FUJITSU SEMICONDUCTOR DATA SHEET DS04-27231-5E ASSP For Power Management Applications (General Purpose DC/DC Converter) 2-ch DC/DC Converter IC with Overcurrent Protection MB39A104 ■ DESCRIPTION The MB39A104 is a 2-channel DC/DC converter IC using pulse width modulation (PWM), incorporating an overcurrent protection circuit (requiring no current sense resistor). This IC is ideal for down conversion. Operating at high frequency reduces the value of coil. This is ideal for built-in power supply such as LCD monitors and ADSL. This product is covered by US Patent Number 6,147,477. ■ FEATURES • • • • • • • • • Built-in timer-latch overcurrent protection circuit (requiring no current sense resistor) Power supply voltage range : 7 V to 19 V Reference voltage : 5.0 V ± 1 % Error amplifier threshold voltage : 1.24 V ± 1 % High-frequency operation capability : 1.5 MHz (Max) Built-in standby function: 0 µA (Typ) Built-in soft-start circuit independent of loads Built-in totem-pole type output for P-ch MOS FET One type of package (SSOP-24 pin : 1 type) ■ APPLICATION • • • • LCD monitor/panel IP phone Printer Video capture etc. Copyright©2002-2006 FUJITSU LIMITED All rights reserved MB39A104 ■ PIN ASSIGNMENTS (TOP VIEW) VCCO : 1 24 : CTL VH : 2 23 : GNDO OUT1 : 3 22 : OUT2 VS1 : 4 21 : VS2 ILIM1 : 5 20 : ILIM2 DTC1 : 6 19 : DTC2 VCC : 7 18 : GND CSCP : 8 17 : VREF FB1 : 9 16 : FB2 −INE1 : 10 15 : −INE2 CS1 : 11 14 : CS2 RT : 12 13 : CT (FPT-24P-M03) 2 MB39A104 ■ PIN DESCRIPTION Pin No. Symbol I/O Descriptions 1 VCCO ⎯ Output circuit power supply terminal (Connect to same potential as VCC pin) 2 VH O Power supply terminal for FET drive circuit (VH = VCC − 5 V) 3 OUT1 O External P-ch MOS FET gate drive terminal 4 VS1 I Overcurrent protection circuit input terminal 5 ILIM1 I Overcurrent protection circuit detection resistor connection terminal. Set overcurrent detection reference voltage depending on external resistor and internal current resource (110 µA at RT = 24 kΩ) 6 DTC1 I PWM comparator block (PWM) input terminal. Compares the lowest voltage among FB1 and DTC1 terminals with triangular wave and controls output. 7 VCC ⎯ Power supply terminal for reference power supply and control circuit (Connect to same potential as the VCCO terminal) 8 CSCP ⎯ Timer-latch short-circuit protection capacitor connection terminal 9 FB1 O Error amplifier (Error Amp 1) output terminal 10 −INE1 I Error amplifier (Error Amp 1) inverted input terminal 11 CS1 ⎯ Soft-start capacitor connection terminal 12 RT ⎯ Triangular wave oscillation frequency setting resistor connection terminal 13 CT ⎯ Triangular wave oscillation frequency setting capacitor connection terminal 14 CS2 ⎯ Soft-start capacitor connection terminal 15 −INE2 I Error amplifier (Error Amp 2) inverted input terminal 16 FB2 O Error amplifier (Error Amp 2) output terminal 17 VREF O Reference voltage output terminal 18 GND ⎯ Output circuit ground terminal (Connect to same potential as GNDO terminal.) 19 DTC2 I PWM comparator block (PWM) input terminal. Compares the lowest voltage among FB2 and DTC2 terminals with triangular wave and controls output. 20 ILIM2 I Overcurrent protection circuit detection resistor connection terminal. Set overcurrent detection reference voltage depending on external resistor and internal current resource (110 µA at RT = 24 kΩ) 21 VS2 I Overcurrent protection circuit input terminal 22 OUT2 O External P-ch MOS FET gate drive terminal 23 GNDO ⎯ Output circuit ground terminal (Connect to same potential as GND terminal) 24 CTL I Power supply control terminal. Setting the CTL terminal at “L” level places IC in the standby mode. 3 MB39A104 ■ BLOCK DIAGRAM −INE1 10 VREF 10 µA CS1 11 PWM + Comp.1 + + + 1.24 V 1 VCCO CH1 L priority Error Amp1 Drive1 P-ch 3 OUT1 L priority FB1 9 IO = 200 mA at VCCO = 12 V 4 VS1 Current Protection Logic + 5 ILIM1 DTC1 6 −INE2 15 VREF 10 µA CS2 14 PWM + Comp.2 + + + 1.24 V CH2 L priority Error Amp2 Drive2 P-ch FB2 16 IO = 200 mA at VCCO = 12 V DTC2 19 SCP Comp. + + H: at OCP (3.1 V) SCP Logic CSCP 8 VCC − 5 V VH Bias Voltage Error Amp Referennce bias 2 VH Accuracy ±1% 17 VREF 7 VCC 1.24 V VREF Power VR1 ON/OFF CTL 5.0 V 12 13 RT CT 20 ILIM2 Error Amp Power Supply H:UVLO release OSC + 23 GNDO 2.5 V 1.5 V UVLO 21 VS2 Current Protection Logic H priority H: at SCP 4 22 OUT2 L priority 18 GND 24 CTL MB39A104 ■ ABSOLUTE MAXIMUM RATINGS Parameter Symbol Power supply voltage VCC Output current Condition Rating Unit Min Max VCC, VCCO terminal ⎯ 20 V IO OUT1, OUT2 terminal ⎯ 60 mA Output peak current IOP Duty ≤ 5% (t = 1/fOSC×Duty) ⎯ 700 mA Power dissipation PD Ta ≤ +25 °C ⎯ 740* mW −55 +125 °C Storage temperature ⎯ TSTG * : The packages are mounted on the epoxy board (10 cm × 10 cm). WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Value Min Typ Max Unit Power supply voltage VCC VCC, VCCO terminal 7 12 19 V Reference voltage output current IREF VREF terminal −1 ⎯ 0 mA VH output current IVH VH terminal 0 ⎯ 30 mA VINE −INE1, −INE2 terminal 0 ⎯ VCC − 0.9 V VDTC DTC1, DTC2 terminal 0 ⎯ VCC − 0.9 V VCTL CTL terminal 0 ⎯ 19 V −45 ⎯ +45 mA Input voltage Control input voltage Output current IO OUT1, OUT2 terminal Output Peak current IOP Duty ≤ 5% (t = 1/fOSC×Duty) −450 ⎯ +450 mA Oscillation frequency fOSC Overcurrent detection by ON resistance of FET 100 500 1000 kHz * 100 500 1500 kHz Timing capacitor CT ⎯ 39 100 560 pF Timing resistor RT ⎯ 11 24 130 kΩ VH terminal capacitor CVH VH terminal ⎯ 0.1 1.0 µF Soft-start capacitor CS CS1, CS2 terminal ⎯ 0.1 1.0 µF Short-circuit detection capacitor CSCP CSCP terminal ⎯ 0.1 1.0 µF Reference voltage output capacitor CREF VREF terminal ⎯ 0.1 1.0 µF −30 +25 +85 °C Operating ambient temperature Ta ⎯ * : Refer to“ ■ SETTING THE TRIANGULAR OSCILLATION FREQUENCY”. WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand. 5 MB39A104 ■ ELECTRICAL CHARACTERISTICS (VCC = VCCO = 12 V, VREF = 0 mA, Ta = +25 °C) Symbol Pin No Output voltage VREF 17 Ta = +25 °C Output voltage temperature variation ∆VREF/ VREF 17 Input stability Line Load stability Short-circuit output current 7.Error amplifier 6.Soft2.Under 5.Triangular 4.Short-circuit 3.Short-circuit block start voltage lockout wave oscillator detection block detection block [Error Amp1, block protection circuit block [OSC] [SCP Comp.] [SCP Logic] Error Amp2] [CS1, CS2] block [UVLO] 1.Reference voltage block [REF] Parameter Conditions Value Unit Min Typ Max 4.95 5.00 5.05 V Ta = 0 °C to +85 °C ⎯ 0.5* ⎯ % 17 VCC = 7 V to 19 V ⎯ 3 10 mV Load 17 VREF = 0 mA to −1 mA ⎯ 1 10 mV IOS 17 VREF = 1 V −50 −25 −12 mA VTLH 17 VREF = 2.6 2.8 3.0 V VTHL 17 VREF = 2.4 2.6 2.8 V Hysteresis width VH 17 ⎯ ⎯ 0.2* ⎯ V Threshold voltage VTH 8 ⎯ 0.68 0.73 0.78 V Input source current ICSCP 8 ⎯ −1.4 −1.0 −0.6 µA Reset voltage VRST 17 2.4 2.6 2.8 V Threshold voltage VTH 8 ⎯ 2.8 3.1 3.4 V Oscillation frequency fOSC 13 CT = 100 pF, RT = 24 kΩ 450 500 550 kHz ∆fOSC/ fOSC 13 Ta = 0 °C to +85 °C ⎯ 1* ⎯ % Charge current ICS 11, 14 CS1 = CS2 = 0 V −14 −10 −6 µA Threshold voltage VTH 9, 16 FB1 = FB2 = 2 V 1.227 1.240 1.253 V Input bias current IB 10, 15 −INE1 = −INE2 = 0 V −120 −30 ⎯ nA Voltage gain AV 9, 16 DC ⎯ 100* ⎯ dB Threshold voltage Frequency temperature variation VREF = (Continued) 6 MB39A104 (Continued) (VCC = VCCO = 12 V, VREF = 0 mA, Ta = +25 °C) 12.Control block 13.General [CTL] 11.Output block [Drive1, Drive2] 10.Bias 9.Overcurrent 8.PWM comparator 7.Error amplifier block voltage protection circuit block [Error Amp1, block block [PWM Comp.1, Error Amp2] [VH] [OCP1, OCP2] PWM Comp.2] Parameter Symbol Pin No. BW 9, 16 VOH 9, 16 VOL 9, 16 ISOURCE 9, 16 ISINK Conditions Value Unit Min Typ Max ⎯ 1.6* ⎯ MHz ⎯ 4.7 4.9 ⎯ V ⎯ ⎯ 40 200 mV FB1 = FB2 = 2 V ⎯ −2 −1 mA 9, 16 FB1 = FB2 = 2 V 150 200 ⎯ µA VT0 6, 19 Duty cycle = 0 % 1.4 1.5 ⎯ V VT100 6, 19 Duty cycle = Dtr ⎯ 2.5 2.6 V Input current IDTC 6, 19 DTC1 = DTC2 = 0.4 V −2.0 −0.6 ⎯ µA ILIM terminal input current ILIM 5, 20 RT = 24 kΩ, CT = 100 pF 99 110 121 µA Offset voltage VIO 5, 20 ⎯ ⎯ 1* ⎯ mV Output voltage VH 2 Output source current ISOURCE 3, 22 OUT1 to OUT4 = 7 V, Duty ≤ 5 % (t = 1/fOSC×Duty) ⎯ −300 ⎯ mA Output sink current ISINK 3, 22 OUT1 to OUT4 = 12 V, Duty ≤ 5 % (t = 1/fOSC×Duty) ⎯ 350 ⎯ mA Output ON resistor ROH 3, 22 OUT1 = OUT2 = −45 mA ⎯ 8.0 12.0 Ω ROL 3, 22 OUT1 = OUT2 = 45 mA ⎯ 6.5 9.7 Ω VIH 24 IC Active mode 2 ⎯ 19 V VIL 24 IC Standby mode 0 ⎯ 0.8 V ICTLH 24 CTL = 5 V ⎯ 50 100 µA ICTLL 24 CTL = 0 V ⎯ ⎯ 1 µA Standby current ICCS 1, 17 CTL = 0 V ⎯ 0 10 µA Power supply current ICC 1, 17 CTL = 5 V ⎯ 4.0 6.0 mA Frequency bandwidth Output voltage Output source current Output sink current AV = 0 dB Threshold voltage CTL input voltage Input current VCC = VCCO = 7 V to 19 V VCC− VCC− VCC− VH = 0 mA to 30 mA 5.5 5.0 4.5 V *: Standard design value. 7 MB39A104 ■ TYPICAL CHARACTERISTICS Power Supply Current vs. Power Supply Voltage 10 Reference voltage VREF (V) Ta = +25 °C CTL = 5 V 8 6 4 2 0 5 10 15 8 6 4 2 20 0 5 10 15 Power supply voltage VCC (V) Reference Voltage vs. Load current Reference Voltage vs. Ambient Temperature 2.0 Ta = +25 °C VCC = 12 V CTL = 5 V 8 6 4 2 0 0 20 Power supply voltage VCC (V) 10 Reference voltage VREF (V) Ta = +25 °C CTL = 5 V VREF = 0 mA 0 0 Reference voltage ∆VREF (%) Power supply current ICC (mA) 10 Reference Voltage vs. Power Supply Voltage 5 10 15 20 25 30 35 Load current IREF (mA) VCC = 12 V CTL = 5 V VREF = 0 mA 1.5 1.0 0.5 0.0 −0.5 −1.0 −1.5 −2.0 −40 −20 0 +20 +40 +60 +80 +100 Ambient temperature Ta (°C) CTL terminal current ICTL (µA) 500 10 Ta = +25 °C 9 VCC = 12 V VREF = 0 mA 8 400 7 6 300 VREF 5 4 200 ICTL 3 2 100 1 0 0 5 10 15 Reference voltage VREF (V) CTL terminal Current vs. CTL terminal Voltage 0 20 CTL terminal voltage VCTL (V) (Continued) 8 MB39A104 Triangular Wave Oscillation Frequency vs. Timing Capacitor 10000 Ta = +25 °C VCC = 12 V CTL = 5 V 1000 CT = 39 pF CT = 560 pF 100 CT = 220 pF CT = 100 pF 10000 Triangular wave oscillation frequency fOSC (kHz) Triangular wave oscillation frequency fOSC (kHz) Triangular Wave Oscillation Frequency vs. Timing Resistor Ta = +25 °C VCC = 12 V CTL = 5 V 1000 RT = 11 kΩ 100 RT = 130 kΩ 10 10 1 10 100 10 1000 100 Timing resistor RT (kΩ) 3.2 Ta = +25 °C VCC = 12 V CTL = 5 V RT = 47 kΩ 3.0 2.8 Upper 2.6 2.4 2.2 2.0 1.8 Lower 1.6 1.4 1.2 0 200 400 600 VCC = 12 V 3.0 CTL = 5 V 2.8 RT = 24 kΩ CT = 100 pF 2.6 2.2 2.0 1.8 Lower 1.6 1.4 1.2 −40 800 1000 1200 1400 1600 540 520 500 480 460 −20 0 +20 +40 +60 +80 Ambient temperature Ta ( °C) +100 0 +20 +40 +60 +80 +100 Triangular Wave Oscillation Frequency vs. Power supply voltage Triangular wave oscillation frequency fOSC (kHz) VCC = 12 V CTL = 5 V RT = 24 kΩ CT = 100 pF −20 Ambient temperature Ta ( °C) Triangular Wave Oscillation Frequency vs. Ambient Temperature 560 Upper 2.4 Triangular wave oscillation frequency fOSC (kHz) 440 −40 10000 Triangular Wave Upper and Lower Limit Voltage vs. Ambient Temperature Triangular wave upper and lower limit voltage VCT (V) Triangular wave upper and lower limit voltage VCT (V) 3.2 1000 Timing capacitor CT (pF) Triangular Wave Upper and Lower Limit Voltage vs. Triangular Wave Oscillation Frequency Triangular wave oscillation frequency fOSC (kHz) RT = 24 kΩ RT = 68 kΩ 560 Ta = +25 °C CTL = 5 V RT = 24 kΩ CT = 100 pF 540 520 500 480 460 440 0 5 10 15 20 Power supply voltage VCC (V) (Continued) 9 MB39A104 (Continued) Error Amplifier, Gain, Phase vs. Frequency Ta = +25 °C VCC = 12 V 180 40 ϕ 90 Phase φ (deg) 20 Gain AV (dB) 240 kΩ AV 30 10 0 0 −10 −20 −90 −180 −40 100 1k 10 k 100 k 1M 10 M Frequency f (Hz) Power Dissipation vs. Ambient Temperature Power dissipation PD (mW) 1000 10 + IN 10 kΩ 2.4 kΩ (15) 10 − 11 (14) + + 1.24 V −30 800 740 600 400 200 0 −40 10 kΩ 1 µF −20 0 +20 +40 +60 Ambient temperature Ta ( °C) +80 +100 9 (16) OUT Error Amp1 (Error Amp2) MB39A104 ■ FUNCTIONS 1. DC/DC Converter Functions (1) Reference voltage block (REF) The reference voltage circuit generates a temperature-compensated reference voltage (5.0 V Typ) from the voltage supplied from the VCC terminal (pin 7). The voltage is used as the reference voltage for the IC’s internal circuitry. The reference voltage can supply a load current of up to 1 mA to an external device through the VREF terminal (pin 17). (2) Triangular-wave oscillator block (OSC) The triangular wave oscillator incorporates a timing capacitor and a timing resistor connected respectively to the CT terminal (pin 13) and RT terminal (pin 12) to generate triangular oscillation waveform amplitude of 1.5 V to 2.5 V. The triangular waveforms are input to the PWM comparator in the IC. (3) Error amplifier block (Error Amp1, Error Amp2) The error amplifier detects the DC/DC converter output voltage and outputs PWM control signals. In addition, an arbitrary loop gain can be set by connecting a feedback resistor and capacitor from the output terminal to inverted input terminal of the error amplifier, enabling stable phase compensation to the system. Also, it is possible to prevent rush current at power supply start-up by connecting a soft-start capacitor with the CS1 terminal (pin 11) and CS2 terminal (pin 14) which are the non-inverted input terminal for Error Amp. The use of Error Amp for soft-start detection makes it possible for a system to operate on a fixed soft-start time that is independent of the output load on the DC/DC converter. (4) PWM comparator block (PWM Comp.1, PWM Comp.2) The PWM comparator is a voltage-to-pulse width modulator that controls the output duty depending on the input/ output voltage. The comparator keeps output transistor on while the error amplifier output voltage remain higher than the triangular wave voltage. (5) Output block (Drive1, Drive2) The output block is in the totem pole configuration, capable of driving an external P-channel MOS FET. (6) Bias voltage block (VH) This bias voltage circuit outputs VCC − 5 V(Typ) as minimum potential of the output circuit. In standby mode, this circuit outputs the potential equal to VCC. 11 MB39A104 2. Control Function When CTL terminal (pin 24) is “L” level, IC becomes the standby mode. The power supply current is 10 µA (Max) at the standby mode. On/Off Setting Conditions CTL Power L OFF (Standby) H ON (Operating) 3. Protective Functions (1) Timer-latch overcurrent protection circuit block (OCP) The timer-latch overcurrent protection circuit is actuated upon completion of the soft-start period. When an overcurrent flows, the circuit detects the increase in the voltage between the FET’s drain and source using the external FET ON resistor, actuates the timer circuit, and starts charging the capacitor CSCP connected to the CSCP terminal (pin 8). If the overcurrent remains flowing beyond the predetermined period of time, latch is set and OUT terminals (pin 3,22) of each channel are fixed at “H” level. And the circuit sets the latch to turn off the external FET. The detection current value can be set by resistor RLIM1 connected between the FET’s drain and the ILIM1 terminal (pin 5) and resistor RLIM2 connected between the drain and the ILIM2 terminal (pin 20). Changing connection enables to detect overcurrent at current sense resistor. To reset the actuated protection circuit, either the power supply turn off and on again or set the CTL terminal (pin 6) to the “L” level to lower the VREF terminal (pin 17) voltage to 2.4 V (Min) or less. (Refer to “1. Setting Timer-Latch Overcurrent Protection Detection Current” in “■ABOUT TIMER-LATCH PROTECTION CIRCUIT”.) (2) Timer-latch short-circuit protection circuit (SCP Logic, SCP Comp.) The short-circuit detection comparator (SCP Comp.) detects the output voltage level of Error Amp, and if the error amp output voltage of any channel falls below the short-circuit detection voltage (3.1 V Typ), the timer circuits are actuated to start charging the external capacitor CSCP connected to the CSCP terminal (pin 8). When the capacitor voltage reaches about 0.73 V, the circuit is turned off the output transistor and sets the dead time to 100 %. To reset the actuated protection circuit, either the power supply turn off and on again or set the CTL terminal (pin 24) to the “L” level to lower the VREF terminal (pin 17) voltage to 2.4 V (Min) or less. (Refer to “2. Setting Time Constant for Timer-Latch Short-Circuit Protection Circuit” in “■ABOUT TIMER-LATCH PROTECTION CIRCUIT”.) (3) Under voltage lockout protection circuit (UVLO) The transient state or a momentary decrease in supply voltage, which occurs when the power supply is turned on, may cause the IC to malfunction, resulting in breakdown or degradation of the system. To prevent such malfunctions, under voltage lockout protection circuit detects a decrease in internal reference voltage with respect to the power supply voltage, turns off the output transistor, and sets the dead time to 100% while holding the CSCP terminal (pin 8) at the “L” level. The circuit restores the output transistor to normal when the supply voltage reaches the threshold voltage of the undervoltage lockout protection circuit. (4) Protection circuit operating function table This table refers to output condition when protection circuit is operating. Operating circuit CS1 CS2 12 OUT1 OUT2 Overcurrent protection circuit L L H H Short-circuit protection circuit L L H H Under-voltage lockout L L H H MB39A104 ■ SETTING THE OUTPUT VOLTAGE • Output Voltage Setting Circuit VO R1 (−INE2) 15 −INE1 10 R2 (CS2) 14 CS1 11 Error Amp − + + VO (V) = 1.24 R2 (R1 + R2) 1.24 V ■ SETTING THE TRIANGULAR OSCILLATION FREQUENCY The triangular oscillation frequency is determined by the timing capacitor (CT) connected to the CT terminal (pin 13), and the timing resistor (RT) connected to the RT terminal (pin 12). Moreover, it shifts more greatly than the calculated values according to the constant of timing resistor (RT) when the triangular wave oscillation frequency exceeds 1 MHz. Therefore, set it referring to “Triangular Wave Oscillation Frequency vs. Timing Resistor” and “Triangular Wave Oscillation Frequency vs. Timing Capacitor” in “■ TYPICAL CHARACTERISTICS”. Triangular oscillation frequency : fOSC fOSC (kHz) =: 1200000 CT (pF) × RT (kΩ) 13 MB39A104 ■ SETTING THE SOFT-START AND DISCHARGE TIMES To prevent rush currents when the IC is turned on, you can set a soft-start by connecting soft-start capacitors (CS1 and CS2) to the CS1 terminal (pin 11) for channel 1 and the CS2 terminal (pin 14) for channel 2, respectively. When CTL terminal (pin 24) goes to “H” level and IC starts (VCC ≥ UVLO threshold voltage), the external softstart capacitors (CS1 and CS2) connected to CS1 and CS2 terminals are charged at 10 µA. The error amplifier output (FB1 (pin 9) , FB2 (pin 16) ) is determined by comparison between the lower one of the potentials at two non-inverted input terminals (1.24 V, CS1 terminal voltages) and the inverted input terminal voltage (−INE1 (pin 10) voltage, −INE2 (pin 15) voltage). The FB1 (FB2) terminal voltage is decided for the soft-start period by the comparison between 1.24 V in an internal reference voltage and the voltages of the CS1 (CS2) terminal. The DC/DC converter output voltage rises in proportion to the CS1 (CS2) terminal voltage as the soft-start capacitor connected to the CS1 (CS2) terminal is charged. The soft-start time is obtained from the following formula: Soft-start time: ts (time to output 100%) ts (s) =: 0.124 × CS (µF) CS1 (CS2) terminal voltage =: 5 V Error Amp block −INE1 (−INE2) voltage =: 1.24 V =: 0 V t Soft-start time (ts) 14 MB39A104 • Soft-Start Circuit VREF VO 10 µA R1 −INE1 10 (−INE2) 15 R2 L priority Error Amp − CH ON/OFF signal L : ON, H : OFF 11 CS1 (CS2) CS1 (CS2) FB1 + + 14 1.24 V 9 (FB2) 16 UVLO 15 MB39A104 ■ TREATMENT WITHOUT USING CS TERMINAL When not using the soft-start function, open the CS1 terminal (pin 11) and the CS2 terminal (pin 14) . • Without Setting Soft-Start Time “OPEN” “OPEN” 11 CS1 16 CS2 14 MB39A104 ■ ABOUT TIMER-LATCH PROTECTION CIRCUIT 1. Setting Timer-Latch Overcurrent Protection Detection Current The overcurrent protection circuit is actuated upon completion of the soft-start period. When an overcurrent flows, the circuit detects the increase in the voltage between the FET’s drain and source using the external FET ON resistor (RON), actuates the timer circuit, and starts charging the capacitor CSCP connected to the CSCP terminal (pin 8). If the overcurrent remains flowing beyond the predetermined period of time, the circuit sets the latch to fix OUT terminals (pin 3, 22) at “H” level and turn off the external FET. The detection current value can be set by the resistors (RLIM1 and RLIM2) connected between the FET’s drain and the ILIM1 terminal (pin 5) and between the drain and the ILIM2 terminal (pin 20), respectively. The internal current (ILIM) can be set by the timing resistor (RT) connected to the RT terminal (pin 12). Time until activating timer circuit and setting latch is equal to short-circuit detection time in "2. Setting Time Constant for Timer-Latch Short-Circuit Protection Circuit". Internal current value: ILIM ILIM (µA) =: 2700 RT (kΩ) Detection current value: IOCP IOCP (A) =: RLIM : RON : VIN : VO : fOSC : L : ILIM(A) × RLIM(Ω) RON (Ω) − (VIN(V) − VO(V)) × VO(V) 2 × VIN(V) × fOSC(Hz) × L(H) Overcurrent detection resistor External FET ON resistor Input voltage DC/DC converter output voltage Oscillation frequency Coil inductance To reset the actuated protection circuit, either the power supply turn off and on again or set the CTL terminal (pin 24) to the "L" level to lower the VREF terminal (pin 17) voltage to 2.4 V (Min) or less. • Overcurrent detection circuit VIN Q1 L (VS2) 21 VS1 4 VO Current Protection Logic (1 µA) − (ILIM2) + 20 ILIM1 5 (RLIM) Each Channel Drive CSCP 8 VREF S R Latch UVLO 17 MB39A104 Overcurrent Protection Circuit: Range of Operation When an overcurrent flow occurs, if the increased voltage between the drain and source of the FET is detected by means of the external FET (Q1) resistor, operational stability is lost when the external FET (Q1) ON interval determined by the oscillation frequency, input voltage, and output voltage falls below 450 ns. Therefore, the circuit should be used within a range that ensures that the ON interval does not fall below 450ns, according to the following formula. ON interval 450 (ns) ≤ VO (V) VIN (V) × fOSC (Hz) If the ON interval of the external FET (Q1) is below 450ns, we recommend the use of an overcurrent detection resistor RS to detect overcurrent, as shown below. This example shows the range of operation of the overcurrent detection function with a setting of Vo = 3.3V. • Method to detect by current when external FET(Q1) is turned on VIN Overcurrent Detection Function Operating Range (Rs) 1600 Error Amp Q1 1400 (VS2) − + VO = set to 3.3 V 1200 fOSC (kHz) 21 4 VS1 1000 800 400 (ILIM2) 20 ILIM1 5 Connect to RS when using RS Operation Range 200 0 6 8 10 12 14 VCC (V) 16 18 20 • Method to detect by mean current (Possible to detect at 2 V or more of output voltage) Overcurrent Detection Function Operating Range VIN 21 (VS2) 4 VS1 Error Amp RS 1600 1400 VO = set to 3.3 V 1200 fOSC (kHz) Q1 1000 800 Operation Range 600 − + (ILIM2) 20 ILIM1 5 400 200 0 18 6 8 10 12 14 VCC (V) 16 18 20 MB39A104 2. Setting Time Constant for Timer-Latch Short-Circuit Protection Circuit Each channel uses the short-circuit detection comparator (SCP Comp.) to always compare the error amplifier′s output level to the reference voltage (3.1 V Typ). While DC/DC converter load conditions are stable on all channels, the short-circuit detection comparator output remains at “L” level, and the CSCP terminal (pin 8) is held at “L” level. If the load condition on a channel changes rapidly due to a short-circuit of the load, causing the output voltage to drop, the output of the short-circuit detection comparator goes to “H” level. This causes the external shortcircuit protection capacitor CSCP connected to the CSCP terminal to be charged at 1 µA. Short-circuit detection time (tSCP) tSCP (s) =: 0.73 × CSCP (µF) When the capacitor CSCP is charged to the threshold voltage (VTH =: 0.73 V), the latch is set and the external FET is turned off (dead time is set to 100%). At this time, the latch input is closed and the CSCP terminal (pin 8) is held at “L” level. If a short-circuit is detected on either of the two channels, both channels are shut off. When the power supply is turned on back or VREF terminal (pin 17) voltage is less than 2.4 V (Min) by setting CTL terminal (pin 24) to “L” level, the latch is released. • Timer-latch short-circuit protection circuit (FB2) VO R1 FB1 16 9 (−INE2) 15 −INE1 − 10 Error Amp + R2 (1.24 V) SCP Comp. + + − (3.1 V) (1 µA) To each channel Drive CSCP 8 VREF S R Latch UVLO 19 MB39A104 ■ TREATMENT WITHOUT USING CSCP TERMINAL When not using the timer-latch short-circuit protection circuit, connect the CSCP terminal (pin 8) to GND with the shortest distance. • Treatment without using CSCP GND 8 18 CSCP ■ RESETTING THE LATCH OF EACH PROTECTION CIRCUIT When the overcurrent, or short-circuit protection circuit detects each abnormality, it sets the latch to fix the output at the "L" level. To reset the actuated protection circuit, either the power supply turn off and on again or set the CTL terminal (pin 24) to the "L" level to lower the VREF terminal (pin 17) voltage to 2.4 V (Min) or less. 20 MB39A104 ■ I/O EQUIVALENT CIRCUIT 〈〈Reference voltage block〉〉 VCC 7 1.24 V ESD protection element 〈〈Control block〉〉 ESD protection element + − 77.8 kΩ 24.8 kΩ 〈〈Soft-start block〉〉 VREF (5.0 V) CTL 24 VCC 72 kΩ CSX 17 VREF 104 kΩ ESD protection element GND GND GND 18 〈〈Triangular wave oscillator block (RT) 〉〉 VCC 〈〈Short-circuit detection block〉〉 VREF (5.0 V) 〈〈Triangular wave oscillator (CT) block〉〉 (3.1 V) (3.1 V) 2 kΩ 1.35 V 8 CSCP + CT 13 − 12 RT GND GND GND 〈〈Overcurrent protection circuit block〉〉 〈〈Error amplifier block (CH1, CH2) 〉〉 VCC VREF (5.0 V) −INEX ILIMX CSX 1.24 V VSX FBX GND GND 〈〈PWM comparator block (CH1, CH2) 〉〉 〈〈Bias voltage block〉〉 VCC FBX VCCO VCC VCC VCCO GNDO 〈〈Output block (CH1, CH2) 〉〉 VCCO 1 O CT 2 VH DTCX VH GNDO 23 GND GND GNDO X : Each channel No. 21 22 VIN (7 V to 19 V) CH2 ON/OFF signal (Hiz : ON, L : OFF) B CH1 ON/OFF signal (Hiz : ON, L : OFF) A CS1 11 R8 10 CS2 14 R13 15 6 C21 1000 pF CSCP 8 C14 16 1000 pF FB2 19 DTC2 R15R16 DTC1 C12 9 1000 pF FB1 R10R11 RT H priority L priority + + Error Amp2 L priority + + Error Amp1 12 13 CT C1 100 pF H: UVLO release SCP Comp. + + OSC UVLO SCP Logic H: at SCP 1.24 V VREF 1.24 V VREF 3.1 V 5.0 V 17 accuracy ± 1% P-ch Drive2 CH2 VH Bias Voltage + VREF Power 18 GND CTL VR1 ON/OFF 1.24 V Error Amp Reference Error Amp Power Supply H: at OCP Current Protection Logic IO = 200 mA at VCCO = 12 V Current Protection Logic + Drive1 P-ch CH1 IO = 200 mA at VCCO = 12 V VREF bias 2.5 V 1.5 V PWM + Comp.2 + L priority PWM + Comp.1 + L priority ILIM1 VS1 OUT1 VCCO VH R5 + R4 + Q2 Q1 D2 L2 B Stepdown D1 L1 A H : ON (Power ON) L : OFF (Standby mode) VTH = 1.4 V VCC CTL 24 7 GNDO 23 2 20 ILIM2 VS2 21 OUT2 22 5 4 3 1 Stepdown + VO2 (3.3 V) + VO1 (5.0 V) MB39A104 ■ APPLICATION EXAMPLE MB39A104 ■ PARTS LIST COMPONENT ITEM SPECIFICATION VENDOR PARTS No. Q1, Q2 P-ch FET VDS = −30 V, ID = −6 A TOSHIBA TPC8102 D1, D2 Diode VF = 0.42 V (Max) , at IF = 3 A ROHM RB0530L-30 L1, L2 Inductor 15 µH 3.6 A, 50 mΩ SUMIDA CDRH104R-150 C1 C2, C6 C3, C7 C4, C8 C10, C11, C20 C12, C14, C21 C16, C17 Ceramics Condenser OS-CONTM Ceramics Condenser OS-CONTM Ceramics Condenser Ceramics Condenser Ceramics Condenser 100 pF 10 µF 10 µF 82 µF 0.1 µF 1000 pF 0.1 µF 50 V 20 V 25 V 6.3 V 50 V 50 V 50 V TDK SANYO TDK SANYO TDK TDK TDK C1608CH1H101J 20SVP10M C3225JF1E106Z 6SVP82M C1608JB1H104K C1608JB1H102K C1608JB1H104K R1 R4, R5 R8, R13 R9, R14 R10 R11 R15 R16 Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor 24 kΩ 2.7 kΩ 220 kΩ 68 kΩ 150 kΩ 56 kΩ 100 kΩ 13 kΩ 0.5 % 0.5 % 0.5 % 0.5 % 0.5 % 0.5 % 0.5 % 0.5 % ssm ssm ssm ssm ssm ssm ssm ssm RR0816P-243-D RR0816P-272-D RR0816P-224-D RR0816P-683-D RR0816P-154-D RR0816P-563-D RR0816P-104-D RR0816P-133-D Note : TOSHIBA ROHM SANYO TDK SUMIDA ssm : TOSHIBA Corporation : ROHM Co., Ltd : SANYO Electric Co., Ltd. : TDK Corporation : SUMIDA Electric Co., Ltd. : SUSUMU Co., Ltd. 23 MB39A104 ■ SELECTION OF COMPONENTS • P-ch MOS FET The P-ch MOSFET for switching use should be rated for at least 20% more than the maximum input voltage. To minimize continuity loss, use a FET with low RDS(ON) between the drain and source. For high input voltage and high frequency operation, on/off-cycle switching loss will be higher so that power dissipation must be considered. In this application, the Toshiba TPC8102 is used. Continuity loss, on/off switching loss, and total loss are determined by the following formulas. The selection must ensure that peak drain current does not exceed rated values, and also must be in accordance with overcurrent detection levels. Continuity loss : PC PC = ID 2 × RDS (ON) × Duty On-cycle switching loss : PS (ON) VD (Max) × ID × tr × fOSC PS (ON) = 6 Off-cycle switching loss : PS (OFF) VD (Max) × ID (Max) × tf × fOSC PS (OFF) = 6 Total loss : PT PT = PC + PS (ON) + PS (OFF) Example: Using the Toshiba TPC8102 CH1 Input voltage VIN (Max) = 19 V, output voltage VO = 5 V, drain current ID = 3 A, Oscillation frequency fOSC = 500 kHz, L = 15 µH, drain-source on resistance RDS (ON) =: 50 mΩ, tr = tf =: 100 ns. Drain current (Max) : ID (Max) VIN − VO ID (Max) = IO + ton 2L =3+ 19 − 5 2 × 15 × 10−6 × 1 × 0.263 500 × 103 × 1 × 0.263 500 × 103 =: 3.25 (A) Drain current (Min) : ID (Min) VIN − VO ID (Min) = IO − ton 2L =3− 19 − 5 2 × 15 × 10−6 =: 2.75 (A) 24 MB39A104 = ID 2 × RDS (ON) × Duty PC = 3 2 × 0.05 × 0.263 =: 0.118 W PS (ON) = = VD (Max) × ID × tr × fOSC 6 19 × 3 × 100 × 10−9 × 500 × 103 6 =: 0.475 W PS (OFF) = VD (Max) × ID (Max) × tf × fOSC 6 = 19 × 3.25 × 100 × 10−9 × 500 × 103 6 =: 0.515 W PT = PC + PS (ON) + PS (OFF) =: 0.118 + 0.475 + 0.515 =: 1.108 W The above power dissipation figures for the TPC8102 are satisfied with ample margin at 2.4 W (Ta = +25 °C) . CH2 Input voltage VIN (Max) = 19 V output voltage VO = 3.3 V, drain current ID = 3 A, Oscillation frequency fOSC = 500 kHz, L = 15 µH, drain-source on resistance RDS (ON) =: 50 mΩ, tr = tf =: 100 ns. Drain current (Max) : ID (Max) VIN − VO ID (Max) = IO + ton 2L =3+ 19 − 3.3 2 × 15 × 10−6 × 1 × 0.174 500 × 103 × 1 × 0.174 500 × 103 =: 3.18 (A) Drain current (Min) : ID (Min) VIN − VO ton ID (Min) = IO − 2L =3− 19 − 3.3 2 × 15 × 10−6 =: 2.82 (A) 25 MB39A104 PC = ID 2 × RDS (ON) × Duty = 3 2 × 0.05 × 0.174 =: 0.078 W PS (ON) = VD (Max) × ID × tr × fOSC 6 = 19 × 3 × 100 × 10−9 × 500 × 103 6 =: 0.475 W PS (OFF) = = VD (Max) × ID (Max) × tf × fOSC 6 19 × 3.18 × 100 × 10−9 × 500 × 103 6 =: 0.504 W PT = PC + PS (ON) + PS (OFF) =: 0.078 + 0.475 + 0.504 =: 1.057 W The above power dissipation figures for the TPC8102 are satisfied with ample margin at 2.4 W (Ta = +25 °C) . • Inductors In selecting inductors, it is of course essential not to apply more current than the rated capacity of the inductor, but also to note that the lower limit for ripple current is a critical point that if reached will cause discontinuous operation and a considerable drop in efficiency. This can be prevented by choosing a higher inductance value, which will enable continuous operation under light loads. Note that if the inductance value is too high, however, direct current resistance (DCR) is increased and this will also reduce efficiency. The inductance must be set at the point where efficiency is greatest. Note also that the DC superimposition characteristics become worse as the load current value approaches the rated current value of the inductor, so that the inductance value is reduced and ripple current increases, causing loss of efficiency. The selection of rated current value and inductance value will vary depending on where the point of peak efficiency lies with respect to load current. Inductance values are determined by the following formulas. The L value for all load current conditions is set so that the peak to peak value of the ripple current is 1/2 the load current or less. Inductance value : L 2 (VIN − VO) ton L ≥ IO 26 MB39A104 Example: CH1 L ≥ ≥ 2 (VIN − VO) ton IO 2 × (19 − 5) 1 × × 0.263 IO 500 × 103 ≥ 4.91 µH CH2 L ≥ ≥ 2 (VIN − VO) ton IO 2 × (19 − 3.3) 1 × × 0.174 IO 500 × 103 ≥ 3.64 µH Inductance values derived from the above formulas are values that provide sufficient margin for continuous operation at maximum load current, but at which continuous operation is not possible at light loads. It is therefore necessary to determine the load level at which continuous operation becomes possible. In this application, the Sumida CDRH104R-150 is used. At 15 µH, the load current value under continuous operating conditions is determined by the following formula. Load current value under continuous operating conditions : IO VO IO ≥ toff 2L Example: Using the CDRH104R-150 15 µH (allowable tolerance ±30%) , rated current = 3.6 A CH1 IO ≥ ≥ VO 2L toff 5 2 × 15 × 10−6 × 1 × (1 − 0.263) 500 × 103 × 1 × (1 − 0.174) 500 × 103 ≥ 245.7 mA CH2 IO ≥ ≥ VO 2L toff 3.3 2 × 15 × 10−6 ≥ 181.7 mA 27 MB39A104 To determine whether the current through the inductor is within rated values, it is necessary to determine the peak value of the ripple current as well as the peak-to-peak values of the ripple current that affect the output ripple voltage. The peak value and peak-to-peak value of the ripple current can be determined by the following formulas. Peak value : IL VIN − VO IL ≥ IO + 2L ton Peak-to-peak value : ∆IL VIN − VO ∆IL = ton L Example: Using the CDRH104R-150 15 µH (allowable tolerance ±30%) , rated current = 3.6 A Peak value: CH1 IL VIN − VO 2L ≥ IO + ≥3+ ton 19 − 5 1 × 0.263 × 2 × 15 × 10−6 500 × 103 ≥ 3.25 A CH2 IL VIN − VO 2L ≥ IO + ≥3+ ton 19 − 3.3 2 × 15 × 10−6 × 1 × 0.174 500 × 103 ≥ 3.18 A Peak-to-peak value: CH1 ∆IL = = VIN − VO L ton 19 − 5 1 × × 0.263 15 × 10−6 500 × 103 = 0.491 A CH2 ∆IL = = VIN − VO L 19 − 3.3 1 × × 0.174 15 × 10−6 500 × 103 = 0.364 A 28 ton MB39A104 • Flyback diode The flyback diode is generally used as a Shottky barrier diode (SBD) when the reverse voltage to the diode is less than 40V. The SBD has the characteristics of higher speed in terms of faster reverse recovery time, and lower forward voltage, and is ideal for achieving high efficiency. As long as the DC reverse voltage is sufficiently higher than the input voltage, the average current flowing through the diode is within the average output current level, and peak current is within peak surge current limits, there is no problem. In this application the Rohm RB053L-30 is used. The diode average current and diode peak current can be calculated by the following formulas. Diode mean current : IDi VO ) IDi ≥ IO × (1 − VIN Diode peak current : IDip VO IDip ≥ (IO + toff) 2L Example: Using the Rohm RB053L-30 VR (DC reverse voltage) = 30 V, average output voltage = 3.0 A, peak surge current = 70 A, VF (forward voltage) = 0.42 V, IF = 3.0 A CH1 IDi ≥ IO × (1 − VO ) VIN ≥ 3 × (1 − 0.263) ≥ 2.21 A CH2 IDi ≥ IO × (1 − VO ) VIN ≥ 3 × (1 − 0.174) ≥ 2.48 A CH1 IDip ≥ (IO + VO toff) 2L ≥ 3.24 A CH2 IDip ≥ (IO + VO toff) 2L ≥ 3.18 A 29 MB39A104 • Smoothing Capacitor The smoothing capacitor is an indispensable element for reducing ripple voltage in output. In selecting a smoothing capacitor it is essential to consider equivalent series resistance (ESR) and allowable ripple current. Higher ESR means higher ripple voltage, so that to reduce ripple voltage it is necessary to select a capacitor with low ESR. However, the use of a capacitor with low ESR can have substantial effects on loop phase characteristics, and therefore requires attention to system stability. Care should also be taken to use a capacity with sufficient margin for allowable ripple current. This application uses the (OS-CON TM) 6SVP82M made by SANYO. The ESR, capacitance value, and ripple current can be calculated from the following formulas. Equivalent Series Resistance : ESR 1 ∆VO − ESR ≤ ∆IL 2πfCL Capacitance value : CL ∆IL CL ≥ 2πf (∆VO − ∆IL × ESR) Ripple current : ICLrms (VIN − VO) ton ICLrms ≥ 2√3L Example: Using the 6SVP82M Rated voltage = 6.3 V, ESR = 50 mΩ, maximum allowable ripple current = 1570 mArms Equivalent series resistance CH1 ESR ≤ ≤ ∆VO ∆IL − 0.050 0.491 ≤ 98.0 mΩ 30 − 1 2πfCL 1 2π × 500 × 103 × 82 × 10−6 MB39A104 CH2 ∆VO ∆IL ESR ≤ − 0.033 0.364 ≤ 1 2πfCL − 1 2π × 500 × 103 × 82 × 10−6 ≤ 86.8 mΩ Capacitance value CH1 CL ≥ ≥ ∆IL 2πf (∆VO − ∆IL × ESR) 0.491 2π × 500 × 103 × (0.050 − 0.491 × 0.05) ≥ 6.14 µF CH2 CL ≥ ≥ ∆IL 2πf (∆VO − ∆IL × ESR) 0.364 2π × 500 × 103 × (0.033 − 0.364 × 0.05) ≥ 7.83 µF Ripple current CH1 ICLrms ≥ ≥ (VIN − VO) ton 2√3L (19 − 5) × 0.263 2√3 × 15 × 10−6 × 500 × 103 ≥ 141.7 mArms CH2 ICLrms ≥ ≥ (VIN − VO) ton 2√3L (19 − 3.3) × 0.174 2√3 × 15 × 10−6 × 500 × 103 ≥ 105.1 mArms 31 MB39A104 ■ REFERENCE DATA Conversion Efficiency vs. Load Current (CH1) 100 Conversion efficiency η (%) 90 80 70 VIN = 7 V VIN = 10 V VIN = 12 V VIN = 19 V 60 Ta = +25 °C 5 V Output SW1 = OFF SW2 = ON 50 40 30 10 m 100 m 1 10 Load current IL (A) Conversion Efficiency vs. Load Current (CH2) Conversion efficiency η (%) 100 90 80 70 VIN = 7 V VIN = 10 V VIN = 12 V VIN = 19 V 60 Ta = +25 °C 3.3 V Output SW1 = ON SW2 = OFF 50 40 30 10 m 100 m 1 10 Load current IL (A) (Continued) 32 MB39A104 (Continued) Switching Wave Form (CH1) VG (V) Ta = +25 °C VIN = 12 V CTL = 5 V VO = 5 V RL = 1.67 Ω 15 10 5 VS (V) 0 15 10 5 0 0 1 2 3 4 5 6 7 8 9 10 t (µs) Switching Wave Form (CH2) VG (V) Ta = +25 °C VIN = 12 V CTL = 5 V VO = 3.3 V RL = 1.1 Ω 15 10 5 VS (V) 0 15 10 5 0 0 1 2 3 4 5 6 7 8 9 10 t (µs) 33 MB39A104 ■ USAGE PRECAUTIONS • Printed circuit board ground lines should be set up with consideration for common impedance. • Take appropriate static electricity measures. • Containers for semiconductor materials should have anti-static protection or be made of conductive material. • After mounting, printed circuit boards should be stored and shipped in conductive bags or containers. • Work platforms, tools, and instruments should be properly grounded. • Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ between body and ground. • Do not apply negative voltages. • The use of negative voltages below −0.3 V may create parasitic transistors on LSI lines, which can cause malfunction. ■ ORDERING INFORMATION Part number MB39A104PFV-❏❏❏E1 Package Remarks 24-pin plastic SSOP (FPT-24P-M03) Lead Free version ■ EV BOARD ORDERING INFORMATION EV board part No. MB39A104EVB EV board version No. Remarks Board Rev. 1.0 SSOP-24P ■ RoHS COMPLIANCE INFORMATION OF LEAD (Pb) FREE VERSION The LSI products of Fujitsu with “E1” are compliant with RoHS Directive , and has observed the standard of lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB) , and polybrominated diphenyl ethers (PBDE) . The product that conforms to this standard is added “E1” at the end of the part number. ■ MARKING FORMAT (Lead Free version) 3 9A1 04 XXXX XXX E1 INDEX 34 Lead Free version MB39A104 ■ LABELING SAMPLE (LEAD FREE VERSION) lead-free mark JEITA logo MB123456P - 789 - GE1 (3N) 1MB123456P-789-GE1 1000 (3N)2 1561190005 107210 JEDEC logo G Pb QC PASS PCS 1,000 MB123456P - 789 - GE1 2006/03/01 ASSEMBLED IN JAPAN MB123456P - 789 - GE1 1/1 0605 - Z01A 1000 1561190005 Lead Free version 35 MB39A104 ■ MB39A104PFV-❏❏❏E1 RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY LEVEL Item Condition Mounting Method IR (infrared reflow) , Manual soldering (partial heating method) Mounting times 2 times Storage period Before opening Please use it within two years after Manufacture. From opening to the 2nd reflow Less than 8 days When the storage period after opening was exceeded Please processes within 8 days after baking (125 °C, 24H) 5 °C to 30 °C, 70%RH or less (the lowest possible humidity) Storage conditions [Temperature Profile for FJ Standard IR Reflow] (1) IR (infrared reflow) H rank : 260 °C Max 260 °C 255 °C 170 °C to 190 °C (b) RT (a) (a) Temperature Increase gradient (b) Preliminary heating (c) Temperature Increase gradient (d) Actual heating (d’) (e) Cooling (2) Manual soldering (partial heating method) 36 (d) (e) (d') : Average 1 °C/s to 4 °C/s : Temperature 170 °C to 190 °C, 60 s to 180 s : Average 1 °C/s to 4 °C/s : Temperature 260 °C Max; 255 °C or more, 10 s or less : Temperature 230 °C or more, 40 s or less or Temperature 225 °C or more, 60 s or less or Temperature 220 °C or more, 80 s or less : Natural cooling or forced cooling Note : Temperature : the top of the package body Conditions : Temperature 400 °C Max Times : 5 s max/pin (c) MB39A104 ■ PACKAGE DIMENSION 24-pin plastic SSOP (FPT-24P-M03) 24-pin plastic SSOP (FPT-24P-M03) Lead pitch 0.65 mm Package width × package length 5.6 × 7.75 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.45 mm MAX Weight 0.12 g Code (Reference) P-SSOP24-5.6×7.75-0.65 Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max). Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. 0.17±0.03 (.007±.001) *17.75±0.10(.305±.004) 24 13 *2 5.60±0.10 7.60±0.20 (.220±.004) (.299±.008) INDEX Details of "A" part +0.20 1.25 –0.10 +.008 .049 –.004 (Mounting height) 0.25(.010) 1 "A" 12 0.65(.026) 0.24 .009 +0.08 –0.07 +.003 –.003 0.13(.005) 0~8˚ M 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.10±0.10 (.004±.004) (Stand off) 0.10(.004) C 2003 FUJITSU LIMITED F24018S-c-4-5 Dimensions in mm (inches). Note: The values in parentheses are reference values. 37 MB39A104 FUJITSU LIMITED All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. 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Please note that Fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. Edited Business Promotion Dept. F0608