USBULC6-2F3 IPAD™ Dual ultra low capacitance protection for high speed USB Main application ■ Hi-Speed USB port in wireless handsets (up to 480 Mb/s according to USB 2.0 High Speed Specification) Features ■ Ultra low diode capacitance (1.2 pF max) ■ Two data lines (D+ and D-) protected against 15 kV ESD ■ Breakdown Voltage VBR = 6.0 V min ■ Flip-Chip 400 µm pitch, lead-free ■ Very low leakage current ■ Very small PCB area ■ RoHS compliant Flip-Chip (4 Bumps) Pin configuration (bump side) A B 1 2 Description The USBULC6-2F3 is a monolithic, application specific discrete device dedicated to ESD protection of high speed interfaces. Configuration A1 B1 Its ultra low line capacitance secures a high level of signal integrity without compromizing the protection of downstream sensitive chips against the most stringently characterized ESD strikes. Benefits ■ Minimized impact on rise and fall times for maximum data integrity ■ Low PCB space occupation ■ Higher reliability offered by monolithic integration Complies with the following standards: IEC 61000-4-2: A2 Note: B1 and B2 bumps must be grounded on the PCB together Order code 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015.7 25 kV (Human body model) December 2006 B2 Part Number Marking USBULC6-2F3 EH TM: IPAD is a trademark of STMicroelectronics Rev 1 1/8 www.st.com Characteristics 1 USBULC6-2F3 Characteristics Table 1. Absolute Maximum Ratings (Tamb = 25° C) Symbol Parameter Value Unit VPP ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge 15 8 kV PPP Peak pulse power dissipation (8/20 µs) 60 W Maximum junction temperature 125 °C Tj Top Operating temperature range -30 to + 85 °C Tstg Storage temperature range -55 to +150 °C Table 2. Electrical characteristics (Tamb = 25° C) Symbol Parameter VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage I IF Dynamic impedance IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop Slope = 1/Rd Test conditions Min. VBR IR = 1 mA IRM VRM = 3 V Rd Exponential wave form 8/20 µs, Ipp = 1 to 5 A αT Figure 1. IPP Typ. 6 IR = 1 mA Cline V IRM Rd Symbol VF VCL VBR VRM Max. Unit 9 V 100 nA Ω 1.6 5 VLINE = 0 V, VOSC = 30 mV, F = 1 MHz 1.2 Application diagram USB CONNECTOR Vbus Vbus DB2 A2 B1 A1 D- D+ D+ GND GND TO USB TRANSCEIVER 2/8 10-4/° pF C USBULC6-2F3 Figure 2. Characteristics Eye diagram, board only (according Figure 3. to USB High Speed) USBULC6-2F3 480 Mb/s Board 480 Mb/s Horiz: 350 ps/div Ver: 200 mV/div Horiz: 350 ps/div Ver: 200 mV/div Figure 4. Eye diagram, board with USBULC6-2F3 (according to USB 2.0 High Speed) ESD response to IEC 61000-4-2 (+15 kV air discharge) Figure 5. ESD response to IEC 61000-4-2 (-15 kV air discharge X: 50 ns/division Y: 20 V/division 1 Gs/s Figure 6. 1.2 X: 50 ns/division Y: 20 V/division 1 Gs/s Junction capacitance versus frequency (typical values) Figure 7. C(pF) 0.00 VOSC=30 mVRMS Tj=25 °C 1.1 Analog crosstalk measurements dB USBULC6 -2F3 1.0 0.9 -30.00 0.8 0.7 0.6 -60.00 0.5 0.4 0.3 -90.00 0.2 0.1 F(Hz) F (Hz) 0.0 1.E+07 1.E+08 1.E+09 -120.00 100.0k 1.0M 10.0M 100.0M 1.0G 3/8 Characteristics Figure 8. USBULC6-2F3 S21 (dB) attenuation measurements dB USBULC6-2F3 0.00 -2.00 -4.00 -6.00 -8.00 F (Hz) -10.00 100.0k Figure 9. 1.0M 10.0M 100.0M 1.0G Digital crosstalk 90% INPUT: 1 V/div 0 mV offset 2 ns/div 5 Gs/s Rise time = 1.647 ns 10% OUTPUT: 100 m V/div -300 mV offset 2 ns/div 5 Gs/s Vpkpk = 205 mV Figure 10. Relative variation of peak pulse power versus initial junction temperature 1.1 Figure 11. Peak pulse power versus exponential pulse duration PPP[T j initial] / PPP [T j initial=25°C] 1000 PPP(W) Tj initial = 25° C 1.0 0.9 0.8 0.7 0.6 100 0.5 0.4 0.3 0.2 0.1 tP(µs) Tj(°C) 10 0.0 0 4/8 25 50 75 100 125 150 1 10 100 USBULC6-2F3 Ordering information scheme Figure 12. Clamping voltage versus peak pulse current (typical values, exponential waveform) 100.0 Figure 13. Relative variation of leakage current versus junction temperature (typical values) IPP(A) IR [T j] / IR [T j=25°C] 1.E+02 VR =3 V 10.0 1.E+01 1.0 8/20 µs Tj initial =25° C VCL(V) T j(°C) 1.E+00 0.1 0 2 10 20 30 40 50 60 70 25 50 75 100 125 Ordering information scheme USB ULC 6 - 2 F3 USB protection Ultra Low Capacitance Breakdown voltage 6 = 6 VMIN Number of lines 2 = 2 lines Package F = Flip-Chip 3: Lead free, Pitch = 400 µm, Bump = 255 µm 5/8 Package information 3 USBULC6-2F3 Package information 400 µm ± 40 Figure 14. Flip-Chip dimensions 605 µm ± 55 0.97 mm ± 30µm 400 µm ± 40 0.92 mm ± 30 µm 255 µm ± 40 Figure 15. Foot print recommendations Figure 16. Marking Copper pad Diameter: 220µm recommended 260µm maximum Solder mask opening: 300µm minimum Solder stencil opening : 220µm recommended 6/8 Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) x x z y ww USBULC6-2F3 Ordering information Figure 17. Flip-Chip tape and reel specifications Dot identifying Pin A1 location 3.5 +/- 0.1 1.07 xxz yww 1.02 xxz yww xxz yww 8 +/- 0.3 0.71 1.75 +/- 0.1 Ø 1.5 +/- 0.1 4 +/- 0.1 4 +/- 0.1 User direction of unreeling All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: More information is available in the application notes: AN2348: “400 µm Flip-Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" 4 Ordering information 5 Part Number Marking Package Weight Base qty Delivery mode USBULC6-2F3 EH Flip-Chip 1.16 mg 5000 Tape and reel (7”) Revision history Date Revision 15-Dec-2006 1 Changes Initial release 7/8 USBULC6-2F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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