MICROCHIP TC1410N

TC1410/TC1410N
0.5A High-Speed MOSFET Drivers
Features
General Description
• Latch-Up Protected: Withstands 500 mA Reverse
Current
• Input Withstands Negative Inputs Up to 5V
• Electrostatic Discharge (ESD) Protected: 2.0 kV
(HBM) and 400V (MM)
• High Peak Output Current: 0.5A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 500 pF in 25 ns
• Short Delay Time: 30 ns typical
• Consistent Delay Times With Changes in Supply
Voltage
• Matched Delay Times
• Low Supply Current
- With Logic ‘1’ Input: 500 µA
- With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 16Ω
• Available in Space-Saving 8-pin MSOP Package
• Pinout – same as TC1411/TC1412/TC1413
The TC1410/TC1410N are 0.5A CMOS buffers/drivers.
They do not latch up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
of either polarity being forced back into their output. All
terminals are fully protected against Electrostatic
Discharge (ESD) up to 2.0 kV (HBM) and 400V (MM).
Switch Mode Power Supplies
Line Drivers
Pulse Transformer Drive
Relay Driver
8-Pin MSOP/PDIP/SOIC
VDD 1
IN 2
NC 3
GND 4
2
8
7
6
5
6,7
Inverting
VDD
OUT
OUT
GND
VDD 1
IN 2
TC1410N
•
•
•
•
Package Type
TC1410
Applications
As MOSFET drivers, the TC1410/TC1410N can easily
charge a 500 pF gate capacitance in 25 ns with
matched rise and fall times. To ensure the MOSFET’s
intended state will not be affected even by large
transients, low enough impedance in both the ‘ON’ and
‘OFF’ states are provided. The leading and trailing
edge propagation delay times are also matched to
allow driving short-duration inputs with greater
accuracy.
NC 3
GND 4
2
8 VDD
7 OUT
6 OUT
5 GND
6,7
Non-Inverting
NC = No Connection
Note:
For proper operation, duplicate pins
must be connected together.
 2001-2013 Microchip Technology Inc.
DS20001389E-page 1
TC1410/TC1410N
Functional Block Diagram
TC1410
VDD
Inverting
Output
300 mV
Output
Non-Inverting
Output
Input
Effective
Input C = 10 pF
4.7V
TC1410N
GND
DS20001389E-page 2
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
1.0
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage ..................................................... +20V
Input Voltage ...................... VDD + 0.3V to GND – 5.0V
Power Dissipation (TA ≤ 70°C)
MSOP .......................................................... 340 mW
PDIP ............................................................ 730 mW
SOIC............................................................ 470 mW
Storage Temperature Range .............. -65°C to +150°C
Maximum Junction Temperature ...................... +150°C
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over the operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters
Sym
Min
Typ
Max
Units
Logic ‘1’, High Input Voltage
VIH
2.0
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
-1
—
1
µA
-10
—
10
Conditions
Input
0V ≤ VIN ≤ VDD, TA = +25°C
-40°C ≤ TA ≤ +85°C
Output
High Output Voltage
VOH
VDD – 0.025
—
—
V
DC Test
Low Output Voltage
VOL
—
—
0.025
V
DC Test
Output Resistance
RO
—
16
22
Ω
VDD = 16V, IO = 10 mA,
TA = +25°C
—
20
28
0°C ≤ TA ≤ +70°C
—
20
28
-40°C ≤ TA ≤ +85°C
Peak Output Current
IPK
—
0.5
—
A
VDD = 16V
Latch-Up Protection
Withstand Reverse Current
IREV
—
0.5
—
A
Duty cycle ≤ 2%, t ≤ 300 µs,
VDD = 16V
tR
—
25
35
ns
TA = +25°C
Switching Time (Note 1)
Rise Time
Fall Time
tF
Delay Time
Delay Time
Note 1:
tD1
tD2
—
27
40
0°C ≤ TA ≤ +70°C
—
29
40
-40°C ≤ TA ≤ +85°C, Figure 4-1
—
25
35
—
27
40
—
29
40
—
30
40
ns
TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
ns
TA = +25°C
—
33
45
0°C ≤ TA ≤ +70°C
—
35
45
-40°C ≤ TA ≤ +85°C, Figure 4-1
—
30
40
—
33
45
0°C ≤ TA ≤ +70°C
—
35
45
-40°C ≤ TA ≤ +85°C, Figure 4-1
ns
TA = +25°C
Switching times ensured by design.
 2001-2013 Microchip Technology Inc.
DS20001389E-page 3
TC1410/TC1410N
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, over the operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters
Sym
Min
Typ
Max
Units
IS
—
0.5
1.0
mA
—
0.1
0.15
Conditions
Power Supply
Power Supply Current
Note 1:
VIN = 3V, VDD = 16V
VIN = 0V
Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range (C)
TA
0
—
+70
ºC
Specified Temperature Range (E)
TA
-40
—
+85
ºC
Maximum Junction Temperature
TJ
—
—
+150
ºC
Storage Temperature Range
TA
-65
—
+150
ºC
Thermal Resistance, 8L-MSOP
θJA
—
211
—
ºC/W
Thermal Resistance, 8L-PDIP
θJA
—
89.3
—
ºC/W
Thermal Resistance, 8L-SOIC
θJA
—
149.5
—
ºC/W
Conditions
Temperature Ranges
Package Thermal Resistances
DS20001389E-page 4
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
500
500
TA = +25°C
400
VIN = 3V
ISUPPLY (μA)
ISUPPLY (μA)
400
300
200
100
0
VSUPPLY = 16V
VIN = 3V
6
8
10
12
14
200
100
VIN = 0V
4
300
0
16
VIN = 0V
-40
-20
0
VDD (V)
FIGURE 2-1:
Quiescent Supply Current
vs. Supply Voltage.
1.6
FIGURE 2-4:
vs. Temperature.
1.6
TA = +25°C
1.4
1.3
VIL
1.2
60
80
Quiescent Supply Current
VSUPPLY = 16V
4
VIH
1.4
1.3
VIL
1.2
6
8
10
12
14
1.1
16
-40
-20
VDD (V)
FIGURE 2-2:
Voltage.
0
20
40
60
80
TEMPERATURE (°C)
Input Threshold vs. Supply
FIGURE 2-5:
Temperature.
50
Input Threshold vs.
50
TA = +85°C
40
RDS-ON (Ohms)
40
RDS-ON (Ohms)
40
1.5
VIH
VTHRESHOLD (V)
VTHRESHOLD (V)
1.5
1.1
20
TEMPERATURE (°C)
TA = +25°C
30
20
TA = -40°C
10
30
20
TA = +85°C
TA = +25°C
10
TA = -40°C
0
0
4
6
8
10
12
VDD (V)
FIGURE 2-3:
High-State Output
Resistance vs. Supply Voltage.
 2001-2013 Microchip Technology Inc.
14
16
4
6
8
10
12
14
16
VDD (V)
FIGURE 2-6:
Low-State Output
Resistance vs. Supply Voltage.
DS20001389E-page 5
TC1410/TC1410N
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
100
100
CLOAD = 500 pF
80
60
tFALL (nsec)
tRISE (nsec)
80
TA = +85°C
TA = +25°C
40
20
0
4
6
8
100
10
VDD (V)
60
TA = +85°C
40
TA = +25°C
20
TA = -40°C
FIGURE 2-7:
Voltage.
TA = -40°C
12
14
0
16
4
6
8
FIGURE 2-10:
Voltage.
Rise Time vs. Supply
100
CLOAD = 500 pF
TA = +85°C
tD2 (nsec)
60
TA = +25°C
40
14
16
CLOAD = 500 pF
60
TA = +85°C
TA = +25°C
40
TA = -40°C
20
4
6
8
FIGURE 2-8:
Supply Voltage.
10
VDD (V)
12
14
4
TA = +25°C
VDD = 16V
Propagation Delays (nsec)
tFALL
40
20
500
1000
1500
2000
2500
3000
8
3500
DS20001389E-page 6
Rise and Fall Times vs.
12
14
16
Propagation Delay vs.
tD2
41
tD1
37
33
29
25
0
500
1000
CLOAD (pF)
FIGURE 2-9:
Capacitive Load.
10
VDD (V)
TA = +25°C
VDD = 16V
tRISE
60
0
6
FIGURE 2-11:
Supply Voltage.
Propagation Delay vs.
80
0
0
16
45
100
tRISE, tFALL (nsec)
12
Fall Time vs. Supply
TA = -40°C
20
0
10
VDD (V)
80
80
tD1 (nsec)
CLOAD = 500 pF
1500
2000
2500
3000
3500
CLOAD (pF)
FIGURE 2-12:
Capacitive Load.
Propagation Delays vs.
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin
No.
TC1410
MSOP, PDIP, SOIC
TC1410N
MSOP, PDIP, SOIC
1
VDD
VDD
2
IN
IN
3.1
Supply input, 4.5V to 16V
Control input
3
NC
NC
4
GND
GND
Ground
5
GND
GND
Ground
6
OUT
OUT
CMOS push-pull output, common to pin 7
7
OUT
OUT
CMOS push-pull output, common to pin 6
8
VDD
VDD
Supply input, 4.5V to 16V
Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 16V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor is
chosen based on the capacitive load that is being
driven. A value of 1.0 µF is suggested.
3.2
Description
Control Input (IN)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input also has
300 mV of hysteresis between the high and low
thresholds that prevents output glitching even when the
rise and fall time of the input signal is very slow.
 2001-2013 Microchip Technology Inc.
No connection
3.3
CMOS Push-Pull Output
(OUT, OUT)
The MOSFET driver output is a low-impedance,
CMOS, push-pull style output, capable of driving a
capacitive load with 0.5 A peak currents.
3.4
Ground (GND)
The ground pins are the return path for the bias current
and for the high peak currents that discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
DS20001389E-page 7
TC1410/TC1410N
4.0
APPLICATIONS INFORMATION
+5V
90%
Input
VDD = 16V
0V
1.0 µF
0.1 µF
1, 8
Input
10%
tD1
tD2
tF
VDD
tR
90%
90%
Output
2
6, 7
Output
10%
10%
0V
Inverting Driver
CL = 500 pF
TC1410
TC1410
TC1410N
+5V
90%
Input
4, 5
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 ns
0V
VDD
10%
tD1 90%
Output
0V
90%
tR
10%
tF
tD2
10%
Non-Inverting Driver
TC1410N
FIGURE 4-1:
DS20001389E-page 8
Switching Time Test Circuit.
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
Example
TC1410
e3 256
CPA^^
1316
OR
TC1410
CPA256
1316
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
RoHS Compliant JEDEC designator for Matte Tin (Sn)
This package is RoHS Compliant. The RoHS Compliant JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over
to the next line, thus limiting the number of available characters for customer-specific
information.
 2001-2013 Microchip Technology Inc.
DS20001389E-page 9
TC1410/TC1410N
8-Lead SOIC (3.90 mm)
NNN
Example
TC1410C
OA^^
e3 1316
256
OR
TC1410
COA1316
256
8-Lead MSOP (3x3 mm)
Example
1410E
316256
DS20001389E-page 10
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
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 2001-2013 Microchip Technology Inc.
DS20001389E-page 11
TC1410/TC1410N
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001389E-page 12
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2001-2013 Microchip Technology Inc.
DS20001389E-page 13
TC1410/TC1410N
DS20001389E-page 14
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
8$
1RWH
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2001-2013 Microchip Technology Inc.
DS20001389E-page 15
TC1410/TC1410N
UA
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001389E-page 16
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
8-Lead Plastic Micro Small Outline Package (UA) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2001-2013 Microchip Technology Inc.
DS20001389E-page 17
TC1410/TC1410N
NOTES:
DS20001389E-page 18
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
APPENDIX A:
REVISION HISTORY
Revision E (June 2013)
The following is the list of modifications:
• Updated the values for Electrostatic Discharge in
the Features and General Description columns.
• Updated the Pin Description table in Section 3.0,
Pin Descriptions.
• Updated package marking information and
drawings in Section 5.0, Packaging Information.
• Minor grammatical and spelling corrections.
 2001-2013 Microchip Technology Inc.
DS20001389E-page 19
TC1410/TC1410N
NOTES:
DS20001389E-page 20
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Package
Examples:
a)
b)
Device:
TC1410: 0.5A Single MOSFET Driver, Inverting
TC1410N: 0.5A Single MOSFET Driver, Non-Inverting
Temperature Range:
C
E
Package:
OA
= Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
UA
= Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
c)
=
=
0°C to +70°C
-40°C to +85°C
TC1410COA:
0.5A Single MOSFET
driver, SOIC package,
0°C to +70°C.
TC1410CPA:
0.5A Single MOSFET
driver, PDIP package,
0°C to +70°C.
TC1410EUA713: Tape and Reel,
0.5A Single MOSFET
driver, MSOP package,
-40°C to +85°C.
a)
TC1410NCPA:
b)
TC1410NEPA:
c)
TC1410NEUA:
* MSOP package is only available in E-Temp.
 2001-2013 Microchip Technology Inc.
0.5A Single MOSFET
driver, PDIP package,
0°C to +70°C.
0.5A Single MOSFET
driver, PDIP package,
-40°C to +85°C.
0.5A Single MOSFET
driver, MSOP package,
-40°C to +85°C.
DS20001389E-page 21
TC1410/TC1410N
NOTES:
DS20001389E-page 22
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2001-2013 Microchip Technology Inc.
DS20001389E-page 23
TC1410/TC1410N
NOTES:
DS20001389E-page 24
 2001-2013 Microchip Technology Inc.
TC1410/TC1410N
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-243-0
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2001-2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20001389E-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
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Tel: 678-957-9614
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Tel: 774-760-0087
Fax: 774-760-0088
Chicago
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Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
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Tel: 216-447-0464
Fax: 216-447-0643
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Tel: 972-818-7423
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Tel: 248-538-2250
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Tel: 949-462-9523
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Tel: 408-961-6444
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Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
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Netherlands - Drunen
Tel: 31-416-690399
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Korea - Daegu
Tel: 82-53-744-4301
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Spain - Madrid
Tel: 34-91-708-08-90
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China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
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Tel: 86-25-8473-2460
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Tel: 60-4-227-8870
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Tel: 86-532-8502-7355
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Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS20001389E-page 26
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/29/12
 2001-2013 Microchip Technology Inc.