STPS340 Power Schottky rectifier Main product characteristics K IF(AV) 3A VRRM 40 V Tj (max) 150° C VF (max) 0.57 V A NC DPAK STPS340B Features and Benefits ■ Very small conduction losses ■ Negligible switching losses ■ Low forward voltage drop ■ Low thermal resistance ■ Extremely fast switching ■ Surface mounted device ■ Avalanche capability specified A A K K SMB STPS340U SMC STPS340S A K Description SMB flat STPS340UF Single chip Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in DPAK, SMC, SMB, and low profile SMB, this device is intended for use in low and medium voltage operation, high frequency inverters, free wheeling and polarity protection applications where low switching losses are required. February 2007 Order codes Rev 9 Part Number Marking STPS340U U34 STPS340S S34 STPS340B S340 STPS340B-TR S340 STPS340UF FU34 1/11 www.st.com 11 Characteristics 1 STPS340 Characteristics Table 1. Absolute Ratings (limiting values) Symbol VRRM Repetitive peak reverse voltage IF(RMS) RMS forward current IF(AV) Average forward current Unit 40 V 6 A 3 A DPAK Tc = 135° C δ = 0.5 DPAK TL = 105° C δ = 0.5 SMB/SMC TL = 115° C δ = 0.5 SMB flat Surge non repetitive forward current tp =10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 1300 W -65 to + 150 °C 150 °C Storage temperature range Operating junction temperature Tj dPtot --------------dTj < Table 2. 1 -------------------------Rth ( j – a ) Rth(j-l) Rth(j-c) Table 3. Symbol IR(1) (1) condition to avoid thermal runaway for a diode on its own heatsink Thermal resistance Symbol Parameter Junction to lead Junction to case VF(1) Value SMB 25 SMB flat 15 SMC 20 DPAK 5.5 Unit °C/W °C/W Static electrical characteristics Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 125° C Tj = 25° C Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C VR = VRRM Min. Typ. 2 Max. Unit 20 µA 10 mA 0.63 IF = 3 A 0.52 0.57 V 0.84 IF = 6 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.050 IF2(RMS) 2/11 Value IFSM Tstg 1. Parameter 0.63 0.72 STPS340 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) Average forward current versus ambient temperature (δ = 0.5, per diode) (DPAK / SMB / SMC) IF(AV)(A) PF(AV)(W) 3.5 2.5 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-l) DPAK 3.0 2.0 δ=1 2.5 SMB / SMC 1.5 Rth(j-a)=65°C/W 2.0 1.5 1.0 1.0 T T 0.5 0.5 IF(AV)(A) δ=tp/T 0.0 0.0 0.5 1.0 Figure 3. 1.5 2.0 2.5 3.0 δ=tp/T tp 0.0 3.5 4.0 Average forward current versus ambient temperature (δ = 0.5, per diode) (SMB flat) 0 Tamb(°C) tp 25 Figure 4. 50 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) (DPAK) IM(A) IF(AV)(A) 60 3.5 Rth(j-a)=Rth(j-l) DPAK 3.0 50 2.5 40 2.0 SMB flat 30 Tc=25°C 1.5 Tc=75°C Rth(j-a)=40°C/W . SCU=2.5 cm2 1.0 20 T δ=tp/T 0.0 0 t Tamb(°C) tp Tc=125°C IM 10 0.5 t(s) δ=0.5 0 25 Figure 5. 50 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) 1.E-03 1.E-02 Figure 6. IM(A) 1.E-01 1.E+00 Non repetitive surge peak forward current versus overload duration (maximum values) (SMC) IM(A) 10 12 SMB SMC 11 9 10 8 9 7 Ta=25°C 6 8 Ta=25°C 7 5 6 Ta=75°C 4 Ta=75°C 5 4 3 3 2 1 Ta=125°C IM 2 t 1 t(s) δ=0.5 0 1.E-03 Ta=125°C IM t t(s) δ=0.5 0 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 3/11 Characteristics Figure 7. STPS340 Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat Figure 8. IM(A) Normalized avalanche power derating versus pulse duration PARM(tp) PARM(1µs) 25 SMB flat 1 20 TL=25°C 15 0.1 TL=75°C 10 0.01 TL=125°C 5 IM t t(s) δ=0.5 1.E-03 1.E-02 Figure 9. tp(µs) 0.001 0 1.E-01 0.01 1.E+00 Normalized avalanche power derating versus junction temperature 0.1 1 10 100 1000 Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (DPAK) Zth(j-a)/Rth(j-a) PARM(tp) PARM(25°C) 1.0 0.9 1.2 DPAK 0.8 1 0.7 0.8 0.6 0.5 0.6 0.4 0.4 0.3 Single pulse T 0.2 0.2 Tj(°C) 0.1 0 25 50 75 100 125 150 tp(s) 1.E-03 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) 1.E-02 tp 1.E-01 1.E+00 Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration (SMC) Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a) 1.0 1.0 0.9 0.9 SMB 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 SMC 0.3 T 0.2 Single pulse 0.1 tp(s) δ=tp/T 0.0 1.E-02 T 0.2 Single pulse 0.1 4/11 δ=tp/T 0.0 1.E-01 1.E+00 1.E+01 1.E+02 tp 1.E+03 tp(s) δ=tp/T 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 tp 1.E+03 STPS340 Characteristics Figure 13. Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat Figure 14. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) Zth(j-l)/Rth(j-l) 1.E+01 1.0 Tj=150°C SMB flat 0.9 Tj=125°C 1.E+00 0.8 Tj=100°C 0.7 1.E-01 0.6 Tj=75°C 0.5 1.E-02 0.4 0.3 Tj=25°C 1.E-03 0.2 Single pulse 0.1 tp(s) 0.0 VR(V) 1.E-04 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 15. Junction capacitance versus reverse voltage applied (typical values) 0 5 10 15 20 25 30 35 40 Figure 16. Forward voltage drop versus forward current C(pF) IFM(A) 10 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=125°C (Maximum values) 1 100 Tj=125°C (Typical values) 0 Tj=25°C (Maximum values) VR(V) VFM(V) 0 10 1 10 100 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (DPAK) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (SMB / SMC) Rth(j-a)(°C/W) Rth(j-a)(°C/W) 110 100 90 100 DPAK SMB / SMC 90 80 80 70 70 60 60 50 50 40 40 30 30 20 20 10 10 SCU(cm²) 0 SCU(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5/11 Package Information STPS340 Figure 19. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (SMB flat) Rth(j-a)(°C/W) 110 100 90 80 70 60 SMB flat 50 40 30 20 10 SCU(cm²) 0 0.0 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Package Information ● Band indicates cathode on SMB and SMC ● Epoxy meets UL94, V0 Table 4. DPAK dimensions Dimensions Ref E Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 A B2 C2 L2 D R H L4 A1 B G R C A2 0.60 MIN. V2 6/11 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° STPS340 Package Information Figure 20. DPAK footprint dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 Table 5. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 Figure 21. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 7/11 Package Information Table 6. STPS340 SMB Flat dimensions Dimensions Ref. D L L2 E E1 L L1 b Min. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 (1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 c 0.40 0.016 L2 0.60 0.024 Figure 22. SMB Flat footprint (dimensions in mm) 5.84 2.07 8/11 3.44 Typ. L1 1. Applies to plated leads 1.20 Inches Min. Typ. Max. A c Millimeters 1.20 Max. STPS340 Package Information Table 7. SMC package mechanical data Dimensions Ref Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.40 0.030 0.063 D E A1 C A2 E2 L b Figure 23. Foot print dimensions (in millimeters) 1.54 5.03 1.54 3.15 8.11 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information 3 STPS340 Ordering information Ordering type Marking Package Weight Base qty STPS340U U34 SMB 0.107 g 2500 STPS340S S34 SMC 0.243 g 2500 S340 DPAK 0.30 g Delivery mode Tape and reel STPS340B STPS340B-TR STPS340UF 4 10/11 FU34 SMB flat 0.50 g 75 Tube 2500 Tape and reel 5000 Tape and reel Revision history Date Revision Description of Changes Jul-2003 7B Feb-2005 8 Layout update. No content change. 08-Feb-2007 9 Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. Last update. STPS340 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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