STx30NM60ND N-channel 600 V, 0.11 Ω, 25 A FDmesh™ II Power MOSFET (with fast diode) TO-220, TO-220FP, D2PAK, I2PAK, TO-247 Features VDSS @TJ max Type STB30NM60ND STI30NM60ND STF30NM60ND STP30NM60ND STW30NM60ND 650 V RDS(on) max ID 0.13 Ω 25 A 25 A 25 A(1) 25 A 25 A 3 12 2 I PAK 2 3 1 TO-247 3 2 D PAK 1 1. Limited only by maximum temperature allowed ■ 3 The world’s best RDS(on) in TO-220 amongst the fast recovery diode devices ■ 100% avalanche tested ■ Low input capacitance and gate charge ■ Low gate input resistance ■ Extremely high dv/dt and avalanche capabilities TO-220 1 3 2 TO-220FP Figure 1. 1 2 Internal schematic diagram $ Application ■ Switching applications ' Description The FDmesh™ II series belongs to the second generation of MDmesh™ technology. This revolutionary Power MOSFET associates a new vertical structure to the company's strip layout and associates all advantages of reduced onresistance and fast switching with an intrinsic fastrecovery body diode. Table 1. 3 !-V It is therefore strongly recommended for bridge topologies, in particular ZVS phase-shift converters. Device summary Order codes Marking Package Packaging STB30NM60ND 30NM60ND D²PAK Tape and reel STI30NM60ND 30NM60ND I²PAK Tube STF30NM60ND 30NM60ND TO-220FP Tube STP30NM60ND 30NM60ND TO-220 Tube STW30NM60ND 30NM60ND TO-247 Tube November 2008 Rev 2 1/18 www.st.com 18 Contents STx30NM60ND Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuits 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2/18 .............................................. 9 STx30NM60ND 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Value Symbol Parameter Unit TO-220/D2PAK I2PAK / TO-247 TO-220FP VDS Drain-source voltage (VGS = 0) 600 VGS Gate- source voltage ± 25 V V (1) ID Drain current (continuous) at TC = 25 °C 25 ID Drain current (continuous) at TC = 100 °C 15.8 15.8(1) A Drain current (pulsed) 100 100(1) A Total dissipation at TC = 25 °C 190 40 W IDM (2) PTOT (3) dv/dt Peak diode recovery voltage slope 40 VISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s; TC = 25 °C) Tstg Storage temperature TJ 25 -- A V/ns 2500 V – 55 to 150 °C Max. operating junction temperature 150 1. Limited only by maximum temperature allowed 2. Pulse width limited by safe operating area 3. ISD ≤ 25 A, di/dt ≤ 600 A/µs, VDD = 80% V(BR)DSS Table 3. Symbol Thermal data Parameter Rthj-case Thermal resistance junction-case max Rthj-amb Thermal resistance junction-ambient max Rthj-pcb Thermal resistance junction-pcb max Tl Table 4. Symbol TO-220 I²PAK TO-247 D²PAK TO-220FP 0.66 62.5 -- Maximum lead temperature for soldering purpose -- Unit 3.1 °C/W 50 -- 62.5 °C/W -- 30 -- °C/W 300 °C Avalanche characteristics Parameter Max value Unit IAR Avalanche current, repetitive or notrepetitive (pulse width limited by TJ max) 12 A EAS Single pulse avalanche energy (starting TJ = 25 °C, ID = IAR, VDD = 50 V) 900 mJ 3/18 Electrical characteristics 2 STx30NM60ND Electrical characteristics (TCASE = 25 °C unless otherwise specified) Table 5. On/off states Value Symbol Parameter Test conditions Unit Min. Typ. Max. Drain-source breakdown voltage ID = 1 mA, VGS = 0 Drain source voltage slope VDD= 480 V, ID= 25 A, VGS= 10 V IDSS Zero gate voltage drain current (VGS = 0) VDS = Max rating VDS = Max rating @125 °C 1 100 µA µA IGSS Gate-body leakage current (VDS = 0) VGS = ± 20 V 100 nA VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 4 5 V RDS(on) Static drain-source on resistance VGS = 10 V, ID = 12.5 A 0.11 0.13 Ω V(BR)DSS dv/dt(1) 600 V 48 3 V/ns 1. Characteristic value at turn off on inductive load Table 6. Symbol (1) Dynamic Parameter Test conditions Min. Typ. Max. Unit Forward transconductance VDS = 15 V, ID = 12.5 A 25 Input capacitance Output capacitance Reverse transfer capacitance VDS = 50 V, f = 1 MHz, VGS = 0 2800 200 24 Coss eq.(2) Equivalent output capacitance VGS = 0, VDS = 0 to 480 V 125 pF td(on) tr td(off) tf Turn-on delay time Rise time Turn-off delay time Fall time VDD =300 V, ID = 12.5 A RG = 4.7 Ω, VGS = 10 V (see Figure 23), (see Figure 18) 20 50 110 75 ns ns ns ns Qg Qgs Qgd Total gate charge Gate-source charge Gate-drain charge VDD = 480 V, ID = 25 A, VGS = 10 V, (see Figure 19) 100 16 54 nC nC nC Gate input resistance f=1MHz Gate DC Bias=0 Test signal level=20 mV Open drain 3.0 Ω gfs Ciss Coss Crss Rg S pF pF pF 1. Pulsed: pulse duration=300 µs, duty cycle 1.5% 2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS 4/18 STx30NM60ND Electrical characteristics Table 7. Symbol Source drain diode Parameter Test conditions Min. Typ. Max. Unit 25 100 A A 1.6 V ISD ISDM (1) Source-drain current Source-drain current (pulsed) VSD (2) Forward on voltage ISD = 25 A, VGS = 0 Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 25 A, VDD = 60 V di/dt=100 A/µs (see Figure 20) 170 1.2 15 ns µC A Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 25 A,VDD = 60 V di/dt=100 A/µs, TJ = 150 °C (see Figure 20) 250 2.5 20 ns µC A trr Qrr IRRM trr Qrr IRRM 1. Pulse width limited by safe operating area 2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%. 5/18 Electrical characteristics STx30NM60ND 2.1 Electrical characteristics (curves) Figure 2. Safe operating area for TO-220 / D²PAK / I²PAK Figure 3. Thermal impedance for TO-220 / D²PAK / I²PAK Figure 4. Safe operating area for TO-220FP Figure 5. Thermal impedance for TO-220FP Figure 6. Safe operating area for TO-247 Figure 7. Thermal impedance for TO-247 6/18 STx30NM60ND Figure 8. Electrical characteristics Output characteristics Figure 9. AM00051v1 ID(A) Transfer characteristics AM00052v1 ID(A) VGS=10V 30 5 25 4 5V 20 3 15 2 10 1 5 4V 0 0 0 5 10 15 20 25 30 VSD(V) Figure 10. Transconductance 0 2 4 6 VGS(V) 8 Figure 11. Static drain-source on resistance AM00048v1 Gfs(S) AM00046v1 RDS(on) (Ω) 0.135 30.5 TJ=-50°C 25°C 0.115 25.5 150°C 20.5 0.095 15.5 0.075 10.5 0.055 5.5 0.035 VGS=10V ID=12.5A 0.5 0.015 0 5 10 15 20 25 30 ID(A) 0 5 10 15 20 25 30 ID(A) Figure 12. Gate charge vs gate-source voltage Figure 13. Capacitance variations AM00044v1 AM00045v1 VGS(V) VDD=480V ID=25A 12 C(pF) 10000 Ciss 10 1000 8 6 Coss 100 4 Crss 2 10 0 0 20 40 60 80 100 Qg(nC) 1 0.1 1 10 100 VGS(V) 7/18 Electrical characteristics STx30NM60ND Figure 14. Normalized gate threshold voltage vs temperature Figure 15. Normalized on resistance vs temperature AM00043v1 VGS(th) AM00047v1 RDS(on) (norm) (norm) 1.1 2.1 ID=250µA 1.05 1.9 1 1.7 0.95 1.5 0.9 1.3 0.85 1.1 0.8 0.9 0.75 0.7 0.7 0.5 -50 -25 0 25 50 75 100 Figure 16. Source-drain diode forward characteristics VSD(V) 1 -50 125 T150 J(°C) -25 0 25 50 75 100 125 T150 J(°C) Figure 17. Normalized BVDSS vs temperature AM00050v1 AM00049v1 BVDSS (norm) 25°C TJ=-50°C 1.07 1.05 150°C 0.8 1.03 0.6 1.01 0.99 0.4 0.97 0.2 0.95 0 0.93 0 8/18 10 20 ISD(A) -50 -25 0 25 50 75 100 125 T150 J(°C) STx30NM60ND 3 Test circuits Test circuits Figure 18. Switching times test circuit for resistive load Figure 19. Gate charge test circuit Figure 20. Test circuit for inductive load Figure 21. Unclamped Inductive load test switching and diode recovery times circuit Figure 22. Unclamped inductive waveform Figure 23. Switching time waveform 9/18 Package mechanical data 4 STx30NM60ND Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/18 STx30NM60ND Package mechanical data TO-220 mechanical data mm inch Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 ∅P Q Typ 4.40 0.61 1.14 0.48 15.25 Max Min 4.60 0.88 1.70 0.70 15.75 0.173 0.024 0.044 0.019 0.6 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 Max 0.181 0.034 0.066 0.027 0.62 0.050 16.40 28.90 3.75 2.65 Typ 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 3.85 2.95 0.147 0.104 0.151 0.116 11/18 Package mechanical data STx30NM60ND TO-220FP mechanical data mm. DIM. Min. inch Typ. Max. Min. Typ. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 B D A E L7 L3 L6 F2 H G G1 F F1 L7 L2 12/18 L5 1 23 L4 STx30NM60ND Package mechanical data TO-262 (I2PAK) mechanical data mm. inch DIM. Min. Typ. Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.49 0.70 0.019 0.027 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 E 10 10.40 0.393 0.410 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L2 1.27 1.40 0.050 0.055 13/18 Package mechanical data STx30NM60ND D²PAK (TO-263) mechanical data mm inch Dim Min A A1 b b2 c c2 D D1 E E1 e e1 H J1 L L1 L2 R V2 Max Min 4.60 0.23 0.93 1.70 0.60 1.36 9.35 0.173 0.001 0.027 0.045 0.017 0.048 0.352 0.295 0.394 0.334 10.40 2.54 4.88 15 2.49 2.29 1.27 1.30 Typ Max 0.181 0.009 0.037 0.067 0.024 0.053 0.368 0.409 0.1 5.28 15.85 2.69 2.79 1.40 1.75 0.192 0.590 0.099 0.090 0.05 0.051 8° 0° 0.4 0° 0079457_M 14/18 Typ 4.40 0.03 0.70 1.14 0.45 1.23 8.95 7.50 10 8.50 0.208 0.624 0.106 0.110 0.055 0.069 0.016 8° STx30NM60ND Package mechanical data TO-247 Mechanical data mm. Dim. A Min. 4.85 A1 2.20 Typ Max. 5.15 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c 0.40 0.80 D 19.85 20.15 E 15.45 e 15.75 5.45 L 14.20 14.80 L1 3.70 4.30 L2 18.50 øP 3.55 øR 4.50 S 3.65 5.50 5.50 15/18 Packing mechanical data 5 STx30NM60ND Packing mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 MAX. R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 * on sales type 16/18 inch 0.933 0.956 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 STx30NM60ND 6 Revision history Revision history Table 8. Document revision history Date Revision Changes 29-Nov-2007 1 initial release 11-Nov-2008 2 Document status promoted from preliminary data to datasheet. 17/18 STx30NM60ND Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 18/18