STPS8L30 Low drop power Schottky rectifier Main product characteristics IF(AV) 8A VRRM 30 V Tj 150° C VF(max) 0.40 V K K A A NC K Features and benefits ■ ■ ■ ■ NC DPAK STPS8L30B Low cost device with low drop forward voltage for less power dissipation and reduced heatsink Optimized conduction/reverse losses trade-off which leads to the highest yield in the application High power surface mount miniature package Avalanche capability specified IPAK STPS8L30H Order codes Description Single Schottky rectifier suited to Switched Mode Power Supplies and high frequency DC to DC converters. Part Numbers Marking STPS8L30B LS30 STPS8L30B-TR LS30 STPS8L30H STPS8L30H Packaged in DPAK and IPAK, this device is especially intended for use as a Rectifier at the secondary of 3.3 V SMPS or DC/DC units. wheeling and polarity protection applications. Table 1. Absolute Ratings (limiting values) Symbol Value Unit VRRM Repetitive peak reverse voltage 30 V IF(RMS) RMS forward voltage 7 A 8 A δ = 0.5 IF(AV) Average forward current Tc = 135° C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A IRRM Peak repetitive reverse current tp = 2 µs F = 1 kHz square 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 2 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 3000 W -65 to + 150 °C Tstg Tj dV/dt 1. Parameter Storage temperature range Maximum operating junction temperature (1) Critical rate of rise of reverse voltage 150 °C 10000 V/µs dPtot 1 --------------- > -------------------------- thermal runaway condition for a diode on its own heatsink dTj Rth ( j – a ) March 2006 Rev 4 1/7 www.st.com 7 Characteristics STPS8L30 1 Characteristics Table 2. Thermal Parameters Symbol Rth(j-c) Table 3. Parameter 2.5 °C/W Static Electrical Characteristics Parameter Tests conditions Tj = 25° C Reverse leakage current Typ Max. Unit 1 Tj = 100° C mA 15 40 0.49 IF = 8 A Tj = 125° C Forward voltage drop Min. VR = VRRM Tj = 25° C VF (1) Unit Junction to case Symbol IR (1) Value 0.35 0.40 V Tj = 25° C 0.63 IF = 16 A Tj = 125° C 0.448 0.57 1. Pulse test:* tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.23 x IF(AV) + 0.021 IF2(RMS) Figure 1. Average forward power dissipation versus average forward current Figure 2. PF(AV)(W) IF(AV)(A) 5.0 9 δ = 0.2 δ = 0.1 δ = 0.5 Rth(j-a)=Rth(j-c) 8 δ = 0.05 4.0 Average forward current versus ambient temperature (δ = 0.5) 7 6 δ=1 3.0 5 4 2.0 Rth(j-a)=70°C/W 3 T 2 1.0 IF(AV)(A) δ=tp/T 0.0 0 2/7 2 4 6 8 1 Tamb(°C) tp 0 10 0 25 50 75 100 125 150 STPS8L30 Characteristics Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. PARM(tp) PARM(1µs) Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25°C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) 50 Figure 6. IM(A) 75 100 125 150 Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-c)/Rth(j-c) 120 1.0 100 0.8 80 0.6 Tc=25°C δ = 0.5 60 Tc=75°C 0.4 40 δ = 0.2 Tc=125°C 20 t t(s) δ=0.5 Figure 7. 1E-2 tp(s) Single pulse 0 1E-3 T δ = 0.1 0.2 IM 1E-1 1E+0 Reverse leakage current versus reverse voltage applied (typical values) 0.0 1E-4 1E-3 Figure 8. IR(mA) δ=tp/T 1E-2 1E-1 tp 1E+0 Junction capacitance versus reverse voltage applied (typical values) C(pF) 3E+2 2000 Tj=150°C 1E+2 F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C 1000 1E+1 1E+0 500 1E-1 Tj=25°C 200 1E-2 VR(V) VR(V) 100 1E-3 0 5 10 15 20 25 30 1 10 40 3/7 Packaging information Figure 9. STPS8L30 Forward voltage drop versus forward current Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm) (DPAK) IFM(A) Rth(j-a)(°C/W) 100.0 100 Tj=150°C (typical values) 80 10.0 60 Tj=125°C (maximum values) 40 Tj=25°C (maximum values) 1.0 20 S(mm²) VFM(V) 0 0.1 0.0 2 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 2.0 2 4 6 8 10 12 14 16 18 20 Packaging information Table 4. DPAK dimensions DIMENSIONS REF. E A B2 C2 L2 D R H L4 A1 B G R C A2 Millimeters Inches Min. Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 0.60 MIN. L2 V2 4/7 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° STPS8L30 Packaging information Figure 11. DPAK footprint dimensions (in mm) 6.7 3 1.6 3 2.3 6.7 2.3 1.6 Table 5. IPAK Dimensions DIMENSIONS REF. Millimeters Min. A E C2 Typ. Inches Max. Min. Typ. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A3 0.70 1.30 0.027 0.051 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 0.95 0.037 B2 L2 B3 B5 D H L B3 L1 B A1 V1 B5 e G C A3 0.30 0.035 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.019 0.023 D 6 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 e G 2.28 4.40 H 0.090 4.60 0.173 16.10 0.181 0.634 L 9 9.40 0.354 0.370 L1 0.8 1.20 0.031 0.047 L2 0.80 V1 10° 1 0.031 0.039 10° In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information 3 4 6/7 STPS8L30 Ordering information Ordering type Marking STPS8L30B LS30 STPS8L30B-TR LS30 STPS8L30H STPS8L30H Package Weight DPAK 0.30 g IPAK 0.35 g Base qty Delivery mode 75 Tube 2500 Tape and reel 75 Tube Revision history Date Revision Description of Changes Jul-2002 2A 16-Apr-2005 3 IPAK package added. 01-Mar-2006 4 IPAK connector identifiers corrected on page 1. Ecopack statement added. Document reformatted to current standard. Previous update. STPS8L30 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7