6.00
6.20
0.228 0.236 0.244
E1
3.80
3.90
4.00
0.150 0.154 0.157
e
-
1.27
-
-
0.050
-
h
0.25
-
0.50
0.010
-
0.020
L
0.40
-
1.27
0.016
-
0.050
L1
-
1.04
-
-
0.041
-
k
0°
-
8°
0°
-
8°
ppp
-
-
0.10
-
-
0.004
D
5
8
E1
1
E
4
Figure 13. Footprint recommendations
Figure 14. Marking
6.8
(0.268)
0.6
(0.024)
x x x xx x
4.2
(0.165)
â
®
1.27
(0.050)
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z z y ww
Pin 1
Doc ID 15657 Rev 2
XXXX: Marking
ZZ: Manufacturing location
Y: Year
WW: week
PEP01-5841
5
Ordering information
Ordering information
Table 4.
6
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
PEP01-5841
58E1
SO-8
78 mg
2000
Tape and reel
Revision history
Table 5.
Document revision history
Date
Revision
Changes
06-May-2009
1
Initial release.
14-May-2009
2
Standards compliance updated.
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PEP01-5841
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