STMICROELECTRONICS STL8N10LF3

STL8N10LF3
N-channel 100 V, 25 mΩ typ., 7.8 A STripFET™ III
Power MOSFET in a PowerFLAT™ 5x6 package
Datasheet — production data
Features
Order code
VDS
RDS(on) max
ID
STL8N10LF3
100 V
35 mΩ
7.8 A (1)
1. The value is rated according to Rthj-pcb
1
■
Logic level VGS(th)
■
175 °C maximum junction temperature
■
100% avalanche rated
2
3
4
PowerFLAT™ 5x6
Applications
■
Switching applications
■
Automotive
Figure 1.
Description
Internal schematic diagram
$
This device is an N-channel enhancement mode
Power MOSFET produced using
STMicroelectronics’ STripFET™ III technology,
which is specifically designed to minimize onresistance and gate charge to provide superior
switching performance.
'
3
!-V
Table 1.
Device summary
Order code
Marking
Package
Packaging
STL8N10LF3
8N10LF3
PowerFLAT™ 5x6
Tape and reel
January 2013
This is information on a product in full production.
Doc ID 023977 Rev 1
1/13
www.st.com
13
Contents
STL8N10LF3
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 6
3
Test circuits
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/13
.............................................. 8
Doc ID 023977 Rev 1
STL8N10LF3
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage
100
V
VGS
Gate-source voltage
±20
V
ID(1),(2)
Drain current (continuous) at TC = 25 °C
20
A
ID
Drain current (continuous) at TC = 100 °C
20
A
ID
(4)
Drain current (continuous) at Tpcb = 25 °C
7.8
A
ID
(4)
Drain current (continuous) at Tpcb=100 °C
5.5
A
Drain current (pulsed)
31.2
A
Total dissipation at TC = 25°C
70
W
Total dissipation at Tpcb = 25°C
4.3
W
Not-repetitive avalanche current
7.8
A
Single pulse avalanche energy
190
mJ
Operating junction temperature
Storage temperature
-55 to 175
°C
IDM
(3),(4)
PTOT
(4)
PTOT
IAV
EAS
(5)
TJ
Tstg
1. Specified by design. Not subject to production test.
2. Current is limited by bonding, with an RthJC = 2.1 °C/W the chip is able to carry 32 A at 25 °C.
3. Pulse width limited by safe operating area.
4. When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec
5. Starting TJ= 25 °C, ID= 7.8 A, VDD= 25 V.
Table 3.
Thermal resistance
Symbol
Parameter
Rthj-case
Rthj-pcb
(1)
Value
Unit
Thermal resistance junction-case
2.1
°C/W
Thermal resistance junction-pcb
35
°C/W
1. When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec
Doc ID 023977 Rev 1
3/13
Electrical characteristics
2
STL8N10LF3
Electrical characteristics
(TCASE = 25 °C unless otherwise specified)
Table 4.
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Drain-source breakdown
voltage (VGS= 0)
ID = 250 µA
IDSS
Zero gate voltage drain
current (VGS = 0)
VDS = 100 V
1
µA
IGSS
Gate body leakage current
(VDS = 0)
VGS = ±20 V
±100
nA
VGS(th)
Gate threshold voltage
VDS= VGS, ID = 250 µA
3
V
RDS(on)
Static drain-source onresistance
VGS= 10 V, ID= 4 A
VGS= 5 V, ID= 4 A
25
40
35
50
mΩ
mΩ
Min.
Typ.
Max.
Unit
V(BR)DSS
Table 5.
Symbol
100
V
1
Dynamic
Parameter
Test conditions
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS =25 V, f=1 MHz,
VGS=0
-
970
115
11.5
-
pF
pF
pF
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD=50 V, ID = 7.8 A
VGS =10 V
Figure 13
-
20.5
4
5
-
nC
nC
nC
RG
Intrinsic gate resistance
f=1 MHz open drain
Table 6.
Symbol
td(on)
tr
td(off)
tf
4/13
On/off states
Ω
3.65
Switching times
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Test conditions
VDD=50 V, ID= 7.8 A,
RG=4.7 Ω, VGS=10 V
Figure 12
Doc ID 023977 Rev 1
Min.
Typ.
-
8.7
9.6
50.6
5.2
Max.
Unit
-
ns
ns
ns
ns
STL8N10LF3
Electrical characteristics
Table 7.
Symbol
Parameter
Test conditions
Min
Typ.
Max
Unit
Source-drain current
-
7.8
A
(1)
Source-drain current (pulsed)
-
31.2
A
(2)
Forward on voltage
ISD = 7.8 A, VGS=0
-
1.3
V
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 7.8 A,
di/dt = 100 A/µs,
VDD=48 V, Tj=150 °C
-
ISD
ISDM
VSD
Source drain diode
trr
Qrr
IRRM
42.5
87
4.08
ns
nC
A
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration= 300 µs, duty cycle 1.5%
Doc ID 023977 Rev 1
5/13
Electrical characteristics
STL8N10LF3
2.1
Electrical characteristics (curves)
Figure 2.
Safe operating area
Figure 3.
Thermal impedance
AM13017v1
ID
(A)
ea
n)
ar
is DS(o
th
in ax R
ion y m
at
er d b
p
O
ite
Lim
10
Zth_AM13007v1
K
is
δ=0.5
0.2
0.1
-1
10
0.05
0.02
10ms
0.01
100ms
1s
1
-2
10
Tj=175°C
Tc=25°C
Single pulse
Single pulse
-3
0.1
0.1
Figure 4.
10
10
1
VDS(V)
Output characteristics
VGS=10V
25
4V
AM13019v1
VDS=4V
15
10
5
5
1
2
3
4
VDS(V)
Normalized VDS vs temperature
AM13010v1
VDS
(norm)
ID=1mA
6/13
tp (s)
10
10
Transfer characteristics
ID
(A)
10
0
0
Figure 7.
25.4
1.06
25.2
1.02
25.0
0.98
24.8
0.94
24.6
24.4
-25
25
75
125
1
TJ(°C)
Doc ID 023977 Rev 1
2
4
3
VGS(V)
Static drain-source on-resistance
AM13020v1
RDS(on)
(mΩ)
1.10
0.90
-75
1
0
10
20
15
Figure 6.
-1
10
25
5V
20
0
0
-2
-3
10
Figure 5.
AM13018v1
ID
(A)
-4
10
2
VGS=10V
3
4
5
6
7
ID(A)
STL8N10LF3
Figure 8.
Electrical characteristics
Gate charge vs gate-source voltage Figure 9.
AM13021v1
VGS
(V)
Capacitance variations
C
(pF)
AM13022v1
1000
Ciss
VDD=50V
ID=7.8A
10
8
6
100
4
Coss
2
Crss
0
0
5
10
15
20
Qg(nC)
Figure 10. Normalized gate threshold voltage
vs temperature
AM13014v1
VGS(th)
ID=250µA
(norm)
10
0
20
40
60
80
VDS(V)
Figure 11. Normalized on-resistance vs
temperature
AM13015v1
RDS(on)
ID=4A
VGS=10V
(norm)
2.0
1.2
1.6
1.0
1.2
0.8
0.8
0.6
0.4
-75
0.4
0
-25
25
75
125
TJ(°C)
Doc ID 023977 Rev 1
-75
-25
25
75
125
TJ(°C)
7/13
Test circuits
3
STL8N10LF3
Test circuits
Figure 12. Switching times test circuit for
resistive load
Figure 13. Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
μF
2200
RL
μF
VGS
IG=CONST
VDD
100Ω
Vi=20V=VGMAX
VD
RG
2200
μF
D.U.T.
D.U.T.
VG
2.7kΩ
PW
47kΩ
1kΩ
PW
AM01468v1
AM01469v1
Figure 14. Test circuit for inductive load
Figure 15. Unclamped inductive load test
switching and diode recovery times
circuit
A
A
D.U.T.
FAST
DIODE
B
B
L
A
D
G
VD
L=100μH
S
3.3
μF
B
25 Ω
1000
μF
D
VDD
2200
μF
3.3
μF
VDD
ID
G
RG
S
Vi
D.U.T.
Pw
AM01470v1
Figure 16. Unclamped inductive waveform
AM01471v1
Figure 17. Switching time waveform
ton
V(BR)DSS
tdon
VD
toff
tr
tdoff
tf
90%
90%
IDM
10%
ID
VDD
10%
0
VDD
VDS
90%
VGS
AM01472v1
8/13
0
Doc ID 023977 Rev 1
10%
AM01473v1
STL8N10LF3
4
Package mechanical data
Package mechanical data
Table 8.
PowerFLAT 5x6 type S-R mechanical data
mm
Dim.
Min.
Typ.
Max.
A
0.80
1.00
A1
0.02
0.05
A2
0.25
b
0.30
D
5.00
5.20
5.40
E
5.95
6.15
6.35
D2
4.11
4.31
E2
3.50
3.70
e
0.50
1.27
L
0.60
0.80
K
1.275
1.575
Doc ID 023977 Rev 1
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Package mechanical data
STL8N10LF3
Figure 18. PowerFLAT 5x6 type S-R drawing
Bottom View
Side View
Top View
8231817_Rev.F_Ribbon type S-R
10/13
Doc ID 023977 Rev 1
STL8N10LF3
Package mechanical data
Figure 19. PowerFLAT 5x6 recommended footprint (dimensions are in mm)
Footprint
Doc ID 023977 Rev 1
11/13
Revision history
5
STL8N10LF3
Revision history
Table 9.
12/13
Document revision history
Date
Revision
17-Jan-2013
1
Changes
First release.
Doc ID 023977 Rev 1
STL8N10LF3
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