MICREL SY89540UMI

SY89540U
Precision Low Jitter 4x4 LVDS Crosspoint
Switch with Internal Termination
General Description
The SY89540U is a low-jitter, low skew, high-speed
4x4 crosspoint switch optimized for precision
telecom and enterprise server/storage distribution
applications. The SY89540U guarantees data-rates
up to 3.2Gbps over temperature and voltage.
The SY89540U differential input includes Micrel’s
unique, 3-pin input termination architecture that
directly interfaces to any differential signal (AC or
DC-coupled) as small as 100mV (200mVpp) without
any level shifting or termination resistor networks in
the signal path. The LVDS compatible outputs
maintain extremely fast rise/fall times guaranteed to
be less than 120ps.
The SY89540U features a patent-pending isolation
design that significantly improves on channel-tochannel crosstalk performance.
The SY89540U operates from a 2.5V ±5% supply
and is guaranteed over the full industrial
temperature range (–40°C to +85°C). The
SY89540U is part of Micrel’s high-speed, Precision
Edge® product line.
All support documentation can be found on Micrel’s
web site at www.micrel.com.
Typical Performance
OUTPUT SWING
(100mV/div.)
2.5Gbps Output
Precision Edge®
Features
• Provides crosspoint switching between any input
pairs to any output pair
• Patent pending, channel-to-channel isolation
design provides superior crosstalk performance
• Guaranteed AC performance over temperature
and voltage:
• DC-to-3.2Gbps throughput
– <480ps propagation delay
– <120ps rise/fall time
– <30ps output-to-output skew
• Ultra-low jitter design:
– <1psRMS random jitter
– <10psPP deterministic jitter
– <10psPP total jitter (clock)
– <0.7psRMS crosstalk induced jitter
• Patent pending 50 input termination, extended
CMVR, and VT pin accepts DC- and AC-coupled
differential inputs
• 350mV LVDS output swing
• Power supply 2.5V ±5%
• –40°C to +85°C temperature range
• Available in 44-pin (7mm x 7mm) MLF™ package
• Pb-Free Green package
Applications
TIME (100ps/div.)
• All SONET/SDH channel select applications
• All Fibre Channel multi-channel select
applications
• All Gigabit Ethernet multi-channel select
applications
Precision Edge is a registered trademark of Micrel, Inc.
MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc.
April 2005
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SY89540U
Functional Block Diagram
I N0
50Ω
VT0
0
50Ω
/I N0
Vref_AC0
1
Q0
2
/Q 0
3
0
I N1
50Ω
VT1
50Ω
/I N1
1
Q1
2
/Q 1
Vref_AC1
3
0
I N2
50Ω
VT2
50Ω
/I N2
Vref_AC2
1
Q2
2
/Q 2
3
0
I N3
50Ω
VT3
1
Q3
2
/Q 3
3
50Ω
/I N3
Vref_AC3
SIN0 (CMOS/TTL )
SIN1 (CMOS/TTL )
SOUT0 (CM OS/TTL )
SOUT1 (CM OS/TTL )
CONF (CM OS/TTL)
L OAD (CMOS/TTL )
April 2005
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SY89540U
Ordering Information(1)
Package
Type
Temperature
Range
Package Marking
Lead
Finish
MLF-44
Industrial
89540U
Sn-Pb
SY89540UMITR
MLF-44
Industrial
89540U
Sn-Pb
SY89540UMG
MLF-44
Industrial
89540U with Pb-Free bar-line indicator
Pb-Free
NiPdAu
SY89540UMGTR(2)
MLF-44
Industrial
89540U with Pb-Free bar-line indicator
Pb-Free
NiPdAu
Part Number
SY89540UMI
(2)
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC electrical only.
2. Tape and Reel ordering option.
GND
GND
VREF_AC3
IN3
VT3
/IN3
SOUT0
SOUT1
GND
GND
VCC
Pin Configuration
44 43 42 41 40 39 38 37 36 35 34
1
33
2
32
3
31
4
30
5
29
6
28
7
27
8
26
9
25
24
10
23
11
12 13 14 15 16 17 18 19 20 21 22
/Q3
Q3
VCC
/Q2
Q2
VCC
/Q1
Q1
VCC
/Q0
Q0
GND
GND
VREF_AC0
/IN0
VT0
IN0
SIN0
SIN1
GND
GND
VCC
VREF_AC2
/IN2
VT2
IN2
CONFIG
VCC
LOAD
/IN1
VT1
IN1
VREF_AC1
44-Pin MLF™ (MLF-44)
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SY89540U
Pin Description
Pin Number
Pin Name
Pin Function
17, 15,
10, 8
4, 2
41, 39
IN0, /IN0,
IN1, /IN1,
IN2, /IN2,
IN3, /IN3
Differential Inputs: These input pairs are the differential signal inputs to the
device. Inputs accept AC- or DC-coupled signals as small as 100mV. Each pin
of a pair internally terminates to a VT pin through 50. Note that these inputs
will default to an indeterminate state if left open. Please refer to the "Input
Interface Applications" section for more details.
16, 9,
3, 40
VT0, VT1,
VT2, VT3
Input Termination Center-Tap: Each side of the differential input pair terminates
to a VT pin. The VT pins provide a center-tap to a termination network for
maximum interface flexibility. See "Input Interface Applications" section for more
details.
14,
11,
1,
42
VREF_AC0,
VREF_AC1,
VREF_AC2,
VREF_AC3
Reference Voltage: This output biases to VCC–1.2V. It is used when ACcoupling the inputs (IN, /IN). Connect VREF_AC to the VT pin. Bypass each
VREF-AC pin with a 0.01µF low ESR capacitor. See "Input Interface
Applications" section for more details.
18, 19
SIN0,
SIN1
These single-ended TTL/CMOS-compatible inputs address the data inputs.
Note that these inputs are internally connected to a 25k pull-up resistor and
will default to a logic HIGH state if left open.
38, 37
SOUT0,
SOUT1
These single-ended TTL/CMOS-compatible inputs address the data outputs.
Note that these inputs are internally connected to a 25k pull-up resistor and
will default to logic HIGH state if left open.
5, 7
CONF,
LOAD
These single-ended TTL/CMOS-compatible inputs control the transfer of the
addresses to the internal multiplexers. See "Address Tables" and "Timing
Diagram" sections for more details. Note that these inputs are internally
connected to a 25k pull-up resistor and will default to logic HIGH state if left
open.
Configuration Sequence
1. Load: Loads configuration into buffer, while Configuration Buffer holds
existing switch configuration.
2. Configuration: Loads new configuration into the Configuration Buffer and
updates switch configuration.
Buffer Mode
The SY89540U defaults to buffer mode (IN to Q) if the load and configuration
control signals are not exercised.
23, 24,
26, 27,
29, 30,
32, 33
Q0, /Q0,
Q1, /Q1,
Q2, /Q2,
Q3, /Q3,
6, 22, 25,
28, 31, 34
VCC
12, 13, 20,
21,35, 36,
43, 44
GND,
Exposed pad
April 2005
Differential Outputs: These LVDS output pairs are the outputs of the device.
Please refer to the truth table below for details. Unused output pairs may be left
open. Each output is designed to drive 350mV into 100 across the pair.
Positive power supply. Bypass with 0.1µF//0.01µF low ESR capacitors and
place as close to each VCC pin.
Ground. GND and EPad must both be connected to the same ground.
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SY89540U
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VCC)............................. –0.5V to +4.0V
Input Voltage (VIN)..................................... –0.5V to VCC
CML Output Voltage (VOUT) .......VCC–1.0V to VCC+5.0V
Termination Current(3)
Source or sink current on VT..................... ±100mA
Input Current
Source or sink current on IN, /IN................ ±50mA
VREF-AC Current
Source or sink current on VREF-AC ................. ±2mA
Lead Temperature (soldering, 20sec.)............... 260°C
Storage Temperature (Ts) .................–65°C to +150°C
Supply Voltage (VCC) ....................+2.375V to +2.625V
Ambient Temperature (TA) .................. –40°C to +85°C
Package Thermal Resistance(4)
MLF™ (JA)
Still-air ............................................................... 23°C/W
MLF™ (JB)
Junction-to-board.............................................. 12°C/W
DC Electrical Characteristics(5)
TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
VCC = 2.5V
2.375
2.5
2.625
V
ICC
Power Supply Current
No load, max. VCC.
200
280
mA
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
80
100
120
RIN
Input Resistance
(IN-to-VT, /IN-to-VT)
40
50
60
VIH
Input HIGH Voltage
(IN, /IN)
VCC–1.6
VCC
V
VIL
Input LOW Voltage
(IN, /IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a.
100
1700
mV
VDIFF_IN
Differential Input Voltage
|IN, /IN|
See Figure 1b.
200
IN-to-VT
Maximum Input Voltage
|IN-to-VT|
VREF-AC
Reference Voltage
Note 6
VCC–1.3
mV
VCC–1.2
1.28
V
VCC–1.1
V
Notes:
1.
Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a
stress rating only and functional operation is not implied for conditions other than those detailed in the operational
sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device
reliability.
2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3.
Due to limited drive capability use for input of the same package only.
4.
Assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. JB uses a 4-layer
JA in still-air unless otherwise stated.
5.
The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been
established.
6.
VIH (min) not lower than 1.2V.
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SY89540U
LVDS Outputs DC Electrical Characteristics
VCC = 2.5V ±5%, TA = –40°C to +85°C, RL = 100 across Q and /Q, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOH
Output HIGH Voltage
(Q, /Q)
1.475
V
VOL
Output LOW Voltage
(Q, /Q)
VOUT
Output Voltage Swing
(Q, /Q)
See Figure 1a.
250
350
mV
VDIFF_OUT
Differential Output Voltage Swing
|Q – /Q|
See Figure 1b.
500
700
mV
VOCM
Output Common Mode Voltage
(Q, /Q)
See Figure 4b.
1.125
1.275
V
VOCM
Change in Common Mode Voltage
(Q, /Q)
See Figure 4b.
–50
+50
mV
Max
Units
VCC
V
0.8
V
30
µA
0.925
V
LVTTL/CMOS DC Electrical Characteristics
VCC = 2.5V ±5%, TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIH
Input HIGH Current
IIL
Input LOW Current
April 2005
Condition
Min
2.0
–125
VIL = 0V
–300
6
Typ
µA
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SY89540U
AC Electrical Characteristics(7)
VCC = 2.5V ±5%, TA = –40°C to +85°C, RL = 100 across each output pair, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
fMAX
Maximum Operating Frequency
NRZ Data
3.2
4
Gbps
tPD
Propagation Delay
Clock, VOUT 200mV
4
GHz
IN-to-Q
280
CONFIG-to-Q
350
tPD
Tempco
tS
380
Max
Units
480
160
Set-up Time
SIN-to-LOAD
SOUT-to-LOAD
LOAD-to-CONFIG
CONFIG-to-LOAD
800
fs/°C
800
800
800
950
ps
th
Hold Time
LOAD-to-SIN, LOAD-to-SOUT
800
ps
tPW
Minimum LOAD and CONFIG
Pulse Width
800
ps
tSKEW
Output-to-Output Skew
Part-to-Part Skew
Note 8
Note 9
30
150
ps
ps
tJITTER
Data
Random Jitter (RJ)
Deterministic Jitter (DJ)
Note 10
Note 11
1
10
psRMS
psPP
Clock
Cycle-to-Cycle Jitter
Total Jitter (TJ)
Note 12
Note 13
1
psRMS
psPP
Crosstalk-Induced Jitter
Note 14
0.7
psRMS
Rise/Fall Times
At full output swing (20% to 80%)
120
ps
tr, tr
40
80
Notes:
7.
High frequency AC-parameters are guaranteed by design and characterization.
8.
Output to output skew is measured between two different outputs under identical transitions. Input voltage swing is
100mV.
9.
Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew
of the edges at the respective inputs.
10. RJ is measured with a K28.7 comma detect character pattern, measured at 2.5Gbps/3.2Gbps.
11. DJ is measured at 2.5Gbps/3.2Gpbs, with both K28.5 and 223–1 PRBS pattern
12. Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles, Tn –Tn-1 where T is the time between
rising edges of the output signal.
13. TJ definition: with an ideal clock input of frequency < fMAX, no more than one output edge in 1012 output edges will deviate
by more than the specified peak-to-peak jitter value.
14. Crosstalk induced jitter is defined as the added jitter that results from signals applied to two adjacent channels. It is
measured at the output while applying two similar, differential clock frequencies that are asynchronous with respect to
each other at the inputs.
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SY89540U
Single-Ended and Differential Swing
VIN, VOUT
350mV
(typical)
VDIFF_IN, VDIFF_OUT
700mV (typical)
Figure 1a. Single-Ended Voltage Swing
Figure 1b. Differential Voltage Swing
Timing Diagram
Input Address
SIN[1:0]
Output Address
SOUT[1:0]
t s (SIN-LOAD)
LOAD
t h (LOAD-SIN/SOUT)
t s (CONFIG-LOAD)
t PW
t s (SOUT-LOAD)
t s (LOAD-CONFIG)
CONFIG
t PW
/IN[3:0]
IN[3:0]
t PD (CONFIG-Q)
t PD
/Q[3:0]
Invalid**
Valid**
Q[3:0]
**Invalid and Valid refers to configuration being changed. All outputs with unchanged configuration remain valid.
Figure 2. Timing Diagram
Truth Tables
Input Select Address Table
Output Select Address Table
SIN1
SIN0
Input
SOUT1
SOUT0
Output
0
0
IN0
0
0
Q0
0
1
IN1
0
1
Q1
1
0
IN2
1
0
Q2
1
1
IN3
1
1
Q3
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SY89540U
Typical Operating Characteristics
TEMPERATURE (¡C)
CHANNEL-to-CHANNEL SKEW (ps)
FREQUENCY (MHz)
16
335
900
20 40 60 80 100 120
340
1000
345
-40 -20 0
345
800
350
350
700
5600
5000
4400
3800
3200
2600
2000
800
200
50
1400
100
355
355
600
150
360
500
200
360
365
400
250
365
300
AMPLITUDE (ps)
300
370
Input Voltage Swing vs.
Propagation Delay
200
370
PROPAGATION DELAY (ps)
350
Propagation Delay vs.
Temperature
100
Amplitude vs.
Frequency
OUTPUT PROPAGATION DELAY (ps)
VCC = 2.5, VIN = 100mV, at 25°C.
INPUT VOLTAGE SWING (ps)
Channel-to-Channel
Skew, Relative to Ch0
14
12
10
8
6
4
2
0
0
1
2
3
4
CHANNEL (ps)
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SY89540U
Functional Characteristics
VCC = 2.5, VIN = 100mV, at 25°C.
Clock Pattern
OUTPUT SWING
(80mV/div.)
1.25GHz Output
OUTPUT SWING
(80mV/div.)
200MHz Output
TIME (600ps/div.)
TIME (100ps/div.)
OUTPUT SWING
(80mV/div.)
2.5GHz Output
TIME (50ps/div.)
Data Pattern
OUTPUT SWING
(100mV/div.)
3.2Gbps Output
OUTPUT SWING
(100mV/div.)
1.25Gbps Output
TIME (200ps/div.)
April 2005
TIME (80ps/div.)
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SY89540U
Output Stage Internal Termination
Input and Output Stage Internal
Termination
On a nominal 1.25V common mode above ground,
LVDS specifies a small swing of 350mV, typical. The
common mode voltage has tight limits to permit large
variations in ground between an LVDS driver and
receiver. Also, change in common mode voltage, as
a function of data input, is kept to a minimum to
keep EMI low.
VCC
IN
VOUT
50Ω
VOH, VOL
VT
100Ω
±1%
VOH, VOL
50Ω
/IN
GND
GND
Figure 3. Simplified Differential Input Stage
Figure 4a. LVDS Differential Measurement
50Ω
50Ω
VCOM
V∆COM
GND
Figure 4b. LVDS Common Mode Measurement
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SY89540U
Input Interface Applications
VCC
VCC
VCC
IN
IN
IN
LVPECL
CML
LVPECL
/IN
VCC
SY89540U
0.1µF
GND
RP
RP
GND
VT
VT
GND
VREF-AC
VREF-AC
VCC
GND
NC
VT
NC
VREF-AC
Note:
For 3.3V, RP = 100Ω.
For 2.5V, RP = 50Ω.
Note:
For 3.3V, RP = 50Ω.
For 2.5V, RP = 19Ω.
Figure 5a. LVPECL Interface
(DC-Coupled)
SY89540U
SY89540U
0.1µF
NC
RP
/IN
/IN
VCC
Figure 5b. LVPECL Interface
(AC-Coupled)
Figure 5c. CML Interface
(DC-Coupled)
VCC
IN
IN
CML
LVDS
/IN
VCC
GND
/IN
SY89540U
SY89540U
0.1µF
VT
GND
VREF-AC
Figure 5d. CML Interface
(AC-Coupled)
NC
VT
NC
VREF-AC
Figure 5e. LVDS Interface
Related Product and Support Documentation
Part Number
Function
Data Sheet Link
SY58540U
Ultra Precision 4x4 CML Crosspoint Switch
w/Internal I/O Termination
http:///www.micrel.com/product-info/products/sy89540u.shtml
HBW Solutions
New Products and Applications
www.micrel.com/product-info/products/solutions.shtml
MLF™ Application Note
www.amkor.com/products/notes_papers/MLF_AppNote.pdf
April 2005
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SY89540U
Package Information
44-Pin MLF™ (MLF-44)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel
for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a
product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended
for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a
significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a
Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
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