www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 FEATURES D 100-mA Low-Dropout Regulator With EN D Available in 1.8-V, 3.3-V, 4.7-V, and Adj. D High PSRR (70 dB at 10 kHz) D Ultralow Noise (15 µVRMS) D Fast Start-Up Time (63 µs) D Stable With Any 1-µF Ceramic Capacitor D Excellent Load/Line Transient D Very Low Dropout Voltage DESCRIPTION The TPS791xx family of low-dropout (LDO) low-power linear voltage regulators features high power supply rejection ratio (PSRR), ultralow noise, fast start-up, and excellent line and load transient responses in a small outline, SOT23, package. Each device in the family is stable, with a small 1-µF ceramic capacitor on the output. The family uses an advanced, proprietary BiCMOS fabrication process to yield extremely low dropout voltages (e.g., 38 mV at 100 mA, TPS79147). Each device achieves fast start-up times (approximately 63 µs with a 0.001 µF bypass capacitor) while consuming very low quiescent current (170 µA typical). Moreover, when the device is placed in standby mode, the supply current is reduced to less than 1 µA. The TPS79118 exhibits approximately 15 µVRMS of output voltage noise with a 0.1 µF bypass capacitor. Applications with analog components that are noise sensitive, such as portable RF electronics, benefit from the high PSRR and low noise features as well as the fast response time. (38 mV at Full Load, TPS79147) D 5-Pin SOT23 (DBV) Package D TPS792xx Provides EN Options APPLICATIONS D Cellular and Cordless Telephones D VCOs D RF D Bluetooth, Wireless LAN D Handheld Organizers, PDA 2 EN 3 OUT RIPPLE REJECTION vs FREQUENCY 100 4 BYPASS Fixed Option DBV PACKAGE (TOP VIEW) IN 1 6 OUT GND 2 5 FB EN 3 4 BYPASS VI = 4.3 V Co = 10 µF C(byp) = 0.01 µF 90 80 IO = 100 mA 60 IO = 10 mA 40 30 Adjustable Option 20 10 100 1k 10 k 100 k f − Frequency − Hz 1M 0.4 0.35 VO = 4.3 V Co = 1 µF C(byp) = 0.1 µF 0.3 70 50 Hz GND 5 TPS79133 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY Output Spectral Noise Density − 1 Ripple Rejection − dB IN TPS79133 µ V/ DBV PACKAGE (TOP VIEW) 10 M 0.25 0.2 IO = 100 mA 0.15 0.1 IO = 1 mA 0.05 0 100 1k 10 k f − Frequency − Hz 100 k Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Bluetooth is a trademark owned by the Bluetooth SIG, Inc. !"# $ %&!!'# "$ (&)*%"# +"#', !+&%#$ %! # $('%%"#$ ('! #-' #'!$ '."$ $#!&'#$ $#"+"!+ /"!!"#0, !+&%# (!%'$$1 +'$ # '%'$$"!*0 %*&+' #'$#1 "** ("!"'#'!$, Copyright 2002, Texas Instruments Incorporated www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TJ VOLTAGE PACKAGE 1.2 to 5.5 V 1.8 V −40°C to 125°C SOT23 (DBV) 3.3 V 4.7 V (1) The DBVT indicates tape and reel of 250 parts. (2) The DBVR indicates tape and reel of 3000 parts. PART NUMBER TPS79101DBVT(1) TPS79101DBVR(2) SYMBOL PEUI TPS79118DBVT(1) TPS79133DBVT(1) TPS79118DBVR(2) TPS79133DBVR(2) PERI TPS79147DBVT(1) TPS79147DBVR(2) PETI PESI ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) TPS79101, TPS79118 TPS79133, TPS79147 Input voltage range(2) −0.3 V to 6 V Voltage range at EN −0.3 V to VI + 0.3 V Voltage on OUT −0.3 V to 6 V Peak output current Internally limited ESD rating, HBM 2 kV ESD rating, CDM 500 V Continuous total power dissipation See Dissipation Rating Table Operating virtual junction temperature range, TJ −40°C to 150°C Operating ambient temperature range, TA −40°C to 85°C Storage temperature range, Tstg −65°C to 150°C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. PACKAGE DISSIPATION RATING BOARD PACKAGE RθJC Low K(1) High K(2) DBV 63.75°C/W DBV 63.75°C/W TA ≤ 25°C POWER RATING TA = 70°C POWER RATING TA = 85°C POWER RATING 256°C/W DERATING FACTOR ABOVE TA = 25°C 3.906 mW/°C 391 mW 215 mW 156 mW 178.3°C/W 5.609 mW/°C 561 mW 308 mW RθJA 224 mW (1) The JEDEC low-K (1s) board design used to derive this data was a 3-inch × 3-inch, two-layer board with 2-ounce copper traces on top of the board. (2) The JEDEC high-K (2s2p) board design used to derive this data was a 3-inch × 3-inch, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom of the board. RECOMMENDED OPERATING CONDITIONS MIN Input voltage, VI (1) Continuous output current, IO (2) NOM MAX UNIT 2.7 5.5 V 0 100 mA Operating junction temperature, TJ −40 125 °C (1) To calculate the minimum input voltage for your maximum output current, use the following formula: VI(min) = VO(max) + VDO (max load) (2) Continuous output current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that the device operate under conditions beyond those specified in this table for extended periods of time. 2 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range, (TJ = −40 to 125 °C), VI = VO(typ) + 1 V, IO = 1 mA, EN = 0 V, Co = 10 µF, Co(byp)= 0.01 µF (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TPS79101 TJ = 25°C, 1.22 V ≤ VO ≤ 5.2 V 0 µA< IO < 100 mA(1), 1.22 V ≤ VO ≤ 5.2 V TPS79118 TJ = 25°C 0 µA < IO < 100 mA, 2.8 V < VI < 5.5 V TPS79133 TJ = 25°C 0 µA < IO < 100 mA, 4.3 V < VI < 5.5 V 3.234 TPS79147 TJ = 25°C 0 µA < IO < 100 mA, 5.2 V < VI < 5.5 V 4.606 Output voltage 0.98 VO 1.8 1.764 1.836 0 µA < IO < 100 mA, TJ = 25°C Output voltage line regulation (∆VO/VO)(2) VO + 1 V < VI ≤ 5.5 V, TJ = 25°C VO + 1 V < VI ≤ 5.5 V BW = 100 Hz to 100 kHz, IO = 100 mA, TJ = 25 25°C C RL = 33 Ω, TJ = 25°C Time, start-up (TPS79133) Co = 1 µF, F, 3.366 4.7 4.794 170 UVLO threshold 5 µA A mV 0.05 0.12 C(byp) = 0.001 µF C(byp) = 0.0047 µF 32 C(byp) = 0.01 µF C(byp) = 0.1 µF 16 C(byp) = 0.001 µF C(byp) = 0.0047 µF 53 C(byp) = 0.01 µF 98 VO = 0 V(1) VCC rising Output current limit V 3.3 250 Load regulation UNIT 1.02 VO 0 µA < IO < 100 mA Output noise voltage (TPS79118) MAX VO 0 µA < IO < 100 mA, TJ = 25°C Quiescent current (GND current) TYP 17 %/V µV VRMS 15 µs 67 285 600 mA 2.25 2.65 V UVLO hysteresis TJ = 25°C, VCC rising 100 mV (1) The minimum IN operating voltage is 2.7 V or VO(typ) + 1 V, whichever is greater. The maximum IN voltage is 5.5 V. The maximum output current is 100 mA. (2) If VO ≤ 1.8 V then VImin = 2.7 V, VImax = 5.5 V: Line regulation (mV) + ǒ%ńVǓ V O ǒV Imax * 2.7 VǓ 100 1000 If VO ≥ 2.5 V then VImin = VO + 1 V, VImax = 5.5 V: Line regulation (mV) + ǒ%ńVǓ ǒ ǒ ǓǓ VO V Imax * VO ) 1 V 100 1000 3 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 ELECTRICAL CHARACTERISTICS continued over recommended operating free-air temperature range, (TJ = −40 to 125 °C), VI = VO(typ) + 1 V, IO = 1 mA, EN = 0 V, Co = 10 µF, Co(byp)= 0.01 µF (unless otherwise noted) PARAMETER TEST CONDITIONS Standby current High level enable input voltage EN = VI, 2.7 V < VI < 5.5 V Low level enable input voltage 2.7 V < VI < 5.5 V Input current (EN) EN = VI f = 100 Hz, f = 100 Hz, TPS79118 f = 10 kHz, f = 100 kHz, Power supply ripple rejection f = 100 Hz, f = 100 Hz, TPS79133 f = 10 kHz, f = 100 kHz, MIN 2.7 V < VI < 5.5 V MAX 0.07 1 2 −1 TJ = 25°C, TJ = 25°C, IO = 10 mA IO = 100 mA 80 TJ = 25°C, TJ = 25°C, IO = 100 mA IO = 100 mA 72 TJ = 25°C, TJ = 25°C, IO = 10 mA IO = 100 mA 70 TJ = 25°C, TJ = 25°C, IO = 100 mA IO = 100 mA 73 µA 0.7 V 1 µA 75 45 dB 75 37 50 TPS79133 38 TPS79147 IO = 100 mA, TJ = 25°C IO = 100 mA (1) IN voltage equals VO(typ) − 100 mV; The TPS79118 dropout voltage is limited by the input voltage range limitations. UNIT V IO = 100 mA, TJ = 25°C IO = 100 mA Dropout voltage(1) 4 TYP 90 mV 70 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 FUNCTIONAL BLOCK DIAGRAM—ADJUSTABLE VERSION VOUT VIN Current Sense UVLO SHUTDOWN ILIM _ GND R1 + FB EN R2 UVLO Thermal Shutdown External to the Device 250 kΩ Bandgap Reference VIN Vref Bypass FUNCTIONAL BLOCK DIAGRAM—FIXED VERSION VOUT VIN UVLO Current Sense GND SHUTDOWN ILIM _ R1 + EN UVLO R2 Thermal Shutdown VIN 250 kΩ Bandgap Reference Vref Bypass Terminal Functions TERMINAL NAME I/O DESCRIPTION ADJ FIXED BYPASS 4 4 EN 3 3 I The EN terminal is an input which enables or shuts down the device. When EN is a logic high, the device will be in shutdown mode. When EN is a logic low, the device will be enabled. FB 5 N/A I This terminal is the feedback input voltage for the adjustable device. GND 2 2 IN 1 1 I The IN terminal is the input to the device. OUT 6 5 O The OUT terminal is the regulated output of the device. An external bypass capacitor, connected to this terminal, in conjunction with an internal resistor, creates a low-pass filter to further reduce regulator noise. Regulator ground 5 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 TYPICAL CHARACTERISTICS TPS79118 TPS79133 TPS79118 OUTPUT VOLTAGE vs OUTPUT CURRENT OUTPUT VOLTAGE vs OUTPUT CURRENT OUTPUT VOLTAGE vs JUNCTION TEMPERATURE 3.303 VI = 2.8 V Co = 10 µF TJ = 25° C 3.302 V O − Output Voltage − V 1.801 1.8 1.799 1.798 1.797 1.815 3.301 3.3 3.299 3.298 20 40 60 80 IO − Output Current − mA 0 100 20 40 60 80 20 35 50 65 80 95 110 125 TJ − Junction Temperature − °C Figure 3 TPS79133 TPS79133 TPS79118 GROUND CURRENT vs JUNCTION TEMPERATURE OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY 260 Hz VI = 4.3 V Co = 10 µF 3.29 IO = 100 mA 3.28 220 200 IO = 1 mA 180 IO = 100 mA 160 140 120 3.27 −40 −25 −10 5 100 20 35 50 65 80 95 110 125 −40 −25 −10 5 TJ − Junction Temperature − °C 20 35 50 65 80 95 110 125 Output Spectral Noise Density − IO = 1 mA 3.3 VI = 2.8 V Co = 1 µF C(byp) = 0.1 µF 0.16 0.14 0.12 IO = 100 mA 0.1 0.08 IO = 1 mA 0.06 0.04 0.02 0 100 TJ − Junction Temperature − °C Figure 4 0.2 0.18 µ V/ 240 Ground Current − µ A Figure 5 1k 10 k f − Frequency − Hz 100 k Figure 6 TPS79133 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY IO = 1 mA 0.15 IO = 100 mA 0.1 0.05 0 100 1k 10 k f − Frequency − Hz Figure 7 1.2 1 Output Spectral Noise Density − 0.2 VI = 2.8 V Co = 10 µF C(byp) = 0.1 µF 100 k IO = 0.001 µF 0.8 VI = 2.8 V IO = 100 mA Co = 10 µF IO = 0.1 µF IO = 0.01 µF 0.4 0.2 0 100 1k 10 k f − Frequency − Hz Figure 8 0.35 VI = 4.3 V Co = 1 µF C(byp) = 0.1 µF 0.3 IO = 0.0047 µF 0.6 0.4 Output Spectral Noise Density − 0.25 Hz TPS79118 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY µ V/ TPS79118 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY Hz V O − Output Voltage − V 1.78 −40 −25 −10 5 100 3.31 Hz IO = 100 mA 1.79 OUTPUT VOLTAGE vs JUNCTION TEMPERATURE VI = 4.3 V Co = 10 µF µ V/ 1.795 Figure 2 3.32 Output Spectral Noise Density − IO = 1 mA 1.8 IO − Output Current − mA Figure 1 6 1.805 1.785 3.297 0 VI = 2.8 V Co = 10 µF 1.81 µ V/ V O − Output Voltage − V 1.802 1.82 VI = 4.3 V Co = 10 µF TJ = 25° C V O − Output Voltage − V 1.803 100 k 0.25 0.2 IO = 100 mA 0.15 0.1 IO = 1 mA 0.05 0 100 1k 10 k f − Frequency − Hz Figure 9 100 k www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 1.8 µ V/ VI = 4.3 V Co = 10 µF C(byp) = 0.1 µF 0.35 0.3 0.25 IO = 100 mA 0.2 0.15 IO = 1 mA 0.1 0.05 0 100 1k 10 k f − Frequency − Hz IO = 0.001 µF 1.6 1.4 IO = 0.0047 µF 1.2 IO = 0.1 µF 1 0.8 IO = 0.01 µF 0.6 0.4 0.2 0 100 k 1k 100 100 k BW = 100 Hz to 100 kHz 60 50 VO = 3.3 V 40 30 VO = 1.8 V 20 10 0 0.001 Figure 12 TPS79133 TPS79133 TPS792133 OUTPUT IMPEDANCE vs FREQUENCY DROPOUT VOLTAGE vs JUNCTION TEMPERATURE DROPOUT VOLTAGE vs OUTPUT CURRENT 80 VI = 4.3 V Co = 10 µF TJ = 25°C 100 VI = 3.2 V, Co = 10 µF V DO − Dropout Voltage − mV 70 2 IO = 1 mA 1.5 1 IO = 100 mA 0.5 VI = 3.2 V CO = 10 µF 90 60 50 IO = 100 mA 40 30 20 IO = 10 mA 10 80 TJ = 125°C 70 60 TJ = 25°C 50 40 30 20 TJ = −40°C 10 0 10 0 100 1k 10 k 100 k 1M 10 M f − Frequency − Hz 0 −40 −25 −10 5 20 35 50 65 80 95 110 125 TJ − Junction Temperature − °C Figure 13 0 0.02 Minimum Required Input Voltage − V V DO − Dropout Voltage − mV 100 TJ = 125°C TJ = 25°C 40 TJ = −40°C 20 4 VI − Input Voltage − V Figure 16 4.5 5 4.7 90 VI = 3.2 V Co = 10 µF 4.2 TJ = 125°C 3.7 TJ = −40°C 3.2 TJ = 25°C 70 60 50 30 20 10 2 2.5 3 3.5 4 VO − Output Voltage − V Figure 17 4.5 5 IO = 100 mA 40 2.7 2.2 1.5 IO = 1 mA 80 Ripple Rejection − dB 5.2 3.5 0.1 TPS79118 IO = 100 mA 3 0.08 RIPPLE REJECTION vs FREQUENCY MINIMUM REQUIRED INPUT VOLTAGE vs OUTPUT VOLTAGE 120 60 0.06 Figure 15 TPS79101 80 0.04 IO − Output Current − A Figure 14 DROPOUT VOLTAGE vs INPUT VOLTAGE 0 2.5 0.1 0.01 C(bypass) − Bypass Capacitance − µF Figure 11 3 Z o − Output Impedance − Ω 10 k 70 f − Frequency − Hz Figure 10 2.5 VI = 4.3 V IO = 100 mA Co = 10 µF V DO − Dropout Voltage − mV Output Spectral Noise Density − 2 Hz 0.4 ROOT MEAN SQUARED OUTPUT NOISE vs BYPASS CAPACITANCE µ V (RMS) TPS79133 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY RMS − Root Mean Squared Output Noise − TPS79133 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY Output Spectral Noise Density − µ V/ Hz TYPICAL CHARACTERISTICS 0 100 VI = 2.8 V Co = 10 µF C(byp) = 0.01 µF 1k 10 k 100 k 1M 10 M f − Frequency − Hz Figure 18 7 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 TYPICAL CHARACTERISTICS TPS79118 TPS79118 TPS79133 RIPPLE REJECTION vs FREQUENCY RIPPLE REJECTION vs FREQUENCY RIPPLE REJECTION vs FREQUENCY 80 IO = 10 mA 60 50 40 IO = 100 mA 60 50 40 30 1k 10 k 100 k 1M 0 100 10 M 100 k 1M 10 M 100 1k 10 k 100 k f − Frequency − Hz 1M 10 M Figure 21 TPS79133 TPS79133 RIPPLE REJECTION vs FREQUENCY OUTPUT VOLTAGE, ENABLE VOLTAGE vs TIME (START-UP) 80 70 60 IO = 10 mA 80 30 20 20 1M IO = 10 mA 50 30 10 10 M 100 1k 10 k 100 k f − Frequency − Hz 1M 10 M IO = 100 mA Co = 1 µF C(byp) = 0.01 µF 10 0 ∆ VO − Change In Output Voltage − mV TPS79118 LOAD TRANSIENT RESPONSE VI = 2.8 V Co = 10 µF 20 0 −20 −10 Current Load − mA −40 3.8 100 2.8 60 70 80 90 100 t − Time − µs Figure 25 1 0 3 2 C(byp) = 0.0047 µF 1 C(byp) = 0.01 µF 0 0 20 40 0 0 200 400 600 800 1 k 12 k 14 k 16 k 18 k 2 k t − Time − µs Figure 26 60 80 100 120 140 160 180 200 t − Time − µs Figure 24 TPS79118 30 40 50 VI = 4.3 V VO = 3.3 V IO = 100 mA Co = 1 µF TJ = 25°C 2 Figure 23 LINE TRANSIENT RESPONSE 10 20 3 C(byp) = 0.001 µF 60 40 1k 10 k 100 k f − Frequency − Hz IO = 100 mA 70 40 100 VI = 4.3 V Co = 1 µF C(byp) = 0.1 µF 90 IO = 100 mA Enable Voltage − V 100 VI = 4.3 V CO = 1 µF C(byp) = 0.01 µF 0 10 TPS79133 Ripple Rejection − dB Ripple Rejection − dB − Output Voltage − mV O − Input Voltage − V V I V 10 k RIPPLE REJECTION vs FREQUENCY Figure 22 8 30 Figure 20 100 10 40 f − Frequency − Hz Figure 19 50 IO = 10 mA 20 1k f − Frequency − Hz 90 50 V O − Output Voltage − V 0 100 60 VI = 2.8 V Co = 1 µF C(byp) = 0.1 µF 10 IO = 100 mA 70 TPS79133 V O − Output Voltage − mV 10 IO = 100 mA 20 VI = 2.8 V Co = 1 µF C(byp) = 0.01 µF 80 V I − Input Voltage − V 20 70 Ripple Rejection − dB 70 30 VI = 4.3 V Co = 10 µF C(byp) = 0.01 µF 90 IO = 10 mA Ripple Rejection − dB 80 Ripple Rejection − dB 100 90 90 LINE TRANSIENT RESPONSE 20 0 −20 5.3 4.3 IO = 100 mA Co = 1 µF C(byp) = 0.01 µF 0 5 10 15 20 dv 0.4 V + µs dt 25 30 t − Time − µs Figure 27 35 40 45 50 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 TYPICAL CHARACTERISTICS TPS79118 TYPICAL REGIONS OF STABILITY EQUIVALENT SERIES RESISTANCE (ESR) vs OUTPUT CURRENT TPS79133 Ω VI = 4.3 V Co = 10 µF 20 ESR − Equivalent Series Resistance − ∆ V − Change In O I O − Output Current − mA Output Voltage − mV LOAD TRANSIENT RESPONSE 0 −20 −40 100 0 0 100 Co = 0.47 µF VI = 5.5 V TJ = −40 °C to 125°C 10 Region of Instability 1 0.1 Region of Instability 0.01 50 100 150 200 250 300 350 400 450 500 0 t − Time − µs 0.02 Figure 28 Ω Co = 1 µF VI = 5.5 V TJ = −40 °C to 125°C Region of Instability 1 0.1 Region of Stability 0.01 0.04 0.06 0.08 IO − Output Current − A Figure 30 0.1 TYPICAL REGIONS OF STABILITY EQUIVALENT SERIES RESISTANCE (ESR) vs OUTPUT CURRENT ESR − Equivalent Series Resistance − Ω ESR − Equivalent Series Resistance − 100 0.02 0.08 TPS79118 TPS79118 0 0.06 Figure 29 TYPICAL REGIONS OF STABILITY EQUIVALENT SERIES RESISTANCE (ESR) vs OUTPUT CURRENT 10 0.04 IO − Output Current − A 0.1 100 Co = 10 µF VI = 5.5 V TJ = −40 °C to 125°C 10 Region of Instability 1 0.1 Region of Stability 0.01 0 0.02 0.04 0.06 0.08 0.1 IO − Output Current − A Figure 31 9 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 APPLICATION INFORMATION The TPS791xx family of low-dropout (LDO) regulators have been optimized for use in noise-sensitive battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output noise, low quiescent current (170 µA typically), and enable-input to reduce supply currents to less than 1 µA when the regulator is turned off. A typical application circuit is shown in Figure 32. TPS791xx VI 1 IN BYPASS OUT 0.1 µF 4 5 VO 3 0.01 µF EN + GND 1 µF 2 Figure 32. Typical Application Circuit EXTERNAL CAPACITOR REQUIREMENTS A 0.1-µF or larger ceramic input bypass capacitor, connected between IN and GND and located close to the TPS791xx, is required for stability and to improve transient response, noise rejection, and ripple rejection. A higher-value electrolytic input capacitor may be necessary if large, fast-rise-time load transients are anticipated and the device is located several inches from the power source. Like all low dropout regulators, the TPS791xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop. The minimum recommended capacitance is 1 µF. Any 1 µF or larger ceramic capacitor is suitable. The device is also stable with a 0.47 µF ceramic capacitor with at least 75 mΩ of ESR. The internal voltage reference is a key source of noise in an LDO regulator. The TPS791xx has a BYPASS pin which is connected to the voltage reference through a 250-kΩ internal resistor. The 250-kΩ internal resistor, in conjunction with an external bypass capacitor connected to the BYPASS pin, creates a low pass filter to reduce the voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate properly, the current flow out of the BYPASS pin must be at a minimum because any leakage current creates an IR drop across the internal resistor thus creating an output error. Therefore, the bypass capacitor must have minimal leakage current. For example, the TPS79118 exhibits approximately 15 µVRMS of output voltage noise using a 0.1 µF ceramic bypass capacitor and a 1 µF ceramic output capacitor. Note that the output starts up slower as the bypass capacitance increases due to the RC time constant at the bypass pin that is created by the internal 250 kΩ resistor and external capacitor. BOARD LAYOUT RECOMMENDATION TO IMPROVE PSRR AND NOISE PERFORMANCE To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the ground pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the ground pin of the device. 10 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 POWER DISSIPATION AND JUNCTION TEMPERATURE Specified regulator operation is assured to a junction temperature of 125°C; the maximum junction temperature should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or equal to PD(max). The maximum-power-dissipation limit is determined using the following equation: P T max * T A + J D(max) R qJA (1) Where: TJmax is the maximum allowable junction temperature. RθJA is the thermal resistance junction-to-ambient for the package, see the dissipation rating table. TA is the ambient temperature. The regulator dissipation is calculated using: P D ǒ + V *V I O Ǔ I O (2) Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal protection circuit. PROGRAMMING THE TPS79101 ADJUSTABLE LDO REGULATOR The output voltage of the TPS79101 adjustable regulator is programmed using an external resistor divider as shown in Figure 33. The output voltage is calculated using: V O +V ǒ1 ) R1 Ǔ R2 ref (3) Where: Vref = 1.2246 V typ (the internal reference voltage) Resistors R1 and R2 should be chosen for approximately 50-µA divider current. Lower value resistors can be used for improved noise performance, but the solution consumes more power. Higher resistor values should be avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially increases/decreases the feedback voltage and thus erroneously decreases/increases VO. The recommended design procedure is to choose R2 = 30.1 kΩ to set the divider current at 50 µA, C1 = 15 pF for stability, and then calculate R1 using: R1 + ǒ V V Ǔ O *1 ref R2 (4) In order to improve the stability of the adjustable version, it is suggested that a small compensation capacitor be placed between OUT and FB. For voltages <1.8 V, the value of this capacitor should be 100 pF. For voltages >1.8 V, the approximate value of this capacitor can be calculated as: C1 + (3 10*7) (R1 (R1 ) R2) R2) (5) The suggested value of this capacitor for several resistor ratios is shown in the table below. If this capacitor is not used (such as in a unity-gain configuration) or if an output voltage < 1.8 V is chosen, then the minimum recommended output capacitor is 2.2 µF instead of 1 µF. 11 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 TPS79101 VI OUTPUT VOLTAGE PROGRAMMING GUIDE IN 1 µF ≥2V EN OUT VO C1 R1 ≤ 0.7 V 0.01 µF BYPASS FB GND 1 µF OUTPUT VOLTAGE R1 R2 C1 2.5 V 31.6 kΩ 30.1 kΩ 22 pF 3.3 V 51 kΩ 30.1 kΩ 15 pF 3.6 V 59 kΩ 30.1 kΩ 15 pF R2 Figure 33. TPS79101 Adjustable LDO Regulator Programming REGULATOR PROTECTION The TPS791xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input voltage drops below the output voltage (e.g., during power down). Current is conducted from the output to the input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be appropriate. The TPS791xx features internal current limiting and thermal protection. During normal operation, the TPS791xx limits output current to approximately 400 mA. When current limiting engages, the output voltage scales back linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be taken not to exceed the power dissipation ratings of the package or the absolute maximum voltage ratings of the device. If the temperature of the device exceeds approximately 165°C, thermal-protection circuitry shuts it down. Once the device has cooled down to below approximately 140°C, regulator operation resumes. 12 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 MECHANICAL DATA DBV (R-PDSO-G5) PLASTIC SMALL-OUTLINE 0,50 0,30 0,95 5 0,20 M 4 1,70 1,50 1 0,15 NOM 3,00 2,60 3 Gage Plane 3,00 2,80 0,25 0°−8° 0,55 0,35 Seating Plane 1,45 0,95 0,05 MIN 0,10 4073253-4/F 10/00 NOTES:A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-178 13 www.ti.com SLVS325C − MARCH 2001 − REVISED MAY 2002 MECHANICAL DATA DBV (R-PDSO-G6) PLASTIC SMALL-OUTLINE 0,95 6X 6 0,50 0,25 0,20 M 4 1,70 1,50 1 0,15 NOM 3,00 2,60 3 Gage Plane 3,00 2,80 0,25 0°−8° 0,55 0,35 Seating Plane 1,45 0,95 0,05 MIN 0,10 4073253-5/F 10/00 NOTES:A. B. C. D. E. 14 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Leads 1, 2, 3 are wider than leads 4, 5, 6 for package orientation. Pin 1 is located below the first letter of the top side symbolization. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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