MICREL MIC4451CT

MIC4451/4452
Micrel, Inc.
MIC4451/4452
12A-Peak Low-Side MOSFET Driver
Bipolar/CMOS/DMOS Process
General Description
Features
MIC4451 and MIC4452 CMOS MOSFET drivers are tough,
efficient, and easy to use. The MIC4451 is an inverting driver,
while the MIC4452 is a non-inverting driver.
• BiCMOS/DMOS Construction
• Latch-Up Proof: Fully Isolated Process is Inherently
Immune to Any Latch-up.
• Input Will Withstand Negative Swing of Up to 5V
• Matched Rise and Fall Times ............................... 25ns
• High Peak Output Current .............................12A Peak
• Wide Operating Range .............................. 4.5V to 18V
• High Capacitive Load Drive ........................... 62,000pF
• Low Delay Time .............................................30ns Typ.
• Logic High Input for Any Voltage from 2.4V to VS
• Low Supply Current .............. 450µA With Logic 1 Input
• Low Output Impedance .........................................1.0Ω
• Output Voltage Swing to Within 25mV of GND or VS
• Low Equivalent Input Capacitance (typ) ................. 7pF
Both versions are capable of 12A (peak) output and can drive
the largest MOSFETs with an improved safe operating margin. The MIC4451/4452 accepts any logic input from 2.4V to
VS without external speed-up capacitors or resistor networks.
Proprietary circuits allow the input to swing negative by as
much as 5V without damaging the part. Additional circuits
protect against damage from electrostatic discharge.
MIC4451/4452 drivers can replace three or more discrete
components, reducing PCB area requirements, simplifying
product design, and reducing assembly cost.
Applications
Modern Bipolar/CMOS/DMOS construction guarantees
freedom from latch-up. The rail-to-rail swing capability of
CMOS/DMOS insures adequate gate voltage to the MOSFET during power up/down sequencing. Since these devices
are fabricated on a self-aligned process, they have very low
crossover current, run cool, use little power, and are easy
to drive.
•
•
•
•
•
•
•
•
Switch Mode Power Supplies
Motor Controls
Pulse Transformer Driver
Class-D Switching Amplifiers
Line Drivers
Driving MOSFET or IGBT Parallel Chip Modules
Local Power ON/OFF Switch
Pulse Generators
Functional Diagram
VS
0.1mA
0.3mA
MIC4451
INVERTING
OUT
IN
2kΩ
MIC4452
NONINVERTING
GND
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
July 2005
1
MIC4451/4452
MIC4451/4452
Micrel, Inc.
Ordering Information
Part Number
Temperature
Range
Package
Configuration
MIC4451YN
–40ºC to +85ºC
8-pin Plastic DIP
Inverting
MIC4451BM
MIC4451YM
–40ºC to +85ºC
8-pin SOIC
Inverting
MIC4451CT
MIC4451ZT
0ºC to +70ºC
5-pin TO-220
Inverting
MIC4452BN
MIC4452YN
–40ºC to +85ºC
8-pin Plastic DIP
Non-Inverting
MIC4452BM
MIC4452YM
–40ºC to +85ºC
8-pin SOIC
Non-Inverting
MIC4452CT
MIC4452ZT
0ºC to +70ºC
5-pin TO-220
Non-Inverting
Standard
Pb-Free
MIC4451BN
Pin Configurations
8 VS
VS 1
IN 2
7 OUT
NC 3
6 OUT
GND 4
5 GND
Plastic DIP (N)
SOIC (M)
5
4
3
2
1
OUT
GND
VS
GND
IN
TO-220-5 (T)
Pin Description
Pin Number
TO-220-5
Pin Number
DIP, SOIC
Pin Name
1
2
IN
2, 4
4, 5
GND
3, TAB
1, 8
VS
5
6, 7
OUT
3
NC
MIC4451/4452
Pin Function
Control Input
Ground: Duplicate pins must be externally connected together.
Supply Input: Duplicate pins must be externally connected together.
Output: Duplicate pins must be externally connected together.
Not connected.
2
July 2005
MIC4451/4452
Absolute Maximum Ratings
Micrel, Inc.
Operating Ratings
(Notes 1, 2 and 3)
Supply Voltage .............................................................. 20V
Input Voltage ...................................VS + 0.3V to GND – 5V
Input Current (VIN > VS) .............................................. 50 mA
Power Dissipation, TAMBIENT ≤ 25°C
PDIP .................................................................... 960mW
SOIC .................................................................. 1040mW
5-Pin TO-220 .............................................................. 2W
Power Dissipation, TCASE ≤ 25°C
5-Pin TO-220 ......................................................... 12.5W
Derating Factors (to Ambient)
PDIP ................................................................ 7.7mW/°C
SOIC ............................................................... 8.3 mW/°C
5-Pin TO-220 .................................................... 17mW/°C
Storage Temperature ................................ –65°C to +150°C
Lead Temperature (10 sec) ....................................... 300°C
Operating Temperature (Chip) ................................... 150°C
Operating Temperature (Ambient)
C Version .................................................... 0°C to +70°C
B Version ................................................ –40°C to +85°C
Thermal Impedances (To Case)
5-Pin TO-220 (θJC) ............................................... 10°C/W
Electrical Characteristics(Note 4):
(TA = 25°C with 4.5 V ≤ VS ≤ 18 V unless otherwise specified.)
Symbol
Parameter
Conditions
Min
Typ
2.4
1.3
Max
Units
INPUT
VIH
Logic 1 Input Voltage
VIL
Logic 0 Input Voltage
1.1
V
0.8
V
VIN
Input Voltage Range
–5
VS+.3
V
IIN
Input Current
0 V ≤ VIN ≤ VS
–10
10
µA
High Output Voltage
See Figure 1
VS–.025
VOL
Low Output Voltage
See Figure 1
.025
V
RO
Output Resistance,
Output High
IOUT = 10 mA, VS = 18V
0.6
1.5
Ω
RO
Output Resistance,
Output Low
IOUT = 10 mA, VS = 18V
0.8
1.5
Ω
IPK
Peak Output Current
VS = 18 V (See Figure 6)
IDC
Continuous Output Current
IR
Latch-Up Protection
Withstand Reverse Current
OUTPUT
VOH
Duty Cycle ≤ 2%
t ≤ 300 µs
V
12
A
2
A
>1500
mA
SWITCHING TIME (Note 3)
tR
Rise Time
Test Figure 1, CL = 15,000 pF
20
40
ns
tF
Fall Time
Test Figure 1, CL = 15,000 pF
24
50
ns
tD1
Delay Time
Test Figure 1
15
30
ns
tD2
Delay Time
Test Figure 1
35
60
ns
VIN = 3 V
VIN = 0 V
0.4
80
1.5
150
mA
µA
18
V
Power Supply
IS
Power Supply Current
VS
Operating Input Voltage
July 2005
4.5
3
MIC4451/4452
MIC4451/4452
Micrel, Inc.
Electrical Characteristics:
(Over operating temperature range with 4.5V < VS < 18V unless otherwise specified.)
Symbol
Parameter
Conditions
Min
Typ
2.4
1.4
Max
Units
INPUT
VIH
Logic 1 Input Voltage
VIL
Logic 0 Input Voltage
1.0
V
0.8
V
VIN
Input Voltage Range
IIN
Input Current
0V ≤ VIN ≤ VS
–5
VS+.3
V
–10
10
µA
High Output Voltage
Figure 1
VOL
Low Output Voltage
Figure 1
0.025
V
RO
Output Resistance,
Output High
IOUT = 10mA, VS = 18V
0.8
2.2
Ω
RO
Output Resistance,
Output Low
IOUT = 10mA, VS = 18V
1.3
2.2
Ω
23
50
ns
OUTPUT
VOH
VS–.025
V
SWITCHING TIME (Note 3)
tR
Rise Time
Figure 1, CL = 15,000pF
tF
Fall Time
Figure 1, CL = 15,000pF
30
60
ns
tD1
Delay Time
Figure 1
20
40
ns
tD2
Delay Time
Figure 1
40
80
ns
VIN = 3V
VIN = 0V
0.6
0.1
3
0.4
mA
18
V
POWER SUPPLY
IS
Power Supply Current
VS
Operating Input Voltage
NOTE 1:
NOTE 2:
NOTE 3:
NOTE 4:
4.5
Functional operation above the absolute maximum stress ratings is not implied.
Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to
prevent damage from static discharge.
Switching times guaranteed by design.
Specification for packaged product only.
Test Circuits
VS = 18V
VS = 18V
0.1µF
0.1µF
IN
OUT
15000pF
MIC4451
INPUT
5V
90%
tD1
tP W
tF
tD2
INPUT
tR
0.1µF
IN
OUT
15000pF
5V
90%
1.0µF
2.5V
tP W ≥ 0.5µs
10%
0V
VS
90%
tD1
tP W
tR
tD2
tF
O U TPU T
O U TPU T
10%
0V
10%
0V
Figure 2. Noninverting Driver Switching Time
Figure 1. Inverting Driver Switching Time
MIC4451/4452
0.1µF
MIC4452
2.5V
tP W ≥ 0.5µs
10%
0V
VS
90%
1.0µF
4
July 2005
MIC4451/4452
Micrel, Inc.
Typical Characteristic Curves
60
40
20
0
July 2005
10k
100k
1M
FREQUENCY (Hz)
10M
T IM E (n s )
Supply Current
vs. Frequency
V S = 12V
80
60
40
20
0
10k
100k
1M
FREQUENCY (Hz)
5
10M
18
Supply Current
vs. Capacitive Load
V S = 5V
45
100
kH
50
Hz
z
1M
15
z
30
60
100
16
60
0
100k
8
10 12 14
VOLTAGE (V)
H
z
kH
50
z
H
0k
1000
10k
CAPACITIVE LOAD (pF)
6
1000
10k
CAPACITIVE LOAD (pF)
100k
Supply Current
vs. Frequency
V S = 5V
50
40
30
pF
pF
1000
80
0 .0 1
F
100
µF
140
100
z
MH
4
1000
120
V S = 18V
1
30
0
100k
Supply Current
vs. Frequency
120
90
10 -8
75
V S = 12V
120
PER TRANSITION
10 -9
Supply Current
vs. Capacitive Load
60
120
Crossover Energy
vs. Supply Voltage
10 -7
100k
pF
1000
10k
CAPACITIVE LOAD (pF)
1000
10k
CAPACITIVE LOAD (pF)
20
20
0k
50
H
z
kH
z
z
100
µF
160
150
V S = 18V
100
18V
1000
180
0
100k
Supply Current
vs. Capacitive Load
H
1M
10V
0 .0 1
20
0
1000
10k
CAPACITIVE LOAD (pF)
0 .1 µ
S U P P L Y C U R R E N T (m A )
220
200
180
160
140
120
100
80
60
40
100
150
50
80
0k
18V
5V
100
40
20
100
0
µF
10V
-40
TEMPERATURE ( °C)
Fall Time
vs. Capacitive Load
200
tRISE
0
18
S U P P L Y C U R R E N T (m A )
150
50
6
8
10 12 14 16
SUPPLY VOLTAGE (V)
F
R IS E T IM E (n s )
5V
20
10
250
200
0
300
4
30
0 .0 1
Rise Time
vs. Capacitive Load
250
S U P P L Y C U R R E N T (m A )
18
10,000pF
tFALL
40
F
6
8
10 12 14 16
SUPPLY VOLTAGE (V)
22,000pF
0 .1 µ
4
47,000pF
0 .1 µ
10,000pF
CL = 10,000pF
V S = 18V
50
160
140
120
100
80
60
40
20
0
Rise and FallTimes
vs. Temperature
60
C R O S S O V E R E N E R G Y (A •s )
22,000pF
F A L L T IM E (n s )
300
47,000pF
S U P P L Y C U R R E N T (m A )
40
20
0
F A L L T IM E (n s )
160
140
120
100
80
60
220
200
180
S U P P L Y C U R R E N T (m A )
R IS E T IM E (n s )
220
200
180
Fall Time
vs. Supply Voltage
S U P P L Y C U R R E N T (m A )
Rise Time
vs. Supply Voltage
20
10
0
10k
100k
1M
FREQUENCY (Hz)
10M
MIC4451/4452
MIC4451/4452
Micrel, Inc.
Typical Characteristic Curves (Cont.)
20
t D1
10
Q U IE S C E N T S U P P L Y C U R R E N T (µ A )
0
4
6
8
10 12 14 16
SUPPLY VOLTAGE (V)
18
Quiescent Supply Current
vs. Temperature
1000
V S = 18V
INPUT = 1
100
INPUT = 0
10
-40
0
40
80
TEMPERATURE ( °C)
MIC4451/4452
120
50
Propagation Delay
vs. Temperature
V S = 10V
40
T IM E (n s )
t D2
30
T IM E (n s )
T IM E (n s )
40
120
110
100
90
80
70
60
50
40
30
20
10
0
Propagation Delay
vs. Input Amplitude
30
t D2
20
tD2
t D1
10
0
2
4
6
INPUT (V)
tD1
8
0
10
High-State Output Resist.
vs. Supply Voltage
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
T J = 150 °C
T J = 25 °C
4
6
8
10 12 14 16
SUPPLY VOLTAGE (V)
6
18
L O W -S T A T E O U T P U T R E S IS T A N C E (Ω)
50
H IG H -S T A T E O U T P U T R E S IS T A N C E (Ω)
Propagation Delay
vs. Supply Voltage
-40
0
40
80
TEMPERATURE ( °C)
120
Low-State Output Resist.
vs. Supply Voltage
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
T J = 150 °C
T J = 25 °C
4
6
8
10 12 14 16
SUPPLY VOLTAGE (V)
18
July 2005
MIC4451/4452
Micrel, Inc.
Applications Information
To guarantee low supply impedance over a wide frequency
range, a parallel capacitor combination is recommended for
supply bypassing. Low inductance ceramic disk capacitors
with short lead lengths (< 0.5 inch) should be used. A 1µF
low ESR film capacitor in parallel with two 0.1µF low ESR
ceramic capacitors, (such as AVX RAM GUARD®), provides
adequate bypassing. Connect one ceramic capacitor directly
between pins 1 and 4. Connect the second ceramic capacitor
directly between pins 8 and 5.
Supply Bypassing
Charging and discharging large capacitive loads quickly
requires large currents. For example, changing a 10,000pF
load to 18V in 50ns requires 3.6A.
The MIC4451/4452 has double bonding on the supply pins,
the ground pins and output pins. This reduces parasitic lead
inductance. Low inductance enables large currents to be
switched rapidly. It also reduces internal ringing that can
cause voltage breakdown when the driver is operated at or
near the maximum rated voltage.
Grounding
The high current capability of the MIC4451/4452 demands
careful PC board layout for best performance. Since the
MIC4451 is an inverting driver, any ground lead impedance
will appear as negative feedback which can degrade switching speed. Feedback is especially noticeable with slow-rise
time inputs. The MIC4451 input structure includes 200mV
of hysteresis to ensure clean transitions and freedom from
oscillation, but attention to layout is still recommended.
Internal ringing can also cause output oscillation due to
feedback. This feedback is added to the input signal since it
is referenced to the same ground.
Figure 5 shows the feedback effect in detail. As the MIC4451
input begins to go positive, the output goes negative and
several amperes of current flow in the ground lead. As little
as 0.05Ω of PC trace resistance can produce hundreds of
millivolts at the MIC4451 ground pins. If the driving logic is
referenced to power ground, the effective logic input level is
reduced and oscillation may result.
V DD
1µF
V DD
MIC4451
φ
2
φ1 D R I V E S I G N A L
DRIVE
LOGIC
CONDUCTION ANGLE
CONTROL 0° TO 180°
CONDUCTION ANGLE
CONTROL 1 8 0 ° TO 3 6 0 °
φ
1
M
To insure optimum performance, separate ground traces
should be provided for the logic and power connections. Connecting the logic ground directly to the MIC4451 GND pins
will ensure full logic drive to the input and ensure fast output
switching. Both of the MIC4451 GND pins should, however,
still be connected to power ground.
φ
3
V DD
V DD
1µF
MIC4452
PHASE 1 OF 3 PHASE MOTOR
D R I VER U SI N G M I C 4 4 5 1 / 4 4 5 2
Figure 3. Direct Motor Drive
+15
(x2) 1N4448
5.6 kΩ
OUTPUT VOLTAGE vs LOAD CURRENT
560 Ω
30
0.1µF
50V
1
2
0.1µF
WIMA
MKS2
8
MIC4451
4
5
1µF
50V
MKS2
6, 7
VOLTS
29
+
BYV 10 (x 2)
+
28
12 Ω LINE
27
26
+
560µF 50V
100µF 50V
UNIT E D CHE MCON S X E
25
0
50 100 150 200 250 300 350
mA
Figure 4. Self Contained Voltage Doubler
July 2005
7
MIC4451/4452
MIC4451/4452
Micrel, Inc.
Input Stage
The supply current vs. frequency and supply current vs capacitive load characteristic curves aid in determining power
dissipation calculations. Table 1 lists the maximum safe
operating frequency for several power supply voltages when
driving a 10,000pF load. More accurate power dissipation
figures can be obtained by summing the three dissipation
sources.
The input voltage level of the MIC4451 changes the quiescent
supply current. The N channel MOSFET input stage transistor
drives a 320µA current source load. With a logic “1” input, the
maximum quiescent supply current is 400µA. Logic “0” input
level signals reduce quiescent current to 80µA typical.
The MIC4451/4452 input is designed to provide 200mV of
hysteresis. This provides clean transitions, reduces noise
sensitivity, and minimizes output stage current spiking when
changing states. Input voltage threshold level is approximately
1.5V, making the device TTL compatible over the full temperature and operating supply voltage ranges. Input current
is less than ±10µA.
Given the power dissipation in the device, and the thermal
resistance of the package, junction operating temperature
for any ambient is easy to calculate. For example, the thermal resistance of the 8-pin plastic DIP package, from the
data sheet, is 130°C/W. In a 25°C ambient, then, using a
maximum junction temperature of 125°C, this package will
dissipate 960mW.
The MIC4451 can be directly driven by the TL494,
SG1526/1527, SG1524, TSC170, MIC38C42, and similar
switch mode power supply integrated circuits. By offloading
the power-driving duties to the MIC4451/4452, the power
supply controller can operate at lower dissipation. This can
improve performance and reliability.
Accurate power dissipation numbers can be obtained by summing the three sources of power dissipation in the device:
• Load Power Dissipation (PL)
• Quiescent power dissipation (PQ)
• Transition power dissipation (PT)
The input can be greater than the VS supply, however, current
will flow into the input lead. The input currents can be as high
as 30mA p-p (6.4mARMS) with the input. No damage will occur
to MIC4451/4452 however, and it will not latch.
Calculation of load power dissipation differs depending on
whether the load is capacitive, resistive or inductive.
Resistive Load Power Dissipation
Dissipation caused by a resistive load can be calculated
as:
The input appears as a 7pF capacitance and does not
change even if the input is driven from an AC source. While
the device will operate and no damage will occur up to 25V
below the negative rail, input current will increase up to
1mA/V due to the clamping action of the input, ESD diode,
and 1kΩ resistor.
PL = I2 RO D
where:
I=
RO =
Power Dissipation
CMOS circuits usually permit the user to ignore power dissipation. Logic families such as 4000 and 74C have outputs
which can only supply a few milliamperes of current, and even
shorting outputs to ground will not force enough current to
destroy the device. The MIC4451/4452 on the other hand,
can source or sink several amperes and drive large capacitive
loads at high frequency. The package power dissipation limit
can easily be exceeded. Therefore, some attention should
be given to power dissipation when driving low impedance
loads and/or operating at high frequency.
D=
the current drawn by the load
the output resistance of the driver when the output
is high, at the power supply voltage used. (See data
sheet)
fraction of time the load is conducting (duty cycle)
Capacitive Load Power Dissipation
Dissipation caused by a capacitive load is simply the energy
placed in, or removed from, the load capacitance by the
driver. The energy stored in a capacitor is described by the
equation:
E = 1/2 C V2
+18
WIMA
MKS-2
1 µF
5.0V
1
8
MIC4451
0V
0.1µF
LOGIC
GROUND
POWER
GROUND
4
6, 7
5
TEK CURRENT
PROBE 6302
0.1µF
Table 1: MIC4451 Maximum
Operating Frequency
VS
Max Frequency
18V
220kHz
15V
300kHz
10V
640kHz
5V
2MHz
18 V
0V
2,500 pF
POLYCARBONATE
12 AMPS
300 mV
PC TRACE RESISTANCE = 0.05Ω
Conditions:
1. θJA = 150°C/W
2. TA = 25°C
3. CL = 10,000pF
Figure 5. Switching Time Degradation Due to
Negative Feedback
MIC4451/4452
8
July 2005
MIC4451/4452
Micrel, Inc.
Transition Power Dissipation
As this energy is lost in the driver each time the load is charged
or discharged, for power dissipation calculations the 1/2 is
removed. This equation also shows that it is good practice
not to place more voltage on the capacitor than is necessary,
as dissipation increases as the square of the voltage applied
to the capacitor. For a driver with a capacitive load:
Transition power is dissipated in the driver each time its
output changes state, because during the transition, for a
very brief interval, both the N- and P-channel MOSFETs in
the output totem-pole are ON simultaneously, and a current
is conducted through them from VS to ground. The transition
power dissipation is approximately:
PL = f C (VS)2
where:
PT = 2 f VS (A•s)
f = Operating Frequency
C = Load Capacitance
VS =Driver Supply Voltage
where (A•s) is a time-current factor derived from the typical
characteristic curve “Crossover Energy vs. Supply Voltage.”
Inductive Load Power Dissipation
Total power (PD) then, as previously described is:
PD = PL + PQ + PT
For inductive loads the situation is more complicated. For
the part of the cycle in which the driver is actively forcing
current into the inductor, the situation is the same as it is in
the resistive case:
Definitions
CL = Load Capacitance in Farads.
PL1 = I RO D
2
D = Duty Cycle expressed as the fraction of time the
input to the driver is high.
However, in this instance the RO required may be either
the on resistance of the driver when its output is in the high
state, or its on resistance when the driver is in the low state,
depending on how the inductor is connected, and this is still
only half the story. For the part of the cycle when the inductor is forcing current through the driver, dissipation is best
described as
f = Operating Frequency of the driver in Hertz
IH = Power supply current drawn by a driver when both
inputs are high and neither output is loaded.
IL = Power supply current drawn by a driver when both
inputs are low and neither output is loaded.
PL2 = I VD (1 – D)
ID = Output current from a driver in Amps.
where VD is the forward drop of the clamp diode in the driver
(generally around 0.7V). The two parts of the load dissipation
must be summed in to produce PL
PD = Total power dissipated in a driver in Watts.
PL = Power dissipated in the driver due to the driver’s
load in Watts.
PL = PL1 + PL2
Quiescent Power Dissipation
PQ = Power dissipated in a quiescent driver in Watts.
Quiescent power dissipation (PQ, as described in the input
section) depends on whether the input is high or low. A low
input will result in a maximum current drain (per driver) of
≤ 0.2mA; a logic high will result in a current drain of ≤ 3.0mA.
Quiescent power can therefore be found from:
PT = Power dissipated in a driver when the output
changes states (“shoot-through current”) in Watts.
NOTE: The “shoot-through” current from a dual
transition (once up, once down) for both drivers is
stated in Figure 7 in ampere-nanoseconds. This
figure must be multiplied by the number of repetitions per second (frequency) to find Watts.
PQ = VS [D IH + (1 – D) IL]
RO = Output resistance of a driver in Ohms.
where:
IH =
IL =
D=
VS =
July 2005
VS = Power supply voltage to the IC in Volts.
quiescent current with input high
quiescent current with input low
fraction of time input is high (duty cycle)
power supply voltage
9
MIC4451/4452
MIC4451/4452
Micrel, Inc.
+18 V
WIMA
MK22
1 µF
5.0V
1
2
0V
0.1µF
8
MIC4452
4
6, 7
5
TEK CURRENT
PROBE 6302
0.1µF
18 V
0V
15,000 pF
POLYCARBONATE
Figure 6. Peak Output Current Test Circuit
MIC4451/4452
10
July 2005
MIC4451/4452
Micrel, Inc.
Package Information
PIN 1
DIMENSIONS:
INCH (MM)
0.380 (9.65)
0.370 (9.40)
0.255 (6.48)
0.245 (6.22)
0.135 (3.43)
0.125 (3.18)
0.300 (7.62)
0.013 (0.330)
0.010 (0.254)
0.018 (0.57)
0.130 (3.30)
0.100 (2.54)
0.0375 (0.952)
0.380 (9.65)
0.320 (8.13)
8-Pin Plastic DIP (N)
0.026 (0.65)
MAX)
PIN 1
0.157 (3.99)
0.150 (3.81)
DIMENSIONS:
INCHES (MM)
0.050 (1.27)
TYP
0.064 (1.63)
0.045 (1.14)
0.197 (5.0)
0.189 (4.8)
0.020 (0.51)
0.013 (0.33)
0.0098 (0.249)
0.0040 (0.102)
0°–8°
SEATING
PLANE
45°
0.010 (0.25)
0.007 (0.18)
0.050 (1.27)
0.016 (0.40)
0.244 (6.20)
0.228 (5.79)
8-Pin SOIC (M)
July 2005
11
MIC4451/4452
MIC4451/4452
Micrel, Inc.
0.150 D ±0.005
(3.81 D ±0.13)
0.177 ±0.008
(4.50 ±0.20)
0.400 ±0.015
(10.16 ±0.38)
0.050 ±0.005
(1.27 ±0.13)
0.108 ±0.005
(2.74 ±0.13)
0.241 ±0.017
(6.12 ±0.43)
0.578 ±0.018
(14.68 ±0.46)
SEATING
PLANE
7°
Typ.
0.550 ±0.010
(13.97 ±0.25)
0.067 ±0.005
(1.70 ±0.127)
0.032 ±0.005
(0.81 ±0.13)
0.268 REF
(6.81 REF)
0.018 ±0.008
(0.46 ±0.20)
0.103 ±0.013
(2.62 ±0.33)
Dimensions: inch
(mm)
5-Pin TO-220 (T)
MICREL INC.
TEL
2180 FORTUNE DRIVE
+ 1 (408) 944-0800
FAX
SAN JOSE, CA 95131
+ 1 (408) 474-1000
WEB
USA
http://www.micrel.com
This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's
use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 1998 Micrel, Inc.
MIC4451/4452
12
July 2005