STPS140-Y Automotive power Schottky rectifier Features ■ Very small conduction losses ■ Negligible switching losses ■ Low forward voltage drop ■ Surface mount miniature packages ■ Avalanche capability specified ■ AEC-Q101 qualified ■ ECOPACK®2 compliant component SMA (JEDEC DO-214AC) STPS140AY Table 1. Description Single chip Schottky rectifiers suited to Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMA and SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection for automotive applications. December 2010 Doc ID 17973 Rev 1 SMB (JEDEC DO-214AA) STPS140UY Device summary Symbol Value IF(AV) 1A VRRM 40 V Tj (max) 150 °C VF (max) 0.5 V 1/9 www.st.com 9 Characteristics 1 STPS140-Y Characteristics Table 2. Absolute Ratings (limiting values) Symbol Value Unit VRRM Repetitive peak reverse voltage 40 V IF(RMS) Forward rms voltage 7 A TL = 130 °C δ = 0.5 SMA A IF(AV) Average forward current IFSM Surge non repetitive forward current tp =10 ms sinusoidal 60 A IRRM Repetitive peak reverse current tp = 2 µs F = 1 kHz square 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 1 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 900 W - 65 to + 150 °C - 40 to + 150 °C 10000 V/µs Value Unit Tstg 1. Parameter 1 TL = 135 °C δ = 0.5 SMB A Storage temperature range Tj Operating junction temperature range dV/dt Critical rate of rise of reverse voltage (1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Table 4. Parameter 30 SMB 25 °C/W Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current Test Conditions Tj = 25 °C Tj = 100 °C Tj = 25 °C VF(2) SMA Junction to lead Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM Min. Typ. 0.25 Max. Unit 12 µA 2 mA 0.55 IF = 1 A 0.43 0.5 V 0.65 IF = 2 A 0.53 0.6 1. Pulse test: tp = 380 µs, δ < 2% 2. Pulse test: tp = 5 ms, δ < 2% To evaluate the conduction losses use the following equation: P = 0.4 x IF(AV) + 0.10 IF2(RMS) 2/9 Doc ID 17973 Rev 1 STPS140-Y Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 1.2 0.7 δ = 0.05 0.6 δ = 0.1 δ = 0.2 Rth(j-a)=Rth(j-I) δ = 0.5 1.0 0.5 0.4 SMA Rth(j-a)=100°C/W S(CU)=1.5cm2 0.8 δ=1 0.6 SMB Rth(j-a)=80°C/W S(CU)=1.5cm2 0.3 0.4 0.2 T T 0.2 0.1 IF(AV)(A) δ=tp/T tp 0.0 δ=tp/T 0.0 0.0 0.2 Figure 3. 0.4 0.6 0.8 1.0 1.2 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) Tamb(°C) tp 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25°C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) (SMA) 50 Figure 6. IM(A) 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) IM(A) 8 8 7 7 6 6 5 Ta=25°C 4 Ta=25°C 5 4 Ta=50°C Ta=50°C 3 2 Ta=100°C IM 1 Ta=100°C 2 IM 1 t t(s) δ=0.5 3 0 t t(s) δ=0.5 0 1E-3 1E-2 1E-1 1E+0 1E-3 Doc ID 17973 Rev 1 1E-2 1E-1 1E+0 3/9 Characteristics Figure 7. STPS140-Y Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Figure 8. Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 Epoxy printed circuit board, copper thickness: 35 µm reccomended pad layout 0.9 Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Epoxy printed circuit board, copper thickness: 35 µm reccomended pad layout 0.9 0.8 0.8 0.7 0.7 0.6 0.6 δ = 0.5 0.5 δ = 0.5 0.5 0.4 0.4 0.3 δ = 0.2 0.2 δ = 0.1 0.1 Single pulse T δ=tp/T tp(s) 0.0 1E-2 1E-1 Figure 9. 1E+0 tp 0.3 δ = 0.2 0.2 δ = 0.1 0.1 Single pulse T δ=tp/T tp(s) 0.0 1E+1 1E+2 Reverse leakage current versus reverse voltage applied (typical values) 1E-2 1E-1 1E+0 1E+1 tp 1E+3 1E+2 Figure 10. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1E+3 200 Tj=125°C F=1MHz Tj=25°C 1E+2 100 Tj=75°C 1E+1 50 1E+0 Tj=25°C 20 1E-1 VR(V) VR(V) 10 1E-2 0 5 10 15 20 25 30 35 1 40 Figure 11. Forward voltage drop versus forward current (maximum values) 2 5 10 20 50 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Rth(j-a)(°C/W) IFM(A) 140 1E+1 Epoxy printed circuit board FR4, copper thickness: 35 µm reccomended pad layout Tj=125°C 120 100 P=1.5W 1E+0 80 60 1E-1 40 20 S(Cu)(cm²) VFM(V) 0 1E-2 0.0 4/9 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 Doc ID 17973 Rev 1 1 2 3 4 5 STPS140-Y Characteristics Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMB) Rth(j-a)(°C/W) 120 P=1.5W 100 80 60 40 20 S(Cu)(cm²) 0 0 1 2 3 Doc ID 17973 Rev 1 4 5 5/9 Package information 2 STPS140-Y Package information ● Band indicates cathode ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 14. SMA package mechanical data Dimensions Ref Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.03 0.075 0.080 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 E A1 A2 C L b Figure 15. SMA footprint dimensions (in millimeters) 1.65 1.45 6/9 2.40 Doc ID 17973 Rev 1 1.45 STPS140-Y Package information Figure 16. SMB package mechanical data Dimensions Ref Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 E A1 A2 C L b Figure 17. SMB footprint dimensions (in millimeters) 2.3 1.52 2.75 Doc ID 17973 Rev 1 1.52 7/9 Ordering information 3 Ordering information Table 5. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS140A S140Y SMA 0.068 g 5000 Tape and reel STPS140U G14Y SMB 0.107 g 2500 Tape and reel Revision history Table 6. 8/9 STPS140-Y Document revision history Date Revision 10-Dec-2010 1 Changes First issue. Doc ID 17973 Rev 1 STPS140-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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