TEMIC U834BS

U832BS / U834BS
3-GHz Frequency Divider
Description
U832BS and U834BS use TEMIC’s advanced bipolar
process. RF input can be driven differential as well as
single ended. Low current consumption makes the device
suitable for mobile application.
D U832BS divides by 2
Benefits
D U834BS divides by 4
D Extended operation time due to very low current
D Very low current consumption (typically 12 mA)
D Only three external components
D Low RF input level reduces radiation problems
consumption
D 3-GHz maximum operating frequency
D Supply voltage, typically 5 V
D ESD protection in accordance with MIL-STD. 883
method 3015 class 2
Block Diagram
V
S
8
2
6
2
2
RFi
RFo
(only U834BS)
3
2.3 k W
4
GND
1,5
2.3 kW
7
93 7783 e
N.C
Figure 1. Block diagram
Ordering Information
Extended Type Number
U832BS-FP
U834BS-FP
TELEFUNKEN Semiconductors
Rev. A2, 27-Jan-97
Package
SO8
SO8
Remarks
1 (6)
U832BS / U834BS
Pin Description
Pin
1
2
3
Symbol
NC
RFi
RFi
4
5
6
7
8
GND
NC
RFO
RFO
VS
Function
Not connected
RF input
RF input with internal
decoupling capacitor
Ground
Not connected
Output
Output
Supply voltage
NC
1
8
VS
RFi
2
7
RFO
RFi
3
6
RFO
GND
4
5
NC
94 7836 e
Absolute Maximum Ratings
Parameters
Supply voltage
Pin 8
Input voltage range
Pins 2 and 3
Junction temperature
Storage temperature range
Symbol
Value
Unit
VS
Vi
Tj
Tstg
6
0 to VS
125
– 40 to + 125
V
V
°C
°C
Symbol
VS
Tamb
Value
4.5 to 5.5
– 25 to + 85
Unit
V
°C
Symbol
RthJA
Value
175
Unit
K/W
Operating Range
Parameters
Supply voltage range
Ambient temperature range
Thermal Resistance
Junction ambient
2 (6)
Parameters
SO8
TELEFUNKEN Semiconductors
Rev. A2, 27-Jan-97
U832BS / U834BS
Electrical Characteristics
VS = 4.5 to 5.5 V, Tamb = 0 to + 70°C, referred to test circuit, unless otherwise specified.
Parameters
Supply current
Test Conditions / Pin
VS = 5 V
Pin 8
U832BS (: 2)
U834BS (: 4)
Pin 2
RS = 50 RS = 50 Pin 2
RF Input
Input sensitivity 1)
Input frequency range
RF output
Output level
VS = 5 V,
RL = 50 w
DC output level
1)
Pins 6 and 7
R6, R7 =
R6, R7 = 1 K
R
RL 10 k
VS = 5 V
High
Low
Symbol
IS
Min
RFi
ViRF
fimin
fimax
RFO
VRFo
Typ
Max
Unit
12
13
16
17.5
mA
mA
300
300
mV
MHz
80
3000
RFDCH
RFDCL
–8
–5
dBm
3.6
3.1
V
V
RMS-voltage calculated from the measured available power. RS = System resistance, RL = Load resistance
Output Stage
Input Sensitivity vs. Frequency
94 7882
1000
R7
7
Output
6
2.3 k 2.3 k
Vi ( mVRMS )
Rs = 50 , Vs = 5 V
Guaranteed operating range
Tamb = 0 to 70°C
100
80
R6
typical values for Tamb = 25 °C
10
0 300
1,5
n.c.
Figure 2.
TELEFUNKEN Semiconductors
Rev. A2, 27-Jan-97
94 7848
1000
2000
3000
4000
RFi ( MHz )
Figure 3.
3 (6)
U832BS / U834BS
Input Impedance S11
j
0.5j
2j
4050
0.2j
5j
3853
3655
3458
ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ
ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ
ÁÁ ÁÁ
3260
0
0.
2
0.
30635
1
2
1
5
2865
10
0
297
2667
495
2470
–0.2j
693
2273
2075
–5j
890
1878
1680
–0.5j
1087
1483
1285
–2j
93 7812 e
–j
Figure 4.
4 (6)
TELEFUNKEN Semiconductors
Rev. A2, 27-Jan-97
U832BS / U834BS
Application
Master-Slave-D-Flip-Flops (MS-D-FF’s) can be used for
frequency division by feeding back the inverted output to
the data input. Typical for this kind of dividers is a free–
running oscillation of the first divider stage. Here, the
input sensitivity of the circuit is minimal (see data sheet
page 5: input sensitivity vs. frequency). An oscillation
frequency of, e.g., 3.5 GHz (related to the input) will
result in an output the part number of frequency of
3.5 GHz: 4 = 875 MHz. To indicate this, TEMIC’s selfoscillating frequency dividers are ending with “S”
(U834BS-AFP). This oscillation is often used for the
quality control of ICs: the higher the frequency, the better
the performance. It occurs only if the offset voltage of the
input transistor pair is below a certain limit.
On the other hand, if this oscillation causes problems,
e.g., in frequency counters, an external offset may be
added. This can simply be done by connecting an ohmic
resistor from Pin 3 (RF input) to ground. Using a value of
R3 = 47 kW will stop self oscillation without degrading
the input sensitivity markly. Smaller values will decrease
the sensitivity especially at higher frequencies.
V Batt
1 nF
8
1
470 pF
100 pF
RF
input
2
U832BS
U834BS
3
100 pF
8
1
< 50 k Ω
R3
4
7
2
470 pF
6
3
5
4
U891BS
U893BSE
7
RF
output
6
5
13291
Figure 5.
Package Information
Package SO8
Dimensions in mm
5.2
4.8
5.00
4.85
3.7
1.4
0.25
0.10
0.4
1.27
6.15
5.85
3.81
8
0.2
3.8
5
technical drawings
according to DIN
specifications
13034
8
TELEFUNKEN Semiconductors
Rev. A2, 27-Jan-97
5
5 (6)
U832BS / U834BS
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
6 (6)
TELEFUNKEN Semiconductors
Rev. A2, 27-Jan-97