MOTOROLA MC14LC5447P

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by MC14LC5447/D
SEMICONDUCTOR TECHNICAL DATA
Product Preview
P SUFFIX
PLASTIC DIP
CASE 648
16
1
The MC14LC5447 is a silicon gate HCMOS IC designed to demodulate Bell
202 and V.23 1200–baud FSK asynchronous data. The primary application for
DW SUFFIX
C.
this device is in products that will be used to receive and display the calling
N
16
SOG PACKAGE
I
number, or message waiting indicator sent to subscribers from participating
CASE 751G
R1,
central office facilities of the public switched network. The device also contains
O
a carrier detect circuit and ring detector which may be used to power up the
CT
U
device.
D
ORDERING INFORMATION
Applications for this device include adjunct boxes, answering machines, N
MC14LC5447P
Plastic DIP
O
feature phones, fax machines, and computer interface products.
C
I
MC14LC5447DW SOG Package
The MC14LC5447 offers the following performance features.
M
•
•
•
•
•
•
•
E
S
Ring Detector On–Chip
E
Ring Detect Output for MCU Interrupt
L
Power–Down Mode, Less than 1 µA
CA
S
Single Supply: + 3.5 to + 6.0 V
EEMHz, or 455 kHz
R
Pin Selectable Clock Frequencies: 3.68 MHz,
3.58
F
Two Stage Power–Up for Power Management
Y Control
B
Demodulates Bell 202 and V.23
D
E
IV
CH
BLOCK DIAGRAM
R
A
TIP
RING
1
2
–
BPF
+
DEMOD
VAG
14
15
RDI1
RDI2
4
RING
DETECT
CIRCUIT
PWRUP
13
OSCout
16
VDD
2
15
DOC
RDI1
3
14
DOR
RDI2
4
13
CDO
NC
5
12
RDO
RT
6
11
CLKSIN
PWRUP
7
10
OSCin
VSS
8
9
OSCout
NC = NO CONNECTION
DOC
CDO
RDO
INTERNAL
POWER UP
CLOCK
GEN
OSCin
1
VALID
DATA
DETECT
12
7
TI
RI
3
6
RT
DOR
PIN ASSIGNMENT
11
CLKSIN
10
16
9
8
VDD
VSS
NO CONNECT (5)
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
REV 0
7/96

Motorola, Inc.A
1996
MOTOROL
MC14LC5447
1
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND, except where noted)
Rating
DC Supply Voltage
Input Voltage, All Pins
DC Current Drain Per Pin
Symbol
Value
Unit
VDD
– 0.5 to + 6.0
V
Vin
– 0.5 to VDD + 0.5
V
I
± 10
mA
Power Dissipation
PD
20
mW
Operating Temperature Range
TA
0 to + 70
°C
Tstg
– 40 to + 150
°C
Storage Temperature Range
ELECTRICAL CHARACTERISTICS
This device contains circuitry to protect the
inputs against damage due to high static voltages or electric fields. However, it is advised that
normal precautions be taken to avoid applications of any voltage higher than maximum rated
voltages to this high impedance circuit. For
proper operation it is recommended that Vin and
Vout be constrained to the range VSS ≤ (Vin or
Vout) ≤ VDD.
Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage
level (e.g., either VSS or VDD).
R,
O
T
3.5
C
U
ND —
(All polarities referenced to VSS = 0 V, VDD = + 5 V ± 10%, unless otherwise noted, TA = 0 to + 70°C)
Parameter
Symbol
DC Supply Voltage
VDD
Supply Current (All Output Pins Unloaded) (See Figure 1)
RT = 0, PWRUP = 1, XTAL = 3.58 MHz
IDD
Supply Current (All Output Pins Unloaded) (See Figure 1)
PWRUP = 0, RT = Don’t Care, XTAL = 3.58 MHz
Standby Current (All Output Pins Unloaded) (See Figure 1)
RT = 1, PWRUP = 1
Input Voltage 0 Level (CLKSIN, OSCin)
EE
R
F
LE
A
SC
Y
Output Voltage High: VDD = 5 V (DOR, DOC,B
OSCout)
D
VE
I
H
C(DOR,
Output Voltage Low: VDD = 5 V
DOC, OSCout)
R
A
Input Voltage 1 Level (CLKSIN, OSCin)
S
.
Typ
Max
5
6
V
3
mA
—
4.0
5.5
mA
ISTBY
—
—
1
µA
VIL
—
—
VDD x 0.3
V
VIH
VDD x 0.7
—
—
V
—
—
V
VOH
2.4
4.95
VOL
—
—
IOL = 1.6 mA
IOL ≤ 1 µA
Input Leakage Current (OSCin, CLKSIN, PWRUP, RT, RDI1, and RDI2)
Unit
2.4
O
IIC
EM DD
IOH = 40 µA
IOH ≤ 1 µA
Min
C
IN
V
0.4
0.05
Iin
—
—
±1
µA
Output Voltage Low: VDD = 5 V (RDO, RT, CDO) IOL = 2.0 mA
VOL
—
—
0.4
V
Input Threshold Voltage Positive Going: VDD = 5 V
(RDI1, RT, PWRUP) (See Figure 3)
VT+
2.5
2.75
3.0
V
Input Threshold Voltage Negative Going: VDD = 5 V
(RDI1, RT, PWRUP) (See Figure 3)
VT–
2.0
2.3
2.6
V
RD2VT
1.0
1.1
1.2
V
Rin
—
250
—
kΩ
RDI2 Threshold
TIP/RING Input dc Resistance
ANALOG CHARACTERISTICS (VDD = + 5 V, TA = + 25°C, unless otherwise noted, 0 dBm = 0.7746 Vrms @ 600 Ω)
Characteristic
Input Sensitivity: TIP and RING (Pins 1 and 2, VDD = + 5 V)
Band–Pass Filter (BPF)
Frequency Response (Relative to 1700 Hz @ 0 dBm)
Carrier Detect Sensitivity
MC14LC5447
2
Min
Typ
Max
Unit
– 40
– 45
—
dBm
—
—
—
—
– 64
–4
–3
– 34
—
—
—
—
—
– 48
—
dB
60 Hz
500 Hz
2700 Hz
≥ 3300 Hz
dBm
MOTOROLA
SWITCHING CHARACTERISTICS (VDD = + 5 V, CL = 50 pF, TA = + 25°C)
Description
Symbol
Min
Typ
Max
Unit
OSC Startup (CLKSIN = 1; 3.579 MHz XTAL)
tDOSC
—
2
—
ms
Power–Up Low to FSK (Setup Time)
tSUPD
15
—
—
ms
Carrier Detect Acquisition Time
tDAQ
—
14
—
ms
End of Data to Carrier Detect High
tDCH
8
—
—
ms
TIMING DIAGRAM
0.5
SECOND
2 SECONDS
RI
RT
0101
1
THRESHOLD TO KEEP PART ON
RDO
tSUPD
PWRUP
0.5
SECOND
CH
R
A
ED
V
I
BY
EE
R
F
LE
A
SC
DATA
S
O
IC
EM
R,
O
CT
U
ND
C
IN
.
tDAQ
tDCH
CDO
DOC
COOKED DATA
DOR
tDOSC
OSC
MOTOROLA
RAW DATA
CLOCK 3.58 MHz, 3.6864 MHz, OR 455 kHz
MC14LC5447
3
VDD
TI
RI
RDI1
RDI2
NC
RT
PWRUP
PWRUP
1
1
0
RT
1
0
X
1
2
3
4
5
6
7
15
14
13
12
11
10
9
16
8
DOC
DOR
CDO
RDO
CLKSIN
OSCin
OSCout
OPEN
VDD
3.579 MHz
IDD
OSCin
1 µA MAX DISABLE
2.4 mA TYP ENABLE
6.2 mA TYP ENABLE
30
pF
Figure 1. IDD Test Circuit
PIN DESCRIPTIONS
TI
Tip Input (Pin 1)
This input pin is normally connected to the tip side of the L
twisted pair. It is internally biased to 1/2 supply voltage when
CA
S
the device is in the power–up mode. This pin must be E
dc isolated from the line.
RE
F
BY
D
VEto the ring side of the
I
This input is normally connected
twisted pair. It is internally biased
CH to 1/2 supply voltage when
R
the device is in the power–up
A mode. This pin must be dc isoRI
Ring Input (Pin 2)
lated from the line.
RDI1
Ring Detect Input 1 (Pin 3)
This input is normally coupled to one of the twisted pair
wires through an attenuating network. It detects energy on
the line and enables the oscillator and precision ring detection circuitry.
RDI2
Ring Detect Input 2 (Pin 4)
This input to the precision ring detection circuit is normally
coupled to one of the twisted pair wires through an attenuating network. A valid ring signal as determined from this
input sends the RDO (Pin 12) to a logic 0.
RT
Ring Time (Pin 6)
An RC network may be connected to this pin. The RC time
constant is chosen to hold this pin voltage below 2.2 V between the peaks of the ringing signal. RT is an internal
power–up control and activates only the circuitry necessary
to determine if the incoming ring is valid.
PWRUP
Power Up (Pin 7)
A logic 0 on the PWRUP input causes the device to be in
the active mode ready to demodulate incoming data. A
MC14LC5447
4
0.1 µF
E
10 MΩ
R,
O
CT
U
ND
30
CpF.
N
I
logic 1 on this pin causes the device to be in the standby
mode, ifIthe
CORT input pin is at a logic 1. This pin may be conMby RDO and CDO for auto power–up operation. For
trolled
other
SE applications, this pin may be controlled externally.
VSS
Ground (Pin 8)
Ground return pin is typically connected to the system
ground.
OSCout
Oscillator Output (Pin 9)
This pin will have either a crystal or a ceramic resonator
tied to it with the other end connected to OSCin.
OSCin
Oscillator Input (Pin 10)
This pin will have either a crystal or a ceramic resonator
tied to it with the other end connected to OSCout. OSCin may
also be driven directly from an appropriate external source.
CLKSIN
Clock Select Input (Pin 11)
A logic 1 on this input configures the device to accept either a 3.579 MHz or 3.6864 MHz crystal. A logic 0 on this pin
configures the part to operate with a 455 kHz resonator.
For crystal and resonator specifications see Table 1.
RDO
Ring Detect Out (Pin 12)
This open–drain output goes low when a valid ringing
signal is detected. RDO remains low as long as the ringing
signal remains valid. This signal can be used for auto power–
up, when connected to Pin 7.
CDO
Carrier Detect Output (Pin 13)
When low, this open drain output indicates that a valid
carrier is present on the line. CDO remains low as long as
the carrier remains valid. An 8 ms hysteresis is built in to
allow for a momentary drop out of the carrier. CDO may be
used in the auto power–up configuration when connected to
PWRUP.
MOTOROLA
DOR
Data Out Raw (Pin 14)
The transmission level from the terminating C.O. will be
– 13.5 dBm ± 1.0. The expected worst case attenuation
through the loop is expected to be – 20 dB. The receiver
This pin presents the output of the demodulator whenever
therefore, should have a sensitivity of approximately
CDO is low. This data stream includes the alternate 1 and 0
– 34.5 dBm to handle the worst case installations.
pattern, and the 150 ms of marking, which precedes the
Additional information on CLASS services can be obtained
data. At all other times, DOR is held high.
from:
DOC
BELLCORE CUSTOMER SVS.
Data Out Cooked (Pin 15)
1–800–521–2673
201–699–5800 FOREIGN CALLS
This output presents the output of the demodulator when201–699–0936 FAX
ever CDO is low, and when an internal validation sequence
The document number is: TA–NWT–000030
has been successfully passed. The output does not include
Title: “Voice Band Data Transmission Interface Generic
the alternate 1 and 0 pattern. At all other times, DOC is held
Requirements”
high.
C.
N
Figure 7 is a conceptual design
how the MC14LC5447
, I ofwhich
VDD
can be implemented into a product
will retrieve the inR
O it to EIA–232 levels for transPositive Power Supply (Pin 16)
coming message and convert
T
mission to the serial
The digital supply pin, which is connected to the positive
UCport of a PC. With this message and
D
appropriate
software,
PC can be used to look up the
side of the power supply.
Nadditionaltheinformation
name and any
associated with the callO
IC been previously stored.
er that had
APPLICATIONS INFORMATION
Figure
EM 8 is a conceptual design of an adjunct unit in paralS
The MC14LC5447 has been designed to be one of the
lel with an existing phone. This arrangement gives the submain functional blocks in products targeted for the CLASS LE scriber CND service without having to replace existing
(Custom Local Area Signaling Service) market. CLASS isCaA
equipment.
Sconset of subscriber features now being presented to the
E
E
Table 1. Oscillator Specifications
sumer by the RBOCs (Regional Bell Operating Companies)
FR such as
and independent TELCOs. Among CLASS features,
Clock Select Pin 11 = 1
distinctive ringing and selective call forwarding,
BY the subscriber will also have available a service known
as Calling NumCrystal Mode
Parallel
EDwaiting.
ber Delivery (CND) and message
With these
V
Frequency
3.579 MHz or 3.6864 MHz
I
Rf
10 MΩ
services, a subscriber will haveH
ability to display at a miniCthethe
C1 and C2
30 pF
R
mum, a message containing
phone number of the calling
A
party, the date, and the time. A message containing only this
Source:
information is known as a single format message, as shown
OSCin
OSCout
Fox Electronics
in Figure 9. An extended message, known as multiple format
5570 Enterprise Pkwy.
message, can contain additional information as shown in
Ft. Myers, FL 33905
Figure 10.
RF
Tel. 813–693–0099
The interface should be arranged to allow simplex data
transmission from the terminating central office, to the CPE
Clock Select Pin 11 = 0
C1
C2
(Customer Premises Equipment), only when the CPE is in an
Resonator
#CSB455J
on–hook state. The data will be transmitted in the silent periFrequency
455 kHz ± 0.5%
od between the first and second power ring after a voice path
Rf
1.0 MΩ
has been established.
C1 and C2
100 pF
The data signaling interface should conform to Bell 202,
Source:
which is described as follows:
Murata Manufacturing Co. Ltd.
•
•
•
•
•
Analog, phase coherent, frequency shift keying
Logical 1 (Mark) = 1200 ± 12 Hz
Logical 0 (Space) = 2200 ± 22 Hz
Transmission rate = 1200 bps
Application of data = serial, binary, asynchronous
MOTOROLA
2200 Lake Park Dr.
Smyma, GA 30080
Tel. 404–436–1300
NOTE: Motorola cannot recommend one supplier over another
and in no way suggests that this is a complete listing.
MC14LC5447
5
3.5
The circuit in Figure 2 illustrates in greater detail the relationship between Pins 3, 4, 6, and 7.
The external component values shown in Figure 2 are the
same as those shown in Figures 7 and 8. When VDD is
applied to the circuit in these two figures, the RC network will
charge cap C1 to VDD holding RT (Pin 6) off. If the PWRUP
(Pin 7) is also held at VDD, the MC14LC5447 will be in a
power–down mode, and will consume 1 µA of supply current
(max).
The resistor network (R2 – R4) attenuates the incoming
power ring applied to the top of R2. The values given have
been chosen to provide a sufficient voltage at RDI1 (Pin 3) to
turn on the Schmitt–trigger input with approximately a
40 Vrms or greater power ring input from tip and ring. When
VT+ of the Schmitt is exceeded, Q1 will be driven to saturation discharging cap C1 on RT. This will initialize a partial
power–up, with only the portions of the part involved with the
ring signal analysis enabled, including RDI2 (Pin 4). At this
time the MC14LC5447 power consumption is increased to
approximately 2.4 mA (typ).
EXTERNAL
COMPONENTS
INTERNAL
COMPONENTS
7
PWRUP
R1
270 kΩ
VDD
C1
0.2 µF
TO
BRIDGE
470 kΩ
R2
6
CQ1H
R
A
RT
ED
V
I
BY
EE
R
F
3
RDI1
INTERNAL
POWER–
UP
4
R4
15 kΩ
RDI2
RING
ANALYSIS
CIRCUIT
TO RDO
PIN
Vref
1.2 V
Figure 2.
The value of R1 and C1 must be chosen to hold the RT pin
voltage below the VT+ of the RT Schmitt between the individual cycles of the power ring. The values shown will work for
ring frequencies of 15.3 Hz (min).
With RDI2 now enabled, a portion of the power ring above
1.2 V is fed to the ring analysis circuit. This circuit is a digital
integrator which looks at the duty cycle of the incoming signal. When the input to RDI2 is above 1.2 V, the integrator is
counting up at an 800 Hz rate. When the input to RDI2 falls
below 1.2 V, the integrator counts down at a 400 Hz rate.
MC14LC5447
6
3.0
VT–
2.75
2.5
2.25
2.0
1.75
1.5
1.25
1.0
2.5
C.
N
I
4.5
5.0
5.5
6.0
6.5
,
R
V
DD
TO
Figure 3.C
VDD versus VT+ and VT–
DU
N
A ring is qualified when an internal count of binary 48 is
O
reached.
ICThe ring is disqualified when the count drops to a
M32. The number of ring cycles required to qualify the
binary
SE will depend on the amplitude of the voltage presented
signal
3.0
3.5
4.0
LE to RDI2. The shortest amount of time needed to do the qualiA
fication is approximately 60 ms. The shortest amount of time
SC
PWRUP
LOGIC
R3
18 kΩ
VT+
3.25
VT
DESIGN INFORMATION
required for dequalification will be approximately 40 ms.
Once the ring signal is qualified, the RDO pin will be sent
low. This can be fed back to PWRUP as shown in Figure 7, or
with a pull–up resistor, can be used as an interrupt to an
MCU as shown in Figure 8. In either case, once the PWRUP
pin is below VT–, the part will be fully powered up, and ready
to receive FSK. During this mode, the device current will increase to approximately 6.2 mA (typ). The state of the RT pin
is now a “don’t care” as far as the part is concerned. Normally, however, this pin will be allowed to return to VDD.
After the FSK message has been received, the PWRUP
pin can be allowed to return to VDD and the part will return to
the standby mode, consuming less than 1 µA of supply current. The part is now ready to repeat the same sequence for
the next incoming message.
TYPICAL DEMODULATOR PERFORMANCE
The following describes the performance of the
MC14LC5447 demodulator in the presence of noise over a
simulated Bell 3002 telephone loop.
The Bell 3002 loop represents a worst case local telephone loop in North America. The characteristics of this loop,
which affect performance, are high frequency attenuation
and Envelope Delay Distortion (EDD) or group delay.
The minimum receiver sensitivity of the MC14LC5447 under these conditions is typically – 45 dBm.
The MC14LC5447 achieves a Bit Error Rate (BER) of 1 ×
10–5 at a Signal–to–Noise Ratio (SNR) of 15 dB in V.23 operation and at an SNR of 18 dB in Bell 202 operation (see
Figures 4 and 5).
All measurements in dBm are referenced to 600 Ω: 0 dBm
= 0.7746 Vrms.
All measurements were taken using the MC145460EVK
evaluation board.
MOTOROLA
Electronic file not available for
this figure. To view the complete
document, order it from the
Literature Center.
Electronic file not available for
this figure. To view the complete
document, order it from the
Literature Center.
C
IN
Figure 4. MC14LC5447 V.23 Operation
(Typical BER vs SNR)
500 pF
TIP
10 kΩ
500 pF
RING
ED
V
10 kΩ
HI
C
AR
BY
VDD
EE
R
F
E
LVDD
A
SC
TI
1
S
.
R,
O
CT
Figure 5. MC14LC5447
Bell 202 Operation
U
(Typical BER vs SNR)
D
N
O
IC
M
E
0.1 µf
16
15
DOC
RI
2
14
DOR
RDI1
3
13
CDO
RDI2
4
12
RDO
N/C
5
11
CLKSIN
RT
6
10
OSCin
PWRUP
7
9
OSCout
8
VDD
3.579 MHz
30 pF
10 MΩ
30 pF
Figure 6. Full–Time Power without Ring Detect
MOTOROLA
MC14LC5447
7
APPLICATION CIRCUIT
500 pF
C1
MC14LC5447
VDD
10 kΩ
C3
0.1 µF
TIP
TI 1
1N4004x4
PROTECTION
NETWORK
RING
500 pF
C2
C4
14 DOR
13 CDO
12 RDO
11 CLKSIN
RT 6
10 OSCin
9 OSCout
10 kΩ
PWRUP 7
NOTE: C1 and C2 ≥ 0.2 µF required for line
isolation. C1 through C4 are 250 V min,
non–polarized.
8
TO PC
VDD
C
IN
. MC145407
R,
O
CT
U
+5 V
10 MΩ
30 pF D
30 pF
N
O
4.7
ICMΩ
M
E
18 kΩ
15 kΩ
TO PC
15 DOC
NC 5
470 kΩ
RI
16
RI 2
RDI1 3
RDI2 4
3.579 MHz
+5 V
270 kΩ
S
E
0.33 µF
L
0.2 µF
A
SC
E
E
Figure 7. Partial Implementation
of PC Interface to Tip and Ring
FR
Y
B0.5
SECOND RING
FIRST RING
0.5
D
SEC
SEC
2 SECONDS E
2 SECONDS
V
I
CH
0101 1
DATA
R
A
RT
NOTE 1
RDO
NOTE 3
PWRUP
NOTE 2
CDO
NOTE 1
DATA
DOR
DOC
OSC
DATA
3.58 MHz, 3.6864, OR 455 kHz
NOTES:
1. Wired ‘OR’ RDO with CDO.
2. Overlap of RDO edge with CDO edge to ensure part stays in PWRUP determined by RC time constant on RDO, PWRUP,
and CDO pin.
3. Part reverts to PWR ON, on rising edge of RDO since there is no CDO.
Timing Diagram for Figure 7
MC14LC5447
8
MOTOROLA
APPLICATION CIRCUIT
0.1 µF
C3
500 pF
C4
2 kΩ
TIP
16
TI 1
10 kΩ
C1
RI 2
RDI1 3
0.2 µF
RDI2 4
15 DOC
14 DOR
13 CDO
MC14LC5447
500 pF
NC 5
12 RDO
11 CLKSIN
10 OSCin
9 OSCout
RT 6
C2
PWRUP 7
RING
0.2 µF
470 kΩ
TO PHONE
2 kΩ
VDD
10 kΩ
VDD
270 kΩ
18 kΩ
15 kΩ
0.2 µF
EE
R
F
LE
A
SC
S
O
IC
EM
C
IN
8
VDD
.
INTERRUPT
R,
O
CT
U
ND
MCU
3.68 MHz
DISPLAY
Figure 8. Adjunct
Y Box Concept for Calling Number Display
FIRST RING
2 SECONDS
RI
CH
R
A
D
E0.5
V
I SEC
B
0.5
SEC
0101
1
SECOND RING
2 SECONDS
DATA
RT
RDO
PWRUP
INTERRUPT
FOR MCU
NOTE 1
NOTE 1
NOTE 2
CDO
DOC
DOR
OSC
DATA
DATA
3.58 MHz, 3.6864 MHz, OR 455 kHz
NOTES:
1. MCU must assert PWRUP to MC14LC5447.
2. No data detected, MCU powers down the MC14LC5447.
Timing Diagram for Figure 8
MOTOROLA
MC14LC5447
9
2s
4s
0.5
s
0.5
s
STD RING/20 Hz
DATA WORD
COUNT
MESSAGE
TYPE WORD
30 BYTES/600 Hz
MARKS
01010101
70
250 ms
ms
8
8
BITS BITS
2s
STD RING/20 Hz
CH
R
A
ED
V
I
2s
495
ms
CHECK
SUM
DATA
175 ms
144 BITS MAX
8
BITS
R,
O
MO – DAY – HOUR – MINUTE – NUMBER
CT
U
04 – 15 – 16 – 21 –
512 555 1212
ND
O
IC
Figure 9. Single Message
Format
M
SE
E
AL
C
ES
4s
0.5REVARIABLE
0.5
Fs
s
BY
250 ms
70
ms
30 BYTES/600 Hz
MARKS
01010101
C
IN
.
2s
VARIABLE
DATA
DATA
CHECK
SUM
8
8
8
8
BITS BITS BITS BITS
MESSAGE
TYPE WORD
DATA
PARAMETER
TYPE WORD
MESSAGE
LENGTH WORD
8
8
BITS BITS
144 DATA BITS
MO – DAY – HOUR – MINUTE – NUMBER
CALLING NAME
04 – 15 – 16 –
PARAMETER
LENGTH WORD
8
BITS
PARAMETER
TYPE WORD
21
–
512 555 1212
PARAMETER
LENGTH WORD
Figure 10. Multiple Message Format
MC14LC5447
10
MOTOROLA
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC DIP
CASE 648–08
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
T A
M
O
IC
EM
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
R,
O
CT
U
ND
C
IN
.
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
S
E
L
DW
ASUFFIX
C
SOG
S PACKAGE
–A–
16
BY
ED
V
I
9
CH
R
A
1
–B–
EE CASE 751G–02
R
F
8X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
P
0.010 (0.25)
M
B
M
8
16X
J
D
0.010 (0.25)
M
T A
S
B
S
F
R X 45 _
C
–T–
14X
MOTOROLA
G
K
SEATING
PLANE
M
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
MC14LC5447
11
CH
R
A
ED
V
I
BY
EE
R
F
LE
A
SC
S
O
IC
EM
R,
O
CT
U
ND
C
IN
.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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I51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MC14LC5447
12
◊
*MC14LC5447/D*
MC14LC5447/D
MOTOROLA