STAC2932B
HF/VHF/UHF RF power N-channel MOSFETs
Features
■
Gold metallization
■
Excellent thermal stability
■
Common source push-pull configuration
■
POUT = 300 W min. with 20 dB gain @ 175 MHz
■
In compliance with the 2002/95/EC European
directive
■
ST air cavity packaging technology - STAC™
package
STAC244B
Air cavity
Description
The STAC2932B is a gold metallized N-channel
MOS field-effect RF power transistor, intended for
use in 50 V DC large signal applications up to 250
MHz.
Figure 1.
Pin connection
1
The STAC2932B benefits from the latest
generation of efficient, patent-pending package
technology, otherwise known as STAC™
1
3
2
2
Table 1.
1. Drain
3. Source
2. Gate
(Bottom side)
Device summary
Order code
Marking
Base qty.
Package
Packaging
STAC2932BW
STAC2932(1)
20
STAC244B
Tray
1. For more details please refer to Chapter 7: Marking, packing and shipping specifications.
January 2012
Doc ID 15497 Rev 5
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www.st.com
14
Contents
STAC2932B
Contents
1
2
Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2
Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5
Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7
Marking, packing and shipping specifications . . . . . . . . . . . . . . . . . . . 12
8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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STAC2932B
Electrical data
1
Electrical data
1.1
Maximum ratings
(TCASE = 25 °C)
Table 2.
Absolute maximum ratings
Symbol
V(BR)DSS(1)
VDGR
VGS
ID
PDISS
TJ
TSTG
Parameter
Value
Unit
Drain source voltage
125
V
Drain-gate voltage (RGS = 1 MΩ)
125
V
Gate-source voltage
±20
V
Drain current
40
A
Power dissipation
625
W
Max. operating junction temperature
200
°C
-65 to +150
°C
Value
Unit
0.28
°C/W
Storage temperature
1. TJ = 150 °C
1.2
Thermal data
Table 3.
Symbol
RthJC
Thermal data
Parameter
Junction - case thermal resistance
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Electrical characteristics
2
STAC2932B
Electrical characteristics
TCASE = +25 °C
2.1
Static
Table 4.
Static (per side)
Symbol
Test conditions
Min.
125
Unit
VGS = 0 V
IDS = 100 mA
IDSS
VGS = 0 V
VDS = 50 V
50
μA
IGSS
VGS = 20 V
VDS = 0 V
250
nA
VGS(Q)
VDS = 10 V
ID = 250 mA
4.0
V
VDS(ON)
VGS = 10 V
ID = 10 A
3.0
V
GFS
VDS = 10 V
ID = 5 A
COSS
1.5
VGS = 0 V
VDS = 50 V
V
2.5
5
f = 1 MHz
CRSS
S
468
pF
206
pF
16
pF
Dynamic
Table 5.
Symbol
4/14
Max.
V(BR)DSS
CISS
2.2
Typ.
Dynamic
Test conditions
Min.
Typ.
Max.
Unit
POUT
VDD = 50 V, IDQ = 2 x 250 mA, PIN = 4 W, f = 175 MHz
300
390
W
hD
VDD = 50 V, IDQ = 2 x 250 mA, PIN = 4 W, f = 175 MHz
55
68
%
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STAC2932B
3
Note:
Impedance
Impedance
Figure 2.
Current conventions
Table 6.
Impedance data
Freq. (MHz)
ZIN (Ω)
ZDL(Ω)
175 MHz
2.0 - j2.0
3.5 + j5.2
Measured gate to gate and drain to drain, respectively.
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Typical performance
STAC2932B
4
Typical performance
Figure 3.
Capacitances vs drain supply
voltage
Figure 4.
!-V
".W
0IN7
0IN7
#OSS
#RSS
#ISS
0OUT7
#APACITANCESP&
Output power vs drain supply
voltage
0IN7
)UHT 0+]
,GT [P$
7FDVH &
6DD6
6DD6
Figure 5.
Output power vs gate voltage
Figure 6.
!-V
6DD6
6DD6
0OUT7
0OUT7
4CASE#
)UHT 0+]
,GT [P$
7FDVH &
0IN7
)UHT 0+]
,GT [P$
7FDVH &
6/14
!-V
4CASE#
Output power vs input power
4CASE#
6GS6
)NPUTPOWER7
Doc ID 15497 Rev 5
STAC2932B
Figure 7.
Typical performance
Output power vs input power and
case temperature
Figure 8.
!-V
%FFICIENCY
0OUT7
)UHT 0+]
9GG 9
,GT [P$
$0Y
Efficiency vs output power and
case temperature
4CASE#
4CASE#
4CASE#
)UHT 0+]
9GG 9
,GT [P$
4CASE#
4CASE#
4CASE#
)NPUTPOWER7
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/UTPUTPOWER7
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Test circuit
STAC2932B
5
Test circuit
Figure 9.
175 MHz test circuit schematic (production test circuit)
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64#05/+55+10«.+0'«&+/'05+105
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6
6
%
($
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6GF
6
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«)#2«$'69''0«)4170&««64#05/+55+10«.+0'5«+5«=?«««««««««««««6;2
Table 7.
175 MHz test circuit part list
Component
Description
C1, C2, C14,
C15, C24, C25
1200 pF ATC 700B chip capacitor
C5
75 pF ATC 100B chip capacitor
C6
ST406 variable capacitor
C9, C10
47 pF ATC 100B chip capacitor
C11, C12, C13
43 pF ATC 100B chip capacitor
C16, C18
470 pF ATC 100B chip capacitor
C17, C19, C20, C21
10,000 pF ATC 200B chip capacitor
C22, C23
0.1 μF 200 V chip capacitor
C28
10 μF 100 V electrolytic capacitor
C29
0.8 - 8 pF variable capacitor
R1, R2, R5, R6
430 Ω, 1/2 W chip resistor
8/14
%
%14'
%
%
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($
4
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%
4
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8II
8
Doc ID 15497 Rev 5
$
%
STAC2932B
Table 7.
Test circuit
175 MHz test circuit part list (continued)
Component
Description
R3, R4
270 Ω 1/2 W axial lead resistor
B1
RG-316 50 Ω 11.8" thru ferrite toroidal
B2
RG-142 50 Ω 11.8"
T1
4:1, RG-316 25 Ω, 5.9", 2 turns thru ferrite core
T2
1:4, 25 Ω semi-rigid cable, OD.141”, 5.9"
L1
λ/4 inductor, RG-142 50 Ω, 11.8", 3 turns thru ferrite toroid
FB1,FB5
Ferrite toroidal
FB2, FB6
Multi-aperture core
FB3, FB4
Surface mount ferrite bead
PCB
Rogers ultralam 2000, Er 2.55, 0.060”
Figure 10. Circuit layout
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Package mechanical data
6
STAC2932B
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
10/14
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STAC2932B
Package mechanical data
Table 8.
STAC244B mechanical data
mm
Dim.
Min.
Typ.
Max.
A
5.08
5.59
A1
4.32
4.83
B
4.32
5.33
C
9.65
9.91
D
17.78
18.08
E
33.88
34.19
F
0.10
0.15
G
1.02
H
1.45
1.70
I
4.83
5.33
J
9.27
9.52
K
27.69
28.19
L
3.12
3.23
3.33
M
3.35
3.45
3.56
Figure 11. STAC244B mechanical data drawing
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Marking, packing and shipping specifications
7
STAC2932B
Marking, packing and shipping specifications
Table 9.
Packing and shipping specifications
Order code
Packaging
Pcs per tray
Dry pack
humidity
Lot code
STAC2932BW
Tray
20
< 10 %
Not mixed
Figure 12. Marking layout
Table 10.
12/14
Marking specifications
Symbol
Description
W
Wafer process code
CZ
Assembly plant
xxx
Last 3 digit of diffusion lot
VY
Diffusion plant
MAR
Country of origin
CZ
Test and finishing plant
y
Assembly year
yy
Assembly week
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STAC2932B
8
Revision history
Revision history
Table 11.
Document revision history
Date
Revision
Changes
20-Mar-2009
1
First release.
29-Jun-2010
2
Updated features and description on cover page.
12-Aug-2011
3
Update figures on coverpage and Section 6: Package mechanical
data.
Inserted Section 7: Marking, packing and shipping specifications.
Minor text changes.
05-Sep-2011
4
Update L and M dimensions Table 8 on page 11.
12-Jan-2012
5
Minor text changes to improve readability.
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STAC2932B
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