TC1305 Dual 150mA CMOS LDO With Select Mode™ Operation, Shutdown and Independent RESET Output Features General Description • Extremely Low Supply Current for Longer Battery Life • Select Mode™ Operation: Selectable Output Voltages for High Design Flexibility • Very Low Dropout Voltage • 29µVRMS Typical Output Noise • 10µsec (Typ.) Wake-Up Time from SHDN • 150mA Output Current per Output • High Output Voltage Accuracy • Power-Saving Shutdown Mode • RESET Output Can Be Used as a Low Battery Detector or Processor Reset Generator • Over Current Protection and Over Temperature Shutdown • Space Saving 10-Pin MSOP Package The TC1305 combines two CMOS Low Dropout Regulators and a Microprocessor Monitor in a space saving 10-Pin MSOP package. Designed specifically for battery operated systems, total supply current is typically 120µA at full load, 20 to 60 times lower than in bipolar regulators. Applications • • • • • • • Load Partitioning Battery Operated Systems Portable Computers Medical Instruments Instrumentation Pagers and Cellular/PHS Phones Linear Post-Regulator for SMPS TC1305R-DVUN An active low RESET is asserted when the detected voltage (V DET) falls below the 2.63V reset voltage threshold. The RESET output remains low for 300msec (typical) after VDET rises above reset threshold. When the shutdown controls (SHDN1 and SHDN2) are low, the regulator output voltages fall to zero, RESET output remains valid and supply current is reduced to 20µA (typ.) Other key features for the device include ultra low noise operation, fast response to step changes in load and very low dropout voltage (typically 150mV at full load). The device also incorporates both over temperature and over current protection. Each regulator is stable with an output capacitor of only 1µF and has a maximum output current of 150mA. The TC1305 is featured in a 10-Pin MSOP package with selective output voltages. Device Selection Table Part Number The TC1305 features selectable output voltages for higher design flexibility. The tri-state SELECT input pin allows the user to select VOUT1 and VOUT2 from 3 different values (2.5V, 2.8V and 3.0V). Junction Temperature Range Package 10-Pin MSOP -40°C to +85°C Typical Application VDET VIN 10 2 9 RESET VOUT2 3.3µF NOTE: “R” denotes the suffix for the 2.63V VDET threshold. “D” indicates VOUT1 = VOUT2 = 2.5, 2.8, 3.0 (selectable). GND Other output voltages are available. Please contact Microchip Technology Inc. for details. SELECT Package Type 1 3 TC1305 8 VOUT1 3.3µF SHDN1 4 7 5 6 470pF Bypass (Optional) SHDN2 10-Pin MSOP VDET 1 10 RESET VIN 2 GND 3 9 VOUT2 TC1305 SELECT 4 SHDN1 5 2002 Microchip Technology Inc. 8 VOUT1 7 Bypass 6 SHDN2 DS21526A-page 1 TC1305 1.0 ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS* Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 7) Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V Operating Temperature Range.... -40°C < TJ < +125°C Storage Temperature Range .............. -55°C to +150°C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1305 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VR + 1V, IL = 100µA, C L = 3.3µF, SHDN1 > VIH , SHDN2 > VIH, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2. Symbol Parameter Min Typ Max Units VIN Input Operating Voltage 2.7 — 6.0 V IOUTMAX Maximum Output Current 150 — — mA VOUT Output Voltage (VOUT1 and VOUT2) TCV OUT VOUT Temperature Coefficient VR – 2.5% VR ± 0.5% VR + 2.5% — — 20 40 — — ∆VOUT/∆VIN Line Regulation V Test Conditions Note 1 Per Channel Note 2 ppm/°C Note 3 — 0.05 0.35 % (VR + 1V) < VIN < 6V ∆V OUT/VOUT Load Regulation — 0.5 2 % IL = 0.1mA to IOUTMAX (Note 4) VIN – VOUT Dropout Voltage — 2 50 100 150 — 120 240 360 mV IL = 100µA IL = 50mA IL = 100mA IL = 150mA (Note 5) IIN Supply Current — 120 160 µA SHDN1, SHDN2 = VIH , IL = 0 IINSD Shutdown Supply Current — 0.05 0.5 µA SHDN1, SHDN2 = 0V PSRR Power Supply Rejection Ratio — 64 — dB FRE ≤ 120Hz IOUTSC Output Short Circuit Current — 600 — mA VOUT = 0V ∆V OUT∆PD Thermal Regulation — 0.04 — V/W Notes 6, 7 tWK Wake Up Time — 10 — µsec VIN = 5V CIN = 1µF, COUT = 4.7µF IL = 30mA, (See Figure 4-1) ts Settling Time — 40 — µsec VIN = 5V CIN = 1µF, COUT = 4.7µF IL = 30mA, (See Figure 4-1) (from Shutdown Mode) (from Shutdown Mode) Note 1: 2: 3: 4: 5: 6: 7: The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN ≥ VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 2.5V, 2.8V, 3.0V. TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x ∆T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θ JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details. DS21526A-page 2 2002 Microchip Technology Inc. TC1305 TC1305 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN = VR + 1V, IL = 100µA, CL = 3.3µF, SHDN1 > VIH, SHDN2 > VIH , TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2. Symbol Parameter Min Typ Max Units — 160 — °C Test Conditions TSD Thermal Shutdown Die Temperature ∆TSD Thermal Shutdown Hysteresis — 15 — °C eN Output Noise — 200 — nV√Hz IL = 100µA, F = 1kHz, COUT1 = C OUT2 = 4.7µF, CBYPASS = 0.01µF — 29 — µVRMS F = 10Hz to 100kHz SHDN Input VIH SHDN Input High Threshold 65 — — %VIN VIN = 2.7V to 6.0V VIL SHDN Input Low Threshold — — 15 %VIN VIN = 2.7V to 6.0V VIN – 0.2 — — V VIN = 2.7V to 6.0V — 0.2 V VIN = 2.7V to 6.0V 1.0 1.2 — — 6.0 6.0 V TA = 0°C to +70°C TA = -40°C to +125°C 2.59 2.55 2.63 — 2.66 2.70 V TA = +25°C TA = -40°C to +125°C RESET = Open SELECT Input VSELH SELECT Input HIgh Threshold VSELL SELECT Input Low Threshold RESET Output VDET VDET Voltage Range VTH Reset Threshold IVDET Reset Circuit Supply Current — 20 40 µA Reset Threshold Tempco — 30 — ppm/°C V DET to Reset Delay — 100 — µsec Reset Active Time-out Period VDET = VTH to (VTH – 100mV) 140 300 560 msec VOL RESET Output Voltage Low — — — — — — 0.3 0.4 0.3 V VDET = VTH MIN, ISINK = 1.2mA VDET = VTH MIN, ISINK = 3.2mA VDET > 1.0V, ISINK = 50µA VOH RESET Output Voltage High 0.8 VDET VDET – 1.5 — — — V VDET > VTHMAX, ISOURCE = 500µA VDET > VTHMAX, ISOURCE = 800µA Note 1: 2: 3: 4: 5: 6: 7: The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN ≥ VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 2.5V, 2.8V, 3.0V. TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x ∆T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details. 2002 Microchip Technology Inc. DS21526A-page 3 TC1305 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (10-Pin MSOP) Symbol Description Detected input voltage. VDET and VIN can be connected together. 1 VDET 2 VIN 3 GND 4 SELECT Tri-state input for setting V OUT1 and VOUT2. SELECT = GND for VOUT1 = VOUT2 = 2.5V, SELECT = VIN for VOUT1 = VOUT2 = 3.0V and SELECT = No connect for VOUT1 = VOUT2 = 2.8V. 5 SHDN1 Shutdown control input for VOUT1. Regulator 1 is fully enabled when a logic high is applied to this input. Regulator 1 enters shutdown when a logic low is applied to this input. During shutdown, regulator output voltage falls to zero, RESET output remains valid. 6 SHDN2 Shutdown control input for VOUT2. Regulator 2 is fully enabled when a logic high is applied to this input. Regulator 2 enters shutdown when a logic low is applied to this input. During shutdown, regulator output voltage falls to zero, RESET output remains valid. Power supply input. Ground terminal. 7 Bypass Reference bypass input. Connecting a 0.01µF to this input further reduces output noise. 8 VOUT1 Regulated voltage output 1. 9 VOUT2 Regulated voltage output 2. 10 RESET RESET Output. RESET = Low when VDET is below the Reset Threshold Voltage. RESET = High when VDET is above the Reset Threshold Voltage. DS21526A-page 4 2002 Microchip Technology Inc. TC1305 3.0 DETAILED DESCRIPTION 4.0 TYPICAL APPLICATIONS The TC1305 is a precision fixed output voltage regulator that contains two fully independent 150mA regulator outputs. The device features separate shutdown modes for low-power operation, and a common bypass pin that can be used to further reduce output noise. The Select Mode™ operation allows the user to select VOUT1 and V OUT2 from three different values (2.5V, 2.8V, 3.0V), therefore providing high design flexibility. The CMOS construction of the TC1305 results to a very low supply current, which does not increase with load changes. In addition, VOUT remains stable and within regulation at no load currents. 4.1 Input and Output Capacitor The TC1305 also features an integrated microprocessor supervisor that monitors power-up, power-down, and brown-out conditions. The active low RESET signal is asserted when the detected voltage VDET falls below the reset voltage threshold (2.63V). The RESET output remains low for 300msec (typical) after V DET rises above the reset threshold. The RESET output of the TC1305 is ensured valid down to VDET = 1V and is optimized to reject fast transient glitches on the monitored power supply line. The TC1305 is stable with a wide range of capacitor values and types. A capacitor with a minimum value of 1µF from VOUT to Ground is required. The output capacitor should have an effective series resistance (ESR) of 0.1Ω to 10Ω for a 1µF capacitor and 0.01Ω to 10Ω for a 10µF capacitor. A 1µF capacitor should be connected from the VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -20°C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 4.2 Bypass Capacitor A 0.01µF capacitor connected from the bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but result in a longer time period to rated output voltage when power is initially applied. 4.3 Shutdown Mode Applying a logic high to each of the shutdown pins turns on the corresponding output. Each regulator enters shutdown mode when a logic low is applied in the corresponding input. During shutdown mode, the output voltage falls to zero, and regulator supply current is reduced to 0.5µA (max). If shutdown mode is not necessary, the pins should be connected to VIN. 2002 Microchip Technology Inc. DS21526A-page 5 TC1305 4.4 Select Mode™ Operation The Select Mode™ operation is a tri-state input that allows the user to select VOUT1 and VOUT2 from three different values. By connecting the SELECT pin to GND, both output voltages (VOUT1, VOUT2) supply 2.5V. Connecting the SELECT pin to VIN results in both output channels supplying a fixed 3.0V output. Last but not least, leaving the SELECT pin floating sets both voltages to 2.8V. This output voltage functionality provides high design flexibility and minimizes costs associated with inventory, time-to-market and new device qualifications. 4.5 RESET Output The microprocessor supervisor of theTC1305 provides accurate supply voltage monitoring and reset timing during power-up, power-down and brown-out conditions. The RESET output is valid to VDET = 1.0V (below this point it becomes an open circuit and does not sink current) and is able to reject negative going transients (glitches) on the power supply line. Transient immunity can further be improved by adding a capacitor close to the VDET pin of the TC1305. 4.6 Turn On Response The turn on response is defined as two separate response categories, Wake Up Time (tWK) and Settling Time (tS). The TC1305 has a fast Wake Up Time (10µsec typical) when released from shutdown. See Figure 4-1 for the Wake Up Time designated as tWK. The Wake Up Time is defined as the time it takes for the output to rise to 2% of the V OUT value after being released from shutdown. The total turn on response is defined as the Settling Time (tS), see Figure 4-1. Settling Time (inclusive with tWK) is defined as the condition when the output is within 2% of its fully enabled value (40µsec typical) when released from shutdown. The settling time of the output voltage is dependent on load conditions and output capacitance on VOUT (RC response). FIGURE 4-1: WAKE-UP RESPONSE TIME VIH SHDN VIL tS 98% VOUT 2% tWK DS21526A-page 6 2002 Microchip Technology Inc. TC1305 5.0 THERMAL CONSIDERATIONS 5.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die exceeds approximately 160°C. The regulator remains off until the die temperature drops to approximately 145°C. Thermal shutdown is intended to protect the device under transient accidental (fault) overload conditions. Thermal Shutdown may not protect the LDO while operating above junction temperatures of 125°C continuously. Sufficient thermal evaluation of the design needs to be conducted to ensure that the junction temperature does not exceed 125°C. 5.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation. EQUATION 5-1: PD ≈ (VINMAX – VOUT1MIN)ILOAD1 MAX + (VINMAX – VOUT2MIN)ILOAD2MAX Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on VIN VOUT1MIN = Minimum regulator output voltage1 ILOAD1MAX = Maximum output (load) current1 VOUT2MIN = Minimum regulator output voltage2 ILOAD2MAX = Maximum output (load) current2 The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125°C), and the thermal resistance from junction-to-air (θJA). The MSOP-10 package has a θJA of approximately 113°C/W when mounted on a four layer FR4 dielectric copper clad PC board. EQUATION 5-2: PDMAX = (T JMAX – TAMAX) θJA Where all terms are previously defined. 2002 Microchip Technology Inc. Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.8V ± 5% VOUT1MIN = 3.0V ± 2.5% VOUT2MIN = 3.0V ± 2.5% ILOAD1MAX = 120mA ILOAD2MAX = 120mA TJMAX = 125°C TAMAX = 55°C θJA = 113°C/W Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ [(VINMAX – VOUT1MIN)] x ILOAD1MAX + [(VINMAX – VOUT2MIN)] x ILOAD2MAX [(3.8 x 1.05) – (3.0 x .975)] x 120 x 10-3 + [(3.8 x 1.05) – (3.0 x .975)] x 120 x 10-3 = 256mW Maximum allowable power dissipation: PD = (TJMAX – TAMAX) θJA = (125 – 55) 113 = 620mW In this example, the TC1305 dissipates a maximum of 256mW; below the allowable limit of 620mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 620mW into Equation 5-1, from which VINMAX = 5.6V. 5.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and therefore increase the maximum allowable power dissipation limit. DS21526A-page 7 TC1305 6.0 TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Dropout Voltage1 vs. Load Current (SELECT = VDD) 0.18 0.18 0.16 0.16 130°C DROPOUT VOLTAGE (V) 0.14 0.12 25°C 0.10 0.08 0.06 0.04 -45°C 0.02 0.25 130°C 0.14 0.12 25°C 0.10 0.08 0.06 0.04 -45°C 0.02 0 25 50 75 100 125 150 LOAD CURRENT (mA) 130°C 0.15 25°C 0.10 -45°C 0.05 0.00 0 25 Dropout Voltage2 vs. Load Current (SELECT = VDD) 0 50 75 100 125 150 LOAD CURRENT (mA) 130°C -45°C 0.10 0.05 0.00 0 25 50 75 100 140 0.500 120 0.400 IL = 0.1 to 150mA 0.300 0.200 130 350 RESET TIMING (µsec) 400 120 VDD = 6.0V 110 VDD = 3.0V 90 -20 5 30 55 80 30 55 80 TEMPERATURE (°C) DS21526A-page 8 60 0 3 105 130 3.5 105 125 4 4.5 VDD (V) 5 5.5 6 VCC Trip Point vs. Temperature (°C) 2.70 2.68 2.66 300 250 200 150 100 0 -40 -20 2.64 2.62 2.60 2.58 2.56 2.54 50 5 -45°C 25°C Reset Active Time vs. Temperature (°C) 140 -20 80 TEMPERATURE (°C) IDD vs. Temperature (SELECT = NC) 80 -40 100 20 LOAD CURRENT (mA) 100 130°C 40 0.100 0.000 -45 125 150 150 IDD (µA) 25°C LOAD REGULATION (%) 0.15 50 75 100 125 150 LOAD CURRENT (mA) IDD vs. VDD (SELECT = GND) 0.600 0.20 25 Load Regulation vs. Temperature 0.25 DROPOUT VOLTAGE (V) 0.20 0.00 0.00 IDD (µA) Dropout Voltage2 vs. Load Current (SELECT = VDD) VCC TRIP POINT (V) DROPOUT VOLTAGE (V) Dropout Voltage1 vs. Load Current (SELECT = NC) DROPOUT VOLTAGE (V) Note: 2.52 5 30 55 80 TEMPERATURE (°C) 105 125 2.50 -40 -20 5 30 55 80 105 125 TEMPERATURE (°C) 2002 Microchip Technology Inc. TC1305 TYPICAL CHARACTERISTICS (CONTINUED) VOUT1 vs. Temperature (SELECT = VDD) VOUT2 vs. Temperature (SELECT = VDD) 3.01 VDD = 6.0V & IL = 100µA VDD = 4.0V & IL = 100µA 2.99 VDD = 3.8V & IL = 100mA 2.97 2.96 2.95 2.81 2.99 2.80 2.98 VDD = 3.8V & IL = 150mA 2.79 2.97 2.78 2.96 VDD = 6.0V & IL = 100µA VDD = 4.0V & IL = 100µA 2.95 2.93 2.74 2.92 -45 2.73 -45 30 55 80 105 130 5 30 55 80 105 130 -20 5 30 55 80 105 130 TEMPERATURE (°C) TEMPERATURE (°C) VOUT2 vs. Temperature (SELECT = NC) VOUT1 vs. Temperature (SELECT = GND) VOUT2 vs. Temperature (SELECT = GND) 2.51 VDD = 6.0V & IL = 100µA 2.49 VOUT1 (V) VDD = 3.8V & IL = 150mA 2.77 2.76 2.51 VDD = 6.0V & IL = 100µA VDD = 3.5V & IL = 100µA 2.50 VDD = 6.0V & IL = 100µA 2.79 2.78 -20 TEMPERATURE (°C) 2.81 2.80 VDD = 3.8V & IL = 150mA 2.76 2.92 -45 5 VDD = 3.8V & IL = 100mA 2.77 2.93 -20 VDD = 6.0V & IL = 100µA 2.75 2.94 2.94 VOUT2 (V) 3.00 2.50 VDD = 3.5V & IL = 150mA VDD = 3.5V & IL = 150mA 2.48 2.47 2.46 2.48 2.46 2.45 2.45 2.74 2.44 2.44 2.43 -45 -20 5 30 55 80 105 TEMPERATURE (°C) 2002 Microchip Technology Inc. 130 VDD = 6.0V & IL = 100µA 2.47 2.75 2.73 VDD = 3.5V & IL = 100µA 2.49 VOUT2 (V) VOUT1 (V) 2.98 VOUT2 (V) 3.00 VOUT1 vs. Temperature (SELECT = NC) VOUT1 (V) 6.0 2.43 -45 -20 5 30 55 80 105 TEMPERATURE (°C) 130 -45 -20 5 30 55 80 105 130 TEMPERATURE (°C) DS21526A-page 9 TC1305 6.0 TYPICAL CHARACTERISTICS (CONTINUED) Power Supply Rejection Ratio vs. Frequency Power Supply Rejection Ratio vs. Frequency 0 0 -20 PSRR (dB) -20 IOUT = 150mA COUT = 10µF Tantalum VINDC = 4V VINAC = 100mVP-P VOUTDC = 3V PSRR (dB) -40 -60 -40 -60 -80 -80 -100 -100 10 100 1k 10k 100k 10 1M Input Voltage 2V / div 0.1 0.001 0.01 COUT1 = COUT2 = 4.7µF, CBYPASS = 0.01µF, ILOAD = 100µA, VIN = 4.0V, VOUT1 = VOUT2 = 3.0V 0.1 1 10k 100k 1M Output Voltage (50mV / div) VOUT2 VOUT1 0.01 1k Line Transient Response Output Noise 10 1 100 f (Hz) f (Hz) Noise (mV/ √HZ) IOUT = 150mA COUT = 10µF Tantalum CBYPASS = 0.01µF Ceramic VINDC = 4V VINAC = 100mVP-P VOUTDC = 3V 10 100 1000 6V 4V COUT = 10µF Ceramic CIN = 0 CBYP = 0.01µF ILOAD = 100µA VOUT = 3V Frequency (kHz) Time (2µs / div) Output Current Output Voltage (50mV / div) Load Transient Response 150mA 100µA VIN = 4V VOUT = 3V COUT = 10µF Ceramic CBYP = 0.01µF Time (100ms / div) DS21526A-page 10 2002 Microchip Technology Inc. TC1305 TYPICAL CHARACTERISTICS (CONTINUED) Output Voltage Output Voltage (20mV / div) (20mV / div) Line Transient Response VOUT2 4.6V 3.6V COUT1 = COUT2 = 10µF Ceramic RLOAD = 30kΩ Output Voltage Output Voltage (20mV / div) (20mV / div) Load Transient Response VOUT2 VOUT1 COUT1 = COUT2 = 1µF Tantalum VIN = 5.5V RLOAD = 30kΩ RL = 30kΩ 100mA 100µA Output Voltage 1 Output Voltage 2 (20mV / div) (50mV / div) Load Transient Response VOUT2 VOUT1 COUT1 = COUT2 = 10µF Ceramic VIN = 5.5V RLOAD = 30kΩ RL = 30kΩ 2002 Microchip Technology Inc. Output Current VIN Input Voltage 2V / div VOUT1 100mA 100µA Output Current Output Current Output Voltage Output Voltage (20mV / div) (20mV / div) Output Current Output Voltage Output Voltage (20mV / div) (20mV / div) Input Voltage 2V / div Output Voltage Output Voltage (20mV / div) (20mV / div) 6.0 Line Transient Response VOUT2 VOUT1 VIN 4.6V 3.6V COUT1 = COUT2 = 1µF Tantalum RLOAD = 30kΩ Load Transient Response VOUT2 VOUT1 COUT1 = COUT2 = 10µF Ceramic 100mA VIN = 5.5V RLOAD = 30kΩ RL = 30kΩ 100µA Load Transient Response VOUT2 VOUT1 COUT1 = COUT2 = 1µF Tantalum VIN = 5.5V RLOAD = 30kΩ RL = 30kΩ 100mA 100µA DS21526A-page 11 TC1305 6.0 TYPICAL CHARACTERISTICS (CONTINUED) Thermal Shutdown Response Thermal Shutdown Response VOUT 1V / div 1V / div VOUT VIN = 6.0V VOUT = 2.8V CIN = 1µF COUT = 1µF CBYPASS = 470pF VIN = 6.0V VOUT = 2.5V CIN = 1µF COUT = 1µF CBYPASS = 470pF Time (500ms / div) Time (500ms / div) Shutdown Response Thermal Shutdown Response 3.0V VOUT 3.0V VOUT1 1V / div 1V / div 1V / div VOUT2 VIN = 6.0V VOUT = 3.0V CIN = 1µF COUT = 1µF CBYPASS = 470pF /Shdn1 = /Shdn2 COUT1 = COUT2 = 1µF Tantalum VIN = 5.5V RLOAD = 30kΩ Time (500ms / div) Time (10ms / div) DS21526A-page 12 2002 Microchip Technology Inc. TC1305 7.0 PACKAGING INFORMATION 7.1 Package Marking Information Package marking data not available at this time. 7.2 Taping Form Component Taping Orientation for 10-Pin MSOP Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in 10-Pin MSOP 7.3 Package Dimensions 10-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .201 (5.10) .183 (4.65) .012 (0.30) .006 (0.15) .122 (3.10) .114 (2.90) .043 (1.10) MAX. .020 (0.50) .006 (0.15) .002 (0.05) .009 (0.23) .005 (0.13) 6° MAX. .028 (0.70) .016 (0.40) Dimensions: inches (mm) 2002 Microchip Technology Inc. DS21526A-page 13 TC1305 NOTES: DS21526A-page 14 2002 Microchip Technology Inc. TC1305 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21526A-page15 TC1305 NOTES: DS21526A-page16 2002 Microchip Technology Inc. TC1305 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro ® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. DS21526A-page 17 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC Japan Corporate Office Australia 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Rocky Mountain China - Beijing 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456 Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 Atlanta 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-6766200 Fax: 86-28-6766599 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 San Jose Hong Kong Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 New York Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 03/01/02 *DS21526A* DS21526A-page 18 2002 Microchip Technology Inc.