STPS1150 Power Schottky rectifier Features ■ Negligible switching losses ■ Low forward voltage drop for higher efficiency and extented battery life ■ Low thermal resistance ■ Surface mount miniature package ■ Avalanche capability specified A K STmite (JEDEC DO-216AA) STPS1150M STmite flat STPS1150MF A A Description These 150 V power Schottky rectifiers are suited for switch mode power supplies on up to 24 V rails and high frequency converters. Packaged in STmite/STmite flat, SMA and axial, this device is intended for use in consumer and computer applications like TV, STB, PC and DVD where low drop forward voltage is required to reduce power dissipation. February 2011 K SMA (JEDEC DO-214AC) STPS1150A Table 1. Doc ID 9472 Rev 5 K DO-41 STPS1150 Device summary IF(AV) VRRM Tj (max) VF(max) 1A 150 V 175 °C 0.67 V 1/11 www.st.com 11 Characteristics STPS1150 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol VRRM IF(RMS) 1. Parameter STmite/flat SMA DO-41 STmite/flat SMA DO-41 IF(AV) Average forward current IFSM Surge non repetitive forward current PARM Tstg Tj Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature(1) dPtot --------------dTj Unit 150 15 V 1 A Tc = 160 °C δ = 0.5 TL = 160 °C δ = 0.5 TL = 150 °C δ = 0.5 A 50 50 75 1500 -65 to + 175 175 tp = 10 ms sinusoidal tp = 1µs Tj = 25 °C A W °C °C 1 - condition to avoid runaway for a diode on its own heatsink < ------------------------Rth ( j – a ) Table 3. Thermal resistance Symbol Parameter Rth(j-c) Junction to case Rth(j-l) Junction to lead Table 4. IR (1) STmite/STmite flat 20 SMA 20 DO-41 30 Unit °C/W Static electrical characteristics Parameter Reverse leakage current Tests conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF (2) Value Lead length = 10 mm Symbol Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 1 A Typ. Max. Unit 0.2 1.0 µA 0.2 1.0 mA 0.78 0.82 0.62 0.67 0.85 0.89 0.69 0.75 V IF = 2 A 1. tp = 5 ms, δ < 2% 2. tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.08 IF2(RMS) 2/11 Value Repetitive peak reverse voltage Forward rms current Doc ID 9472 Rev 5 STPS1150 Characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. PF(AV)(W) 1.2 0.9 δ = 0.1 0.8 δ = 0.2 Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) STmite and STmite flat Rth(j-a) = Rth(j-c) δ = 0.5 1.0 δ = 0.05 0.7 Rth(j-a) = 120 °C/W 0.8 δ=1 0.6 0.5 Rth(j-a) = 250 °C/W 0.6 0.4 SMA Rth(j-a) = Rth(j-l) 0.4 0.3 T 0.2 T DO-41 Rth(j-a) = Rth(j-l) 0.2 0.1 IF(AV)(A) δ=tp/T tp 0.0 0.0 0.0 0.2 Figure 3. 0.4 0.6 0.8 1.0 0 1.2 Normalized avalanche power derating versus pulse duration δ = tp / T Figure 4. PARM(tp) PARM(1 µs) Tamb(°C) tp 25 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 1.2 0.1 0.8 1 0.6 0.4 0.01 0.2 0.001 0.01 0.1 Figure 5. 20 Tj(°C) tp(µs) 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration - maximum values IM(A) STmite Figure 6. 20 18 18 16 16 14 75 100 125 150 Non repetitive surge peak forward current versus overload duration - maximum values IM(A) STmite flat 14 12 Tc = 25 °C 10 12 Tc = 25 °C 10 Tc = 75 °C 8 6 4 50 Tc = 125 °C 2 0 1.E-03 t δ = 0.5 Tc = 125 °C 6 4 IM Tc = 75 °C 8 IM 2 t(s) 1.E-02 1.E-01 1.E+00 0 1.E-03 Doc ID 9472 Rev 5 t δ = 0.5 t(s) 1.E-02 1.E-01 1.E+00 3/11 Characteristics Figure 7. STPS1150 Non repetitive surge peak forward current versus overload duration - maximum values Figure 8. IM(A) Non repetitive surge peak forward current versus overload duration - maximum values IM(A) 8 8 SMA DO-41 7 7 6 6 5 Ta=25°C 5 Ta=25°C Ta=75°C 4 4 Ta=75°C 3 3 Ta=125°C 2 Ta=125°C 2 IM 1 IM t 1 t(s) δ=0.5 1.E-02 1.E-01 1.E+00 1.E-03 Zth(j-c)/Rth(j-c) 1.0 STmite 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse tp(s) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration 1.0 1.E-02 Zth(j-a)/Rth(j-a) STmite flat Single pulse 0.1 tp(s) 0.0 1.E-04 1.E-03 1.0 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 1.E-01 Zth(j-a)/Rth(j-a) DO-41 0.3 Single pulse Single pulse 0.2 1.E-02 Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration 0.9 0.2 0.1 4/11 1.E+00 Zth(j-c)/Rth(j-c) SMA 0.0 1.E-02 1.E-01 Figure 10. Relative variation of thermal Relative variation of thermal impedance junction to case versus impedance junction to case versus pulse duration pulse duration Figure 9. 0.1 t(s) 0 1.E-03 1.0 t δ=0.5 0 0.1 tp(s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0.0 1.E-02 Doc ID 9472 Rev 5 tp(s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 STPS1150 Characteristics Figure 13. Reverse leakage current versus reverse voltage applied (typical values) Figure 14. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1.E+04 100 1.E+03 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C Tj=125°C 1.E+02 Tj=100°C 1.E+01 Tj=75°C 1.E+00 10 Tj=50°C 1.E-01 Tj=25°C 1.E-02 VR(V) VR(V) 1 1.E-03 0 25 50 75 100 125 1 150 Figure 15. Forward voltage drop versus forward current (all packages) 10 100 1000 Figure 16. Thermal resistance junction to ambient versus copper surface under tab (STmite) IFM(A) 250 3.0 Rth(j-a)(°C/W) STmite 225 2.5 200 Tj=125°C (maximum values) 175 Epoxy printed circuit board, copper thickness = 35 µm 2.0 150 1.5 125 Tj=125°C (typical values) 100 1.0 75 Tj=25°C (maximum values) 50 0.5 25 VFM(V) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 17. Thermal resistance junction to ambient versus copper surface under tab (STmite flat) 250 SCu(cm²) 0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Rth(j-a)(°C/W) Rth(j-a)(°C/W) 130 STmite flat 225 Epoxy printed circuit board, copper thickness = 35 µm 120 110 200 100 175 Epoxy printed circuit board, copper thickness = 35 µm 150 90 80 70 125 60 100 50 75 40 30 50 20 25 SCu(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 10 SCu(cm²) 0 0.0 Doc ID 9472 Rev 5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5/11 Characteristics STPS1150 Figure 19. Thermal resistance versus lead length (DO-41) Rth(°C/W) 120 Rth(j-a) 100 80 60 Rth(j-I) 40 20 Lleads(mm) 0 5 6/11 10 15 Doc ID 9472 Rev 5 20 25 STPS1150 2 Package information Package information ● Band shows cathode. ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. STmite dimensions Dimensions Ref. L3 D b2 b H L2 L E R C A A1 R1 0° to 6° Millimeters Inches Min. Typ. Max. Min. Typ. A 0.85 1.00 1.15 0.033 0.039 0.045 A1 -0.05 0.105 -0.002 Max. 0.004 b 0.40 0.65 0.016 0.025 b2 0.70 1.00 0.027 0.039 c 0.10 0.25 0.004 0.010 D 1.75 1.90 2.05 0.069 0.007 0.081 E 1.75 1.90 2.05 0.069 0.007 0.081 H 3.60 3.75 3.90 0.142 0.148 0.154 L 0.50 0.63 0.80 0.047 0.025 0.031 L2 1.20 1.35 1.50 0.047 0.053 0.059 0.50 ref L3 0.019 ref R 0.07 0.003 R1 0.07 0.003 Figure 20. Footprint (dimensions in mm) 1.82 1.38 2.03 0.75 1.10 0.50 Doc ID 9472 Rev 5 0.71 7/11 Package information STPS1150 Table 6. STmite flat dimensions Dimensions Ref. L E1 D L1 Inches Min. Typ. Max. Min. b2 L3 c A A 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 Max. c 0.10 0.15 0.25 0.004 0.006 0.009 D 1.75 1.90 2.05 0.069 0.075 0.081 E 3.60 3.80 3.90 0.142 0.150 0.154 E1 2.80 2.95 3.10 0.110 0.116 0.122 L 0.50 0.55 0.80 0.020 0.022 0.031 L1 2.10 2.40 2.60 0.083 0.094 0.102 L2 0.45 0.60 0.75 0.018 0.024 0.030 L3 0.20 0.35 0.50 0.008 0.014 0.020 Figure 21. Footprint dimensions 0.85 0.63 2.00 0.65 (0.033) (.025) (0.079) (.026) 0.95 0.65 (0.026) (0.037) 4.13 (0.163) millimeters (inches) 8/11 Typ. L2 b E Millimeters Doc ID 9472 Rev 5 1.95 (0.077) STPS1150 Package information Table 7. SMA dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 b Figure 22. Footprint (dimensions in mm) 2.63 1.4 1.4 1.64 5.43 Table 8. DO-41 (plastic) dimensions Dimensions Ref. A C Doc ID 9472 Rev 5 Inches Min. Max. Min. Max. A 4.1 5.20 0.160 0.205 B 2 2.71 0.080 0.107 C 25.4 D 0.712 ØD ØB C Millimeters 1 0.863 0.028 0.034 9/11 Ordering information 3 STPS1150 Ordering information Table 9. Ordering information Order code 4 Package Weight Base qty Delivery mode STPS1150M 115 STmite 0.0155 g 12000 Tape and reel STPS1150MF F115 STmite flat 0.016 g 12000 Tape and reel STPS1150A 1150 SMA 0.068 g 5000 Tape and reel STPS1150 STPS1150 DO-41 0.34 g 2000 Ammopack STPS1150RL STPS1150 DO-41 0.34 g 5000 Tape and reel Revision history Table 10. 10/11 Marking Document revision history Date Revision Changes Jul-2003 2A Aug-2004 3 SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106) to 2.03mm (0.080). 31-May-2006 4 Reformatted to current standard. Added ECOPACK statement. Updated SMA footprint in Figure 15. Changed nF to pF in Figure 10. 09-Feb-2011 5 Added STmite and STmite flat package. Last update. Doc ID 9472 Rev 5 STPS1150 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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