TI TLC5945PWP

TLC5945
PWP
www.ti.com
RHB
SLVS755 – MARCH 2007
16-CHANNEL LED DRIVER WITH DOT CORRECTION AND GRAYSCALE PWM CONTROL
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
16 Channels
12-bit (4096 Steps) Grayscale PWM Control
Dot Correction
– 6 bit (64 Steps)
Drive Capability (Constant-Current Sink)
– 0 mA to 80 mA
LED Power Supply Voltage up to 17 V
VCC = 3.0 V to 5.5 V
Serial Data Interface
30-MHz Data Transfer Rate
CMOS Level I/O
Error Information
– LOD: LED Open Detection
– TEF: Thermal Error Flag
VCC
SCLK
GND
Monocolor, Multicolor, Full-Color LED
Displays
LED Signboards
Display Back-lighting
•
•
DESCRIPTION
The TLC5945 is a 16-channel, constant-current sink,
LED driver. Each channel has an individually
adjustable 4096-step grayscale PWM brightness
control and a 64-step constant-current sink (dot
correction). The dot correction adjusts the brightness
variations between LED channels and other LED
drivers. Both grayscale control and dot correction are
accessible via a serial interface. A single external
resistor sets the maximum current value of all 16
channels.
The TLC5945 features two error information circuits.
The LED open detection (LOD) indicates a broken or
disconnected LED at an output terminal. The thermal
error flag (TEF) indicates an overtemperature
condition.
SIN
XLAT
CNT
MODE
1 0
IREF
Max. OUTn
Current
V REF
=1.24V
GS Register
MODE
1 0
11
0
GSCLK
BLANK
0
DC Register
0
5
GS Counter
CNT
0
Status
Information:
LOD,
TED,
DC DATA
191
96
12−Bit Grayscale
PWM Control
Constant-Current
Driver
OUT0
Constant-Current
Driver
OUT1
Constant-Current
Driver
OUT15
6−Bit Dot Correction
LED Open Detection
Input
Shift
Register
CNT
192
192
GS Register
23
96
95
1 0
96
12
DC Register
11
12−Bit Grayscale
PWM Control
6−Bit Dot Correction
6
MODE
LED Open Detection
96
Temperature
Error Flag
(TEF)
LED Open
Detection
(LOD)
CNT
Input
Shift
Register
GS Register
191
XERR
180
DC Register
95
12−Bit Grayscale
PWM Control
6−Bit Dot Correction
90
191
LED Open Detection
SOUT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TLC5945
www.ti.com
SLVS755 – MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
TA
PACKAGE (1)
PART NUMBER
–40°C to 85°C
28-pin HTSSOP PowerPAD™
TLC5945PWP
–40°C to 85°C
32-pin 5 mm x 5 mm QFN
TLC5945RHB
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI Web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS.
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
VI
Input voltage range (2)
IO
Output current (dc)
VI
Input voltage range
VO
Output voltage range
ESD rating
90 mA
–0.3 V to VCC +0.3 V
V(SOUT), V(XERR)
–0.3 V to VCC +0.3 V
V(OUT0) to V(OUT15)
HBM (JEDEC JESD22-A114, Human Body Model)
CDM (JEDEC JESD22-C101, Charged Device Model)
Storage temperature range
TA
Operating ambient temperature range
(1)
(2)
(3)
(4)
–0.3 V to 6 V
V(BLANK), V(SCLK), V(XLAT), V(MODE), V(SIN), V(GSCLK), V(IREF), V(TEST)
Tstg
Package thermal impedance (3)
2
VCC
–0.3 V to 18 V
2 kV
500 V
–55°C to 150°C
–40°C to 85°C
HTSSOP (PWP) (4)
31.58°C/W
QFN (RHB) (4)
35.9°C/W
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
The package thermal impedance is calculated in accordance with JESD 51-7.
With PowerPAD soldered on PCB with 2-oz. trace of copper. See TI application report SLMA002 for further information.
Submit Documentation Feedback
TLC5945
www.ti.com
SLVS755 – MARCH 2007
RECOMMENDED OPERATING CONDITIONS
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
DC Characteristics
VCC
Supply Voltage
VO
Voltage applied to output (OUT0 - OUT15)
3
VIH
High-level input voltage
VIL
Low-level input voltage
IOH
High-level output current
VCC = 5 V at SOUT
IOL
Low-level output current
VCC = 5 V at SOUT, XERR
IOLC
Constant output current
OUT0 to OUT15
TA
Operating free-air temperature range
5.5
V
17
V
0.8 VCC
VCC
V
GND
0.2 VCC
–40
V
–1
mA
1
mA
80
mA
85
°C
AC Characteristics
VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
f(SCLK)
Data shift clock
frequency
SCLK
30
MHz
f(GSCLK)
Grayscale clock
frequency
GSCLK
30
MHz
twh0/twl0
SCLK pulse duration
SCLK = H/L (See Figure 6)
16
ns
twh1/twl1
GSCLK pulse duration
GSCLK = H/L (See Figure 6)
16
ns
twh2
XLAT pulse duration
XLAT = H (See Figure 6)
20
ns
twh3
BLANK pulse duration
BLANK = H (See Figure 6)
20
ns
tsu0
SIN - SCLK↑ (See Figure 6)
tsu1
SCLK↓ - XLAT↑ (See Figure 6)
10
tsu2
MODE↑↓ - SCLK↑ (See Figure 6)
10
MODE↑↓ - XLAT↑ (See Figure 6)
10
tsu4
BLANK↓ - GSCLK↑ (See Figure 6)
10
tsu5
XLAT↑ - GSCLK↑ (See Figure 6)
30
th0
SCLK↑ - SIN (See Figure 6)
th1
XLAT↓ - SCLK↑ (See Figure 6)
10
tsu3
th2
Setup time
Hold Time
5
ns
3
SCLK↑ - MODE↑↓ (See Figure 6)
10
th3
XLAT↓ - MODE↑↓ (See Figure 6)
10
th4
GSCLK↑ - BLANK↑ (See Figure 6)
10
ns
DISSIPATION RATINGS
PACKAGE
POWER RATING
TA < 25°C
DERATING FACTOR
ABOVE TA = 25°C
POWER RATING
TA = 70°C
POWER RATING
TA = 85°C
28-pin HTSSOP with PowerPAD™
soldered (1)
3958 mW
31.67 mW/°C
2533 mW
2058 mW
28-pin HTSSOP
without PowerPAD™ soldered
2026 mW
16.21 mW/°C
1296 mW
1053 mW
32-pin QFN (1)
3482 mW
27.86 mW/°C
2228 mW
1811 mW
(1)
The PowerPAD is soldered to the PCB with a 2-oz. copper trace. See application report SLMA002 for further information.
Submit Documentation Feedback
3
TLC5945
www.ti.com
SLVS755 – MARCH 2007
ELECTRICAL CHARACTERISTICS
VCC = 3 V to 5.5 V, TA = -40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output
voltage
IOH = –1 mA, SOUT
VOL
Low-level output
voltage
IOL = 1 mA, SOUT
II
Input current
MIN
TYP
VCC –0.5
V
0.5
VI = VCC or GND; BLANK, TEST, GSCLK, SCLK, SIN, XLAT pin
–1
VI = GND; MODE pin
–1
Supply current
1
6
No data transfer, all output OFF, VO = 1 V, R(IREF) = 1.3 kΩ
5.2
12
Data transfer 30 MHz, all output ON, VO = 1 V, R(IREF) = 1.3 kΩ
16
25
Data transfer 30 MHz, all output ON, VO = 1 V, R(IREF) = 640 Ω
30
60
Constant output current All output ON, VO = 1 V, R(IREF) = 640 Ω
Leakage output current
54
61
All output OFF, VO = 15 V, R(IREF) = 640 Ω , OUT0 to OUT15
mA
69 mA
0.1
µA
All output ON, VO = 1 V, R(IREF) = 640 Ω, OUT0 to OUT15,
–20°C to 85°C (1)
±1
±4
All output ON, VO = 1 V, R(IREF) = 640 Ω, OUT0 to OUT15 (1)
±1
±8
All output ON, VO = 1 V, R(IREF) = 480 Ω, OUT0 to OUT15,
–20°C to 85°C (1)
±1
±6
All output ON, VO = 1 V, R(IREF) = 480 Ω, OUT0 to OUT15 (1)
±1
±8
∆IO(LC1)
Constant sink current
error
Device to device, averaged current from OUT0 to OUT15,
R(IREF) = 1920 Ω (20 mA) (2)
–2,
0.4
±4
%
∆IO(LC2)
Constant sink current
error
Device to device, averaged current from OUT0 to OUT15,
R(IREF) = 480 Ω (80 mA) (2)
–2.7,
2
±4
%
All output ON, VO = 1 V, R(IREF) = 640 Ω OUT0 to OUT15,
VCC = 3 V to 5.5 V (3)
±1
±4
All output ON, VO = 1 V, R(IREF) = 480 Ω OUT0 to OUT15,
VCC = 3 V to 5.5 V (3)
±1
±6
All output ON, VO = 1 V to 3 V, R(IREF) = 640 Ω, OUT0 to
OUT15 (4)
±2
±6
All output ON, VO = 1 V to 3 V, R(IREF) = 480 Ω, OUT0 to OUT15 (4)
±2
±8
%/
V
170
°C
0.3
0.4
V
1.24
1.28
V
∆IO(LC0)
∆IO(LC3)
Constant sink current
error
Line regulation
∆IO(LC4)
Load regulation
T(TEF)
Thermal error flag
threshold
V(LED)
LED open detection
threshold
V(IREF)
Reference voltage
output
(1)
(2)
(3)
(4)
(5)
4
0.9
Ilkg
µA
50
No data transfer, all output OFF, VO = 1 V, R(IREF) = 10 kΩ
IO(LC)
V
1
VI = VCC; MODE pin
ICC
MAX UNI
T
Junction temperature (5)
RI(REF) = 640 Ω
150
1.20
%
%/
V
The deviation of each output from the average of OUT0-15 constant current. It is calculated by Equation 1 in Table 1.
The deviation of average of OUT1-15 constant current from the ideal constant-current value. It is calculated by Equation 2 in Table 1.
The ideal current is calculated by Equation 3 in Table 1.
The line regulation is calculated by Equation 4 in Table 1.
The load regulation is calculated by Equation 5 in Table 1.
Not tested. Specified by design.
Submit Documentation Feedback
TLC5945
www.ti.com
SLVS755 – MARCH 2007
Table 1. Test Parameter Equations
D(%) =
D(%) =
I OUTn - I OUTavg _ 0 -15
´ 100
IOUTavg _ 0 -15
(1)
IOUTavg - I OUT (IDEAL )
´ 100
I OUT (IDEAL )
(2)
æ 1.24 V ö
÷÷
IOUT (IDEAL ) = 31.5 ´ çç
è R IREF ø
(IOUTn at VCC = 5.5 V ) - (I OUTn at VCC = 3.0 V ) 100
´
(I OUTn at VCC = 3.0 V )
2.5
(4)
(IOUTn at VOUTn = 3.0 V ) - (IOUTn at VOUTn = 1.0 V ) 100
´
(IOUTn at VOUTn = 1.0 V )
2 .0
(5)
D(% / V ) =
D(% / V ) =
(3)
SWITCHING CHARACTERISTICS
VCC = 3 V to 5.5 V, CL = 15 pF, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
tr0
tr1
tf0
tf1
Rise time
Fall time
tpd0
TYP
OUTn, VCC = 5 V, TA = 60°C, DCn = 3Fh
10
SOUT
10
OUTn - XERR (see Figure 6)
XLAT - IOUT (dot correction) (see Figure 6)
Output on-time error
touton– Tgsclk (see Figure 6), GSn = 01h
Submit Documentation Feedback
30
16
OUTn, VCC = 5 V, TA = 60°C, DCn = 3Fh
GSCLK - OUTn (see Figure 6)
tpd4
MAX
16
BLANK - OUTn (see Figure 6)
Propagation delay time
tpd3
ton_err
MIN
SCLK - SOUT (see Figure 6)
tpd1
tpd2
TEST CONDITIONS
SOUT
–12
–3
30
UNIT
ns
ns
30
ns
60
ns
1000
ns
60
ns
1000
ns
0
ns
5
TLC5945
www.ti.com
SLVS755 – MARCH 2007
DEVICE INFORMATION
RHB PACKAGE
(TOP VIEW)
GSCLK
SOUT
XERR
OUT15
OUT14
OUT13
OUT12
OUT11
23
22
21
20
19
18
17
TEST
25
16
OUT10
IREF
26
15
OUT9
VCC
27
14
OUT8
NC
28
13
NC
THERMAL
PAD
31
10
OUT6
XLAT
32
9
OUT5
OUT4 8
OUT7
BLANK
OUT3 7
NC
11
OUT2 6
12
30
OUT1 5
29
OUT0 4
NC
GND
MODE 3
VCC
IREF
TEST
GSCLK
SOUT
XERR
OUT15
OUT14
OUT13
OUT12
OUT11
OUT10
OUT9
OUT8
SCLK 1
Thermal
PAD
28
27
26
25
24
23
22
21
20
19
18
17
16
15
SIN 2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
BLANK
XLAT
SCLK
SIN
MODE
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
24
PWP PACKAGE
(TOP VIEW)
NC − No internal connection
TERMINAL FUNCTION
TERMINAL
6
I/O
DESCRIPTION
NAME
PWP
RHB
BLANK
2
31
I
Blank all outputs. When BLANK = H, all OUTn outputs are forced OFF. GS counter is also
reset. When BLANK = L, OUTn are controlled by grayscale PWM control.
GND
1
30
G
Ground
GSCLK
25
24
I
Reference clock for grayscale PWM control
IREF
27
26
I/O
NC
-
12, 13, 28, 29
OUT0
7
4
O
Constant-current output
OUT1
8
5
O
Constant-current output
OUT2
9
6
O
Constant-current output
OUT3
10
7
O
Constant-current output
OUT4
11
8
O
Constant-current output
OUT5
12
9
O
Constant-current output
OUT6
13
10
O
Constant-current output
OUT7
14
11
O
Constant-current output
OUT8
15
14
O
Constant-current output
OUT9
16
15
O
Constant-current output
OUT10
17
16
O
Constant-current output
OUT11
18
17
O
Constant-current output
OUT12
19
18
O
Constant-current output
OUT13
20
19
O
Constant-current output
OUT14
21
20
O
Constant-current output
OUT15
22
21
O
Constant-current output
SCLK
4
1
I
Serial data shift clock
SIN
5
2
I
Serial data input
Reference current terminal
No connection
Submit Documentation Feedback
TLC5945
www.ti.com
SLVS755 – MARCH 2007
DEVICE INFORMATION (continued)
TERMINAL FUNCTION (continued)
TERMINAL
NAME
I/O
DESCRIPTION
PWP
RHB
SOUT
24
23
O
Serial data output
TEST
26
25
I
Test pin: TEST must be connected to VCC.
VCC
28
27
I
Power supply voltage.
MODE
6
3
I
Input mode-change pin. When MODE = GND, the device is in GS mode. When MODE =
VCC, the device is in DC mode.
XERR
23
22
O
Error output. XERR is an open-drain terminal. XERR goes L when LOD or TEF is detected.
XLAT
3
32
I
Level triggered latch signal. When XLAT = high, the TLC5945 writes data from the input shift
register to either GS register (MODE = low) or DC register (MODE = high). When XLAT=low,
the data in the GS or DC registers is held constant and does not change.
Submit Documentation Feedback
7
TLC5945
www.ti.com
SLVS755 – MARCH 2007
PARAMETER MEASUREMENT INFORMATION
PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
Resistor values are equivalent resistance and not tested.
INPUT EQUIVALENT CIRCUIT
(BLANK, XLAT, SCLK, SIN, GSCLK, TEST)
OUTPUT EQUIVALENT CIRCUIT (SOUT)
VCC
23 400 INPUT
SOUT
23 GND
GND
INPUT EQUIVALENT CIRCUIT (IREF)
OUTPUT EQUIVALENT CIRCUIT (XERR)
VCC
_
400 INPUT
23 Amp
XERR
+
100 GND
GND
INPUT EQUIVALENT CIRCUIT (VCC)
OUTPUT EQUIVALENT CIRCUIT (OUT)
OUT
INPUT
GND
GND
INPUT EQUIVALENT CIRCUIT (MODE)
INPUT
GND
Figure 1. Input and Output Equivalent Circuits
8
Submit Documentation Feedback
TLC5945
www.ti.com
SLVS755 – MARCH 2007
PARAMETER MEASUREMENT INFORMATION (continued)
t who , t wIO, twh1, twl1, tsu0
t su4, th4
V(LED) = 4 V
SOUT
Test Point
RL = 51
CL = 15 pF
OUTn
Test Point
CL = 15 pF
IOLC, IOLC3, IOLC4
V(LED) = 1 V
OUT0
VCC = 0 V ~ 7 V
OUTn
+ _
OUT15
IREF
Test Point
RIREF = 640
Figure 2. Parameter Measurement Circuits
Submit Documentation Feedback
9
TLC5945
www.ti.com
SLVS755 – MARCH 2007
Typical Characteristics
REFERENCE RESISTOR
vs
OUTPUT CURRENT
POWER DISSIPATION RATE
vs
FREE-AIR TEMPERATURE
4000
10 k
TLC5945PWP
PowerPAD Soldered
R(IREF) − Reference Resistor −
1.92 k
1.28 k
1k
0.96 k
0.79 k
0.64 k
0.55 k
0.48 k
100
0
10
20
30
40
50
60
IO(LC) − Output Current − mA
70
Power Dissipation Rate − mW
TLC5945RHB
3.84 k
3000
2000
TLC5945PWP
PowerPAD Unsoldered
1000
0
−40
80
−20
0
Figure 3.
Figure 4.
OUTPUT CURRENT
vs
OUTPUT VOLTAGE
100
90
I O − Output Current − mA
80
70
IMAX = 60 mA
60
50
40
IMAX = 30 mA
30
20
10
0
IMAX = 5 mA
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.61.8 2 2.2 2.4 2.6 2.8 3
VO − Output Voltage − V
Figure 5.
10
20
40
60
TA − Free-Air Temperature − C
Submit Documentation Feedback
80
TLC5945
www.ti.com
SLVS755 – MARCH 2007
PRINCIPLES OF OPERATION
SERIAL INTERFACE
The TLC5945 has a flexible serial interface, which can be connected to microcontrollers or digital signal
processors in various ways. Only 3 pins are needed to input data into the device. The rising edge of SCLK
signal shifts the data from the SIN pin to the internal register. After all data is clocked in, a high-level pulse of
XLAT signal latches the serial data to the internal registers. The internal registers are level-triggered latches of
XLAT signal. All data are clocked in with the MSB first. The length of serial data is 96 bit or 192 bit, depending
on the programming mode. Grayscale data and dot correction data can be entered during a grayscale cycle.
Although new grayscale data can be clocked in during a grayscale cycle, the XLAT signal should only latch the
grayscale data at the end of the grayscale cycle. Latching in new grayscale data immediately overwrites the
existing grayscale data. Figure 6 shows the timing chart. More than two TLC5945s can be connected in series
by connecting an SOUT pin from one device to the SIN pin of the next device. An example of cascading two
TLC5945s is shown in Figure 7. The SOUT pin can also be connected to the controller to receive status
information from TLC5945 as shown in Figure 16.
MODE
DC Data Input Mode
GS Data Input Mode
th3
tsu3
twh2
XLAT
1st GS Data Input Cycle
SIN
DC
MSB
GS1
MSB
DC
LSB
tsu2
th2
SCLK
GS2
MSB
GS2
LSB
th1
tsu1
1
96
1
2nd GS Data Input Cycle
GS1
LSB
GS3
MSB
tsu0
twh0
192
193
th0
193
192
1
tpd0
twl0
-
SOUT
DC
MSB
-
GS1
MSB
-
1
SID1 SID1
MSB MSB-1
SID2 SID2
MSB MSB-1
SID1 GS2
LSB MSB
twh3
BLANK
1st GS Data Output Cycle
tsu5
GSCLK
2nd GS Data Output Cycle
1
tpd4
4096
tpd3
tpd1
1
twl1
Tgsclk
tpd3
OUT0
(current)
twh1
tsu4
th4
tpd3
touton
OUT1
(current)
OUT15
(current)
tpd2
XERR
Figure 6. Serial Data Input Timing Chart
SIN(a)
SIN
SOUT
TLC5945 (a)
SIN
SOUT
SOUT(b )
TLC5945 (b)
SCLK, XLAT,
BLANK,
GSCLK,
MODE
Figure 7. Cascading Two TLC5945 Devices
Submit Documentation Feedback
11
TLC5945
www.ti.com
SLVS755 – MARCH 2007
PRINCIPLES OF OPERATION (continued)
MODE
XLAT
SIN(a)
SCLK
DCb
MSB
DCa
LSB
GSb1
MSB
1
192
1
384
96X2
-
SOUT(b)
GSb2
MSB
GSa1
LSB
385
GSa2
LSB
GSb3
MSB
385
384
1
1
192X2
DCb
MSB
-
SIDb1 SIDb1
MSB MSB-1
GSb1
MSB
-
SIDa1
LSB
SIDb2 SIDb2
MSB MSB-1
GSb2
MSB
BLANK
1
GSCLK
4096
1
OUT0
(current)
OUT1
(current)
OUT15
(current)
XERR
Figure 8. Timing Chart for Two Cascaded TLC5945 Devices
ERROR INFORMATION OUTPUT
The open-drain output XERR is used to report both of the TLC5945 error flags, TEF and LOD. During normal
operating conditions, the internal transistor connected to the XERR pin is turned off. The voltage on XERR is
pulled up to VCC through an external pullup resistor. If TEF or LOD is detected, the internal transistor is turned
on, and XERR is pulled to GND. Because XERR is an open-drain output, multiple ICs can be ORed together
and pulled up to VCC with a single pullup resistor. This reduces the number of signals needed to report a system
error (see Figure 16).
To differentiate LOD and TEF signal from XERR pin, LOD can be masked out with BLANK = HIGH.
Table 2. XERR Truth Table
ERROR CONDITION
OUTn VOLTAGE
TJ < T(TEF)
TJ > T(TEF)
TJ < T(TEF)
TJ > T(TEF)
12
ERROR INFORMATION
TEMPERATURE
TEF
LOD
Don't Care
L
X
Don't Care
H
X
OUTn > V(LED)
L
L
OUTn < V(LED)
L
H
OUTn > V(LED)
H
L
OUTn < V(LED)
H
H
Submit Documentation Feedback
SIGNALS
BLANK
H
XERR
H
L
H
L
L
L
L
TLC5945
www.ti.com
SLVS755 – MARCH 2007
TEF: THERMAL ERROR FLAG
The TLC5945 provides a temperature error flag (TEF) circuit to indicate an overtemperature condition of the IC.
If the junction temperature exceeds the threshold temperature (160°C typical), TEF becomes H and XERR pin
goes to low level. When the junction temperature becomes lower than the threshold temperature, TEF becomes
L and XERR pin becomes high impedance. TEF status can also be read out from the TLC5945 status register.
LOD: LED OPEN DETECTION
The TLC5945 has an LED-open detection circuit that detects broken or disconnected LED's. The LED open
detector pulls the XERR pin to GND when an open LED is detected. XERR and the corresponding error bit in
the Status Information Data is only active under the following open LED conditions.
1. OUTn is on and the time tpd2 (1 µs typical) has passed.
2. The voltage of OUTn is < 0.3V (typical)
The LOD status of each output can be also read out from the SOUT pin. See the STATUS INFORMATION
OUTPUT section for details. The LOD error bits are latched into the Status Information Data when XLAT returns
to a low after a high. Therefore, the XLAT pin must be pulsed high then low while XERR is active in order to
latch the LOD error into the Status Information Data for subsequent reading via the serial shift register.
OUTPUT ENABLE
All OUTn channels of the TLC5945 can be switched off with one signal. When BLANK is set high, all OUTn
channels are disabled, regardless of logic operations of the device. The grayscale counter is also reset. When
BLANK is set low, all OUTn channels operate normally. If BLANK goes low and then back high before the
grayscale counter reaches 4095, all outputs turn on for their programmed number of grayscale clocks, or the
length of time the that the BLANK signal was low, whichever is lower. For example, if all outputs are
programmed to turn on for 1 ms, but the BLANK signal is only low for 200 ns, all outputs turn on for 200 ns.
Table 3. BLANK Signal Truth Table
BLANK
OUT0 - OUT15
LOW
Normal condition
HIGH
Disabled
SETTING MAXIMUM CHANNEL CURRENT
The maximum output current per channel is programmed by a single resistor, R(IREF), which is placed between
IREF pin and GND pin. The voltage on IREF is set by an internal band gap V(IREF) with a typical value of
1.24 V. The maximum channel current is equivalent to the current flowing through R(IREF) multiplied by a factor of
31.5. The maximum output current can be calculated by Equation 6:
V
(IREF)
I max +
31.5
R
(IREF)
(6)
where:
V(IREF) = 1.24 V
R(IREF) = User-selected external resistor.
Imax must be set between 5 mA and 80 mA. The output current may be unstable if Imax is set lower than 5 mA.
Output currents lower than 5 mA can be achieved by setting Imax to 5 mA or higher and then using dot
correction.
Figure 3 shows the maximum output current IO versus R(IREF). R(IREF) is the value of the resistor between IREF
terminal to GND, and IO is the constant output current of OUT0 to OUT15. A variable power supply may be
connected to the IREF pin through a resistor to change the maximum output current per channel. The maximum
output current per channel is 31.5 times the current flowing out of the IREF pin.
Submit Documentation Feedback
13
TLC5945
www.ti.com
SLVS755 – MARCH 2007
POWER DISSIPATION CALCULATION
The device power dissipation needs to be below the power dissipation rate of the device package to ensure
correct operation. Equation 7 calculates the power dissipation of device:
P
D
ǒ
+ V
CC
I
Ǔ ) ǒVOUT
CC
I
MAX
N
DCn
63
d
PWM
Ǔ
(7)
where:
VCC: device supply voltage
ICC: device supply current
VOUT: TLC5945 OUTn voltage when driving LED current
IMAX: LED current adjusted by R(IREF) Resistor
DCn: maximum dot correction value for OUTn
N: number of OUTn driving LED at the same time
dPWM: duty cycle defined by BLANK pin or GS PWM value
OPERATING MODES
The TLC5945 has two operating modes defined by MODE as shown in Table 4. The GS and DC registers are
set to random values that are not known just after power on. The GS and DC values must be programmed
before turning on the outputs. Please note that when initially setting GS and DC data after power on, the GS
data must be set before the DC data is set. Failure to set GS data before DC data may result in the first bit of
GS data being lost. XLAT must be low when the MODE pin goes high-to-low or low-to-high to change back and
forth between GS mode and DC mode.
Table 4. TLC5945 Operating Modes Truth Table
MODE
INPUT SHIFT REGISTER
OPERATING MODE
GND
192 bit
Grayscale PWM Mode
VCC
96 bit
Dot Correction Data Input Mode
SETTING DOT CORRECTION
The TLC5945 has the capability to fine-adjust the output current of each channel (OUT0 to OUT15)
independently. This is also called dot correction. This feature is used to adjust the brightness deviations of LEDs
connected to the output channels OUT0 to OUT15. Each of the 16 channels can be programmed with a 6-bit
word. The channel output can be adjusted in 64 steps from 0% to 100% of the maximum output current Imax. The
TEST pin must be connected to VCC to ensure proper operation of the dot correction circuitry. Equation 8
determines the output current for each output n:
I
+ I max DCn
OUTn
63
(8)
where:
Imax = the maximum programmable output current for each output.
DCn = the programmed dot correction value for output n (DCn = 0 to 63).
n = 0 to 15
14
Submit Documentation Feedback
TLC5945
www.ti.com
SLVS755 – MARCH 2007
Figure 9 shows the dot correction data packet format which consists of 6 bits x 16 channel, total 96 bits. The
format is Big-Endian format. This means that the MSB is transmitted first, followed by the MSB-1, etc. The DC
15.5 in Figure 9 stands for the 5th-most significant bit for output 15.
MSB
LSB
0
5
6
89
90
95
DC 15.5
DC 15.0
DC 14.5
DC 1.0
DC 0.5
DC 0.0
DC OUT15
DC OUT0
DC OUT14 − DC OUT1
Figure 9. Dot Correction Data Packet Format
When MODE is set to VCC, the TLC5945 enters the dot correction data input mode. The length of input shift
register becomes 96bits. After all serial data are shifted in, the TLC5945 writes the data in the input shift register
to DC register when XLAT is high, and holds the data in the DC register when XLAT is low. The DC register is a
level triggered latch of XLAT signal. Since XLAT is a level-triggered signal, SCLK and SIN must not be changed
while XLAT is high. After XLAT goes low, data in the DC register is latched and does not change. BLANK signal
does not need to be high to latch in new data. When XLAT goes high, the new dot-correction data immediately
becomes valid and changes the output currents if BLANK is low. XLAT has setup time (tsu1) and hold time (th1)
to SCLK as shown in Figure 6.
To input data into the dot correction register, MODE must be set to VCC. The internal input shift register is then
set to 96-bit width. After all serial data are clocked in, a rising edge of XLAT is used to latch the data into the dot
correction register. Figure 10 shows the dc data input timing chart.
DC Mode Data
Input Cycle n
DC Mode Data
Input Cycle n+1
VCC
MODE
SIN
DC n−1
LSB
DC n
MSB
DC n
MSB−1
DC n
MSB−2
DC n
LSB+1
DC n
LSB
DC n+1
MSB
DC n+1
MSB−1
twh0
SCLK
1
2
3
95
96
1
2
twl0
SOUT
DC n−1
MSB
DC n−1
MSB−1
DC n−1
MSB−2
DC n−1
LSB+1
DC n−1
LSB
tsu1
DC n
MSB
DC n
MSB−1
DC n
MSB−2
twh2
th1
XLAT
Figure 10. Dot Correction Data Input Timing Chart
SETTING GRAYSCALE
The TLC5945 can adjust the brightness of each channel OUTn using a PWM control scheme. The use of 12 bits
per channel results in 4096 different brightness steps, from 0% to 100% brightness. Equation 9 determines the
brightness level for each output n:
Brightness in % + GSn
100
4095
(9)
where:
GSn = the programmed grayscale value for output n (GSn = 0 to 4095)
Submit Documentation Feedback
15
TLC5945
www.ti.com
SLVS755 – MARCH 2007
n = 0 to 15
Grayscale data for all OUTn
The input shift register enters grayscale data into the grayscale register for all channels simultaneously. The
complete grayscale data format consists of 16 x 12 bit words, which forms a 192-bit wide data packet (see
Figure 11). The data packet must be clocked in with the MSB first.
MSB
0
11
12
179
180
LSB
191
GS 15.11
GS 15.0
GS 14.11
GS 1.0
GS 0.11
GS 0.0
GS OUT15
GS OUT14 − GS OUT1
GS OUT0
Figure 11. Grayscale Data Packet Format
When MODE is set to GND, the TLC5945 enters the grayscale data input mode. The device switches the input
shift register to 192-bit width. After all data is clocked in, a rising edge of the XLAT signal latches the data into
the grayscale register (see Figure 12). New grayscale data immediately becomes valid at the rising edge of the
XLAT signal; therefore, new grayscale data should be latched at the end of a grayscale cycle when BLANK is
high. The first GS data input cycle after dot correction requires an additional SCLK pulse after the XLAT signal
to complete the grayscale update cycle. All GS data in the input shift register is replaced with status information
data (SID) after updating the grayscale register.
First GS Mode Data
Input Cycle After DC Data Input Cycle
DC Mode Data
Input Cycle
Following GS Mode Data
Input Cycle
MODE
t h3
t h3
t su3
XLAT
t wh2
SIN
GS
MSB
DC
LSB
GS n + 1
LSB
t h1
t h2
SCLK
GS + 1
MSB
GS
LSB
t su1
t su2
96
192
1
193
1
192
t pd0
n
SOUT DC
LSB
DC
MSB
X
X
GS
MSB
SID
MSB
SID
MSB−1
SID
LSB
SID n + 1
MSB
Figure 12. Grayscale Data Input Timing Chart
STATUS INFORMATION OUTPUT
The TLC5945 does have a status information register, which can be accessed in grayscale mode (MODE =
GND). After the XLAT signal latches the data into the GS register, the input shift register data is replaced with
status information data (SID) of the device (see Figure 12). LOD, TEF, and dot-correction register data can be
read out at the SOUT pin. The status information data packet is 192 bits wide. Bits 0 – 15 contain the LOD
status of each channel. Bit 16 contains the TEF status. Bits 24 – 119 contain the data of the dot-correction
register. The remaining bits are reserved. The complete status information data packet is shown in Figure 13.
SOUT outputs the MSB of the SID at the same time the SID are stored in the SID register, as shown in
16
Submit Documentation Feedback
TLC5945
www.ti.com
SLVS755 – MARCH 2007
Figure 14. The next SCLK pulse, which will be the clock for receiving the MSB of the next grayscale data,
transmits MSB-1 of SID. If output voltage is < 0.3 V (typical) when the output sink current turns on, LOD status
flag becomes active. The LOD status flag is an internal signal which pulls XERR pin down to low when the LOD
status flag becomes active. The delay time, tpd2 (1 µs maximum), is from the time of turning on the output sink
current to the time LOD status flag becomes valid.
MSB
LSB
0
15
16
LOD 15
LOD 0
TEF
LOD Data
23
X
24
X
DC 15.5
TEF
119
120
191
DC 0.0
X
X
DC Values
Reserved
Figure 13. Status Information Data Packet Format
MODE
GS Data Input Mode
XLAT
1st GS Data Input Cycle
GS1
MSB
SIN
2nd GS Data Input Cycle
GS1
LSB
GS2
MSB
> tpd2 + tpd3
tsuLOD
1
SCLK
SOUT
-
192
-
GS2
LSB
193
GS1
MSB
SID1
MSB
192
1
SID1
MSB-1
SID1
LSB
GS2
MSB
(1st GS Data Output Cycle)
BLANK
GSCLK
1
4096
tpd3
OUT0
(current)
OUT1
(current)
OUT15
(current)
XERR
tpd2 + tpd3
Figure 14. Readout Status Information Data (SID) Timing Chart
GRAYSCALE PWM OPERATION
The grayscale PWM cycle starts with the falling edge of BLANK. The first GSCLK pulse after BLANK goes low
increases the grayscale counter by one and switches on all OUTn with grayscale value not zero. Each following
rising edge of GSCLK increases the grayscale counter by one. The TLC5945 compares the grayscale value of
Submit Documentation Feedback
17
TLC5945
www.ti.com
SLVS755 – MARCH 2007
each output OUTn with the grayscale counter value. All OUTn with grayscale values equal to the counter values
are switched off. A BLANK=H signal after 4096 GSCLK pulses resets the grayscale counter to zero and
completes the grayscale PWM cycle (see Figure 15). When the counter reaches a count of FFFh, the counter
stops counting and all outputs turn off. Pulling BLANK high before the counter reaches FFFh immediately resets
the counter to zero.
GS PWM
Cycle n
BLANK
t wl1
t wh1
t h4
GSCLK
1
2
t pd3
t pd1
OUT0
(Current)
GS PWM
Cycle n+1
4096
3
t wl1
t wh3
t su4
1
t pd3
t pd3
OUT1
(Current)
OUT15
(Current)
t pd2
XERR
Figure 15. Grayscale PWM Cycle Timing Chart
SERIAL DATA TRANSFER RATE
Figure 16 shows a cascading connection of n TLC5945 devices connected to a controller, building a basic
module of an LED display system. There is no TLC5945 limitation to the maximum number of ICs that can be
cascaded. The maximum number of cascading TLC5945 devices depends on the application system and is in
the range of 40 devices. Equation 10 calculates the minimum frequency needed:
f
+ 4096
f
(GSCLK)
(update)
f
(SCLK)
+ 193
f
(update)
n
(10)
where:
f(GSCLK): minimum frequency needed for GSCLK
f(SCLK): minimum frequency needed for SCLK and SIN
f(update): update rate of whole cascading system
n: number cascaded of TLC5945 device
18
Submit Documentation Feedback
TLC5945
www.ti.com
SLVS755 – MARCH 2007
Application Example
VCC
V(LED)
V(LED)
V(LED)
V(LED)
100 k
OUT0
XERR
XERR
SCLK
SCLK
BLANK
SOUT
VCC
SOUT
XERR
VCC
SCLK
100 nF
GSCLK
IREF
BLANK
IC 0
TLC5945
MODE
VCC
TEST
100 nF
XLAT
TLC5945
MODE
MODE
OUT15
SIN
VCC
GSCLK
GSCLK
OUT0
SOUT
XLAT
XLAT
Controller
OUT15
SIN
SIN
IREF
BLANK
TEST
IC n
6
Figure 16. Cascading Devices
Submit Documentation Feedback
19
PACKAGE MATERIALS INFORMATION
www.ti.com
17-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
17-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLC5945PWPR
PWP
28
MLA
330
16
7.1
10.4
1.3
12
16
PKGORN
T1TR-MS
P
TLC5945RHBR
RHB
32
MLA
330
12
5.3
5.3
1.5
8
12
PKGORN
T2TR-MS
P
TLC5945RHBT
RHB
32
MLA
177
12
5.3
5.3
1.5
8
12
PKGORN
T2TR-MS
P
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TLC5945PWPR
PWP
28
MLA
346.0
346.0
33.0
TLC5945RHBR
RHB
32
MLA
346.0
346.0
29.0
TLC5945RHBT
RHB
32
MLA
190.0
212.7
31.75
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-May-2007
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated