STMICROELECTRONICS STB10NK60Z_08

STB10NK60Z, STP10NK60Z
STW10NK60Z
N-channel 650 V, 0.65 Ω, 10 A, SuperMESH™ Power MOSFET
Zener-protected I2PAK, D2PAK, TO-220, TO-220FP, TO-247
Features
Type
VDSS
RDS(on)
max
STB10NK60Z-1
600 V
< 0.75 Ω 10 A 115 W
STB10NK60Z
600 V
< 0.75 Ω 10 A 115 W
STP10NK60Z
600 V
< 0.75 Ω 10 A 115 W
STP10NK60ZFP
600 V
< 0.75 Ω 10 A
STW10NK60Z
600 V
< 0.75 Ω 10 A 156 W
Pw
ID
TO-247
TO-262
3
1
35 W
TO-263
3
■
Extremely high dv/dt capability
■
100% avalanche tested
■
Gate charge minimized
■
Very good manufacturing reliability
1
Figure 1.
3
2
TO-220FP
Application
■
3
12
1
2
TO-220
Internal schematic diagram
Switching applications
Description
The SuperMESH™ series is obtained through an
extreme optimization of ST’s well established
strip-based PowerMESH™ layout. In addition to
pushing on-resistance significantly down, special
care is taken to ensure a very good dv/dt
capability for the most demanding applications.
Table 1.
Device summary
Order codes
Marking
Package
Packaging
STB10NK60Z-1
B10NK60Z
I²PAK
Tube
STB10NK60ZT4
B10NK60Z
D²PAK
Tape & reel
STP10NK60ZFP
P10NK60ZFP
TO-220FP
Tube
STP10NK60Z
P10NK60Z
TO-220
Tube
STW10NK60Z
W10NK60Z
TO-247
Tube
November 2008
Rev 10
1/19
www.st.com
19
Contents
STB10NK60Z, STP10NK60Z, STW10NK60Z
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
Electrical characteristics (curves)
........................... 7
3
Test circuits
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/19
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
STB10NK60Z, STP10NK60Z, STW10NK60Z
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Value
Symbol
Parameter
Unit
TO-220
D²PAK,I²PAK
TO-220FP
VDS
Drain-source voltage (VGS = 0)
600
VGS
Gate-source voltage
± 30
ID
Drain current (continuous) at TC = 25 °C
V
V
(1)
10
TO-247
10
10
A
(1)
5.7
A
Drain current (continuous) at TC = 100 °C
5.7
5.7
IDM (2)
Drain current (pulsed)
36
36 (1)
36
A
PTOT
Total dissipation at TC = 25 °C
115
35
156
W
Derating factor
0.92
0.28
1.25
W/°C
ID
Vesd(G-S) G-S ESD (HBM C=100 pF, R=1.5 kΩ)
dv/dt (3)
V
4.5
V/ns
Peak diode recovery voltage slope
Insulation withstand voltage (RMS) from
all three leads to external heat sink
VISO
4000
--
2500
--
V
(t=1 s;TC=25 °C)
Operating junction temperature
Storage temperature
Tj
Tstg
-55 to 150
°C
1. Limited only by maximum temperature allowed
2.
Pulse width limited by safe operating area
3. ISD
< 10A, di/dt < 200A/µs, VDD =80% V(BR)DSS
Table 3.
Thermal data
Value
Symbol
Parameter
TO-220
I²PAK
Unit
D²PAK TO-220FP TO-247
Rthj-case
Thermal resistance junction-case Max
Rthj-pcb
Thermal resistance junction-pcb Max
(when mounted on minimum footprint)
60
Rthj-amb
Thermal resistance junction-amb Max
62.5
Tl
Maximum lead temperature for soldering
purpose
1.09
3.6
0.8
°C/W
°C/W
50
300
°C/W
°C
3/19
Electrical ratings
Table 4.
Symbol
4/19
STB10NK60Z, STP10NK60Z, STW10NK60Z
Avalanche characteristics
Parameter
Max value
Unit
9
A
IAR
Avalanche current, repetitive or not-repetitive
(pulse width limited by Tj max)
EAS
Single pulse avalanche energy
(starting Tj=25 °C, ID=IAR, VDD= 50 V)
300
mJ
EAR
Repetitive avalanche energy
(pulse width limited by Tj max)
3.5
mJ
STB10NK60Z, STP10NK60Z, STW10NK60Z
2
Electrical characteristics
Electrical characteristics
(Tcase = 25 °C unless otherwise specified)
Table 5.
Symbol
V(BR)DSS
On /off states
Parameter
Test conditions
Drain-source breakdown
ID = 250 µA, VGS= 0
voltage
Min.
Typ.
Max.
Unit
600
V
IDSS
Zero gate voltage drain
current (VGS = 0)
VDS = Max rating,
VDS = Max rating, Tj=125 °C
1
50
µA
µA
IGSS
Gate body leakage
current (VDS = 0)
VGS = ±20 V, VDS = 0
±10
µA
VGS(th)
Gate threshold voltage
VDS= VGS, ID = 250 µA
3.75
4.5
V
RDS(on)
Static drain-source on
resistance
VGS= 10 V, ID= 4.5 A
0.65
0.75
Ω
Typ.
Max.
Unit
Table 6.
Symbol
Dynamic
Parameter
Test conditions
gfs (1)
Forward
transconductance
VDS =15 V, ID = 4.5 A
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS =25 V, f=1 MHz, VGS=0
Equivalent output
capacitance
Total gate charge
Gate-source charge
Gate-drain charge
Coss eq(2)
Qg
Qgs
Qgd
3
Min.
7.8
S
1370
156
37
pF
pF
pF
VGS=0, VDS =0 to 480 V
90
pF
VDD=480 V, ID = 8 A
VGS =10 V (see Figure 20)
50
10
25
70
nC
nC
nC
1. Pulsed: pulse duration = 300µs, duty cycle 1.5%
2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS
increases from 0 to 80%
5/19
Electrical characteristics
STB10NK60Z, STP10NK60Z, STW10NK60Z
Table 7.
Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max Unit
td(on)
tr
Turn-on delay time
Rise time
VDD=300 V, ID=4 A,
RG=4.7 Ω, VGS=10 V
(see Figure 19)
20
20
ns
ns
td(off)
tf
Turn-off delay time
Fall time
VDD=300 V, ID=4 A,
RG=4.7 Ω, VGS=10 V
(see Figure 19)
55
30
ns
ns
Table 8.
Source drain diode
Symbol
Parameter
ISD
ISDM(1)
Source-drain current
Source-drain current (pulsed)
VSD(2)
Forward on voltage
ISD=10 A, VGS=0
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD=8 A, di/dt = 100 A/µs,
VDD=40 V, Tj=150 °C
trr
Qrr
IRRM
Test conditions
Min.
Typ.
570
4.3
15
Max. Unit
10
36
A
A
1.6
V
ns
µC
A
1. Pulse width limited by safe operating area
2.
Pulsed: pulse duration = 300µs, duty cycle 1.5%
Table 9.
Symbol
BVGSO(1)
Gate-source Zener diode
Parameter
Gate-source breakdown
voltage
Test conditions
Igs=± 1 mA (open drain)
Min
Typ
Max Unit
30
1. The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components
6/19
V
STB10NK60Z, STP10NK60Z, STW10NK60Z
Electrical characteristics
2.1
Electrical characteristics (curves)
Figure 2.
Safe operating area for TO-220 /
I²PAK / D²PAK
Figure 3.
Thermal impedance for TO-220 /
I²PAK / D²PAK
Figure 4.
Safe operating area for TO-247
Figure 5.
Thermal impedance for TO-247
Figure 6.
Safe operating area for TO-220FP
Figure 7.
Thermal impedance for TO-220FP
7/19
Electrical characteristics
Figure 8.
Output characteristics
Figure 10. Transconductance
STB10NK60Z, STP10NK60Z, STW10NK60Z
Figure 9.
Transfer characteristics
Figure 11. Static drain-source on resistance
Figure 12. Gate charge vs gate-source voltage Figure 13. Capacitance variations
8/19
STB10NK60Z, STP10NK60Z, STW10NK60Z
Electrical characteristics
Figure 14. Normalized gate threshold voltage
vs temperature
Figure 15. Normalized on resistance vs
temperature
Figure 16. Source-drain diode forward
characteristics
Figure 17. Maximum avalanche energy vs
temperature
Figure 18. Normalized BVDSS vs temperature
9/19
Test circuits
3
STB10NK60Z, STP10NK60Z, STW10NK60Z
Test circuits
Figure 19. Switching times test circuit for
resistive load
Figure 20. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
µF
2200
RL
µF
VGS
IG=CONST
VDD
100Ω
Vi=20V=VGMAX
VD
RG
2200
µF
D.U.T.
D.U.T.
VG
2.7kΩ
PW
47kΩ
1kΩ
PW
AM01468v1
AM01469v1
Figure 21. Test circuit for inductive load
Figure 22. Unclamped inductive load test
switching and diode recovery times
circuit
A
A
D.U.T.
FAST
DIODE
B
B
L
A
D
G
VD
L=100µH
S
3.3
µF
B
25 Ω
1000
µF
D
VDD
2200
µF
3.3
µF
VDD
ID
G
RG
S
Vi
D.U.T.
Pw
AM01470v1
Figure 23. Unclamped inductive waveform
AM01471v1
Figure 24. Switching time waveform
ton
V(BR)DSS
tdon
VD
toff
tr
tdoff
tf
90%
90%
IDM
10%
ID
VDD
10%
0
VDD
VDS
90%
VGS
AM01472v1
10/19
0
10%
AM01473v1
STB10NK60Z, STP10NK60Z, STW10NK60Z
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
11/19
Package mechanical data
STB10NK60Z, STP10NK60Z, STW10NK60Z
TO-220 mechanical data
mm
inch
Dim
Min
A
b
b1
c
D
D1
E
e
e1
F
H1
J1
L
L1
L20
L30
∅P
Q
12/19
Typ
4.40
0.61
1.14
0.48
15.25
Max
Min
4.60
0.88
1.70
0.70
15.75
0.173
0.024
0.044
0.019
0.6
10.40
2.70
5.15
1.32
6.60
2.72
14
3.93
0.393
0.094
0.194
0.048
0.244
0.094
0.511
0.137
1.27
10
2.40
4.95
1.23
6.20
2.40
13
3.50
Max
0.181
0.034
0.066
0.027
0.62
0.050
16.40
28.90
3.75
2.65
Typ
0.409
0.106
0.202
0.051
0.256
0.107
0.551
0.154
0.645
1.137
3.85
2.95
0.147
0.104
0.151
0.116
STB10NK60Z, STP10NK60Z, STW10NK60Z
Package mechanical data
TO-220FP mechanical data
mm.
Dim.
Min.
A
4.40
inch
Typ
Max.
Min.
4.60
0.173
Typ.
0.181
Max.
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.70
0.017
0.027
F
0.75
1.00
0.030
0.039
F1
1.15
1.50
0.045
0.067
F2
1.15
1.50
0.045
0.067
G
4.95
5.20
0.195
0.204
G1
2.40
2.70
0.094
0.106
H
10
10.40
0.393
L2
16
0.409
0.630
28.6
30.6
1.126
L4
9.80
10.60
0.385
1.204
0.417
L5
2.9
3.6
0.114
0.141
L6
15.90
16.40
0.626
0.645
L7
9
9.30
0.354
0.366
Dia
3
3.2
0.118
0.126
B
D
A
E
L3
L3
L6
F2
H
G
G1
Dia
F
F1
L7
L2
L5
1 2 3
L4
7012510-I
13/19
Package mechanical data
STB10NK60Z, STP10NK60Z, STW10NK60Z
TO-247 Mechanical data
mm.
Dim.
A
Min.
4.85
A1
2.20
2.60
b
1.0
1.40
b1
2.0
2.40
b2
3.0
3.40
c
0.40
0.80
D
19.85
20.15
E
15.45
15.75
e
Max.
5.15
5.45
L
14.20
14.80
L1
3.70
4.30
L2
18.50
øP
3.55
øR
4.50
S
14/19
Typ
3.65
5.50
5.50
STB10NK60Z, STP10NK60Z, STW10NK60Z
Package mechanical data
I²PAK (TO-262) mechanical data
mm
inch
Dim
Min
A
A1
b
b1
c
c2
D
e
e1
E
L
L1
L2
4.40
2.40
0.61
1.14
0.49
1.23
8.95
2.40
4.95
10
13
3.50
1.27
Typ
Max
Min
4.60
2.72
0.88
1.70
0.70
1.32
9.35
2.70
5.15
10.40
14
3.93
1.40
0.173
0.094
0.024
0.044
0.019
0.048
0.352
0.094
0.194
0.393
0.511
0.137
0.050
Typ
Max
0.181
0.107
0.034
0.066
0.027
0.052
0.368
0.106
0.202
0.410
0.551
0.154
0.055
15/19
Package mechanical data
STB10NK60Z, STP10NK60Z, STW10NK60Z
D²PAK (TO-263) mechanical data
mm
inch
Dim
Min
A
A1
b
b2
c
c2
D
D1
E
E1
e
e1
H
J1
L
L1
L2
R
V2
Max
Min
4.60
0.23
0.93
1.70
0.60
1.36
9.35
0.173
0.001
0.027
0.045
0.017
0.048
0.352
0.295
0.394
0.334
10.40
2.54
4.88
15
2.49
2.29
1.27
1.30
Typ
Max
0.181
0.009
0.037
0.067
0.024
0.053
0.368
0.409
0.1
5.28
15.85
2.69
2.79
1.40
1.75
0.192
0.590
0.099
0.090
0.05
0.051
8°
0°
0.4
0°
0079457_M
16/19
Typ
4.40
0.03
0.70
1.14
0.45
1.23
8.95
7.50
10
8.50
0.208
0.624
0.106
0.110
0.055
0.069
0.016
8°
STB10NK60Z, STP10NK60Z, STW10NK60Z
5
Packaging mechanical data
Packaging mechanical data
D 2 PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
mm
MIN.
A
DIM.
mm
MIN.
inch
MAX.
MIN.
MIN.
330
B
1.5
C
12.8
D
20.2
G
24.4
N
100
T
TAPE MECHANICAL DATA
inch
MAX.
MAX.
12.992
0.059
13.2
0.504 0.520
26.4
0.960 1.039
0795
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
MAX.
A0
10.5
10.7
0.413 0.421
B0
15.7
15.9
0.618 0.626
D
1.5
1.6
0.059 0.063
D1
1.59
1.61
0.062 0.063
E
1.65
1.85
0.065 0.073
F
11.4
11.6
0.449 0.456
K0
4.8
5.0
0.189 0.197
P0
3.9
4.1
0.153 0.161
P1
11.9
12.1
0.468 0.476
P2
1.9
2.1
R
50
1.574
T
0.25
0.35 0.0098 0.0137
W
23.7
24.3
0.075 0.082
0.933 0.956
17/19
Revision history
6
STB10NK60Z, STP10NK60Z, STW10NK60Z
Revision history
Table 10.
18/19
Revision history
Date
Revision
Changes
29-Sep-2005
6
Inserted ecopack indication
29-Oct-2005
7
New value inserted in Table 6
11-Apr-2006
8
New template
19-Sep-2006
9
Unit changed in Table 5
17-Nov-2008
10
Updated Section 4: Package mechanical data
STB10NK60Z, STP10NK60Z, STW10NK60Z
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19/19